| Patent | Date |
|---|
Method to achieve increased trench depth, independent of CD as defined by lithography
Grant 7,144,769 - Chan , et al. December 5, 2 | 2006-12-05 |
Novel method to achieve increased trench depth, independent of CD as defined by lithography
App 20050009295 - Chan, Kevin K. ; et al. | 2005-01-13 |
Optical measurement of planarized features
Grant 6,842,235 - Zaidi , et al. January 11, 2 | 2005-01-11 |
Method to achieve increased trench depth, independent of CD as defined by lithography
Grant 6,821,864 - Chan , et al. November 23, 2 | 2004-11-23 |
Method to fill deep trench structures with void-free polysilicon or silicon
Grant 6,809,005 - Ranade , et al. October 26, 2 | 2004-10-26 |
Method To Fill Deep Trench Structures With Void-free Polysilicon Or Silicon
App 20040180510 - Ranade, Rajiv ; et al. | 2004-09-16 |
Method of etching high aspect ratio openings
Grant 6,743,727 - Mathad , et al. June 1, 2 | 2004-06-01 |
Method to increase the etch rate and depth in high aspect ratio structure
Grant 6,709,917 - Panda , et al. March 23, 2 | 2004-03-23 |
Method for monitoring the rate of etching of a semiconductor
Grant 6,687,014 - Zaidi , et al. February 3, 2 | 2004-02-03 |
Novel method to achieve increased trench depth, independent of CD as defined by lithography
App 20030170951 - Chan, Kevin K. ; et al. | 2003-09-11 |
Method for monitoring the rate of etching of a semiconductor
App 20030133127 - Zaidi, Shoaib Hasan ; et al. | 2003-07-17 |
Method of deep trench formation with improved profile control and surface area
Grant 6,544,838 - Ranade , et al. April 8, 2 | 2003-04-08 |
Optical measurement of planarized features
App 20030063272 - Zaidi, Syed Shoaib Hasan ; et al. | 2003-04-03 |
Method of etching high aspect ratio openings
App 20020179570 - Mathad, Gangadhara S. ; et al. | 2002-12-05 |
Method of deep trench formation with improved profile control and surface area
App 20020132422 - Ranade, Rajiv ; et al. | 2002-09-19 |
Method of reducing RIE lag for deep trench silicon etching
Grant 6,284,666 - Naeem , et al. September 4, 2 | 2001-09-04 |
Formation of self-aligned metal gate FETs using a benignant removable gate material during high temperature steps
Grant 5,391,510 - Hsu , et al. February 21, 1 | 1995-02-21 |
Process of forming a dual overhang collimated lift-off stencil with subsequent metal deposition
Grant 5,258,264 - Mathad , et al. November 2, 1 | 1993-11-02 |
Collimated metal deposition
Grant 5,024,896 - Mathad , et al. June 18, 1 | 1991-06-18 |
Anisotropic silicon etching in fluorinated plasma
Grant 4,741,799 - Chen , et al. May 3, 1 | 1988-05-03 |
Method for control of etch profile
Grant 4,671,849 - Chen , et al. June 9, 1 | 1987-06-09 |
Method of fabricating a chip interposer
Grant 4,617,730 - Geldermans , et al. October 21, 1 | 1986-10-21 |
Monitoring technique for plasma etching
Grant 4,602,981 - Chen , et al. July 29, 1 | 1986-07-29 |
Single wafer plasma etch reactor
Grant 4,534,816 - Chen , et al. August 13, 1 | 1985-08-13 |
Laser induced chemical etching of metals with excimer lasers
Grant 4,490,211 - Chen , et al. December 25, 1 | 1984-12-25 |
Laser induced dry chemical etching of metals
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Laser induced dry etching of vias in glass with non-contact masking
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