Matagawa; Satoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Matagawa; Satoshi.The latest application filed is for "wafer manufacturing method and wafer".
- Matagawa; Satoshi - Tokyo JP
| Patent | Date |
|---|---|
| Method of lapping semiconductor wafer and semiconductor wafer Grant 11,456,168 - Hashimoto , et al. September 27, 2 | 2022-09-27 |
| Wafer Manufacturing Method And Wafer App 20190252180 - TANAKA; Toshiyuki ; et al. | 2019-08-15 |
| Method Of Lapping Semiconductor Wafer And Semiconductor Wafer App 20190181001 - HASHIMOTO; Daisuke ; et al. | 2019-06-13 |
| Method of manufacturing semiconductor wafer Grant 8,283,252 - Taniguchi , et al. October 9, 2 | 2012-10-09 |
| Method of manufacturing semiconductor wafer App 20100009605 - Taniguchi; Toru ; et al. | 2010-01-14 |
| Method of manufacturing semiconductor wafer Grant 7,589,023 - Taniguchi , et al. September 15, 2 | 2009-09-15 |
| Slurry For Wire Saw App 20090211167 - MATAGAWA; Satoshi ; et al. | 2009-08-27 |
| Method of manufacturing semiconductor wafer App 20030104698 - Taniguchi, Toru ; et al. | 2003-06-05 |
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