Masuyama; Takumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Masuyama; Takumi.The latest application filed is for "optical module".
- Masuyama; Takumi - Kawasaki JP
| Patent | Date |
|---|---|
| Optical module Grant 10,586,770 - Matsumura , et al. | 2020-03-10 |
| Optical module Grant 10,444,450 - Matsumura , et al. Oc | 2019-10-15 |
| Optical Module App 20190157207 - Matsumura; Takayoshi ; et al. | 2019-05-23 |
| Optical Module App 20180341075 - Matsumura; Takayoshi ; et al. | 2018-11-29 |
| Optical Module App 20180217343 - Matsumura; Takayoshi ; et al. | 2018-08-02 |
| Semiconductor mounting apparatus, head thereof, and method for manufacturing laminated chip Grant 9,905,528 - Kira , et al. February 27, 2 | 2018-02-27 |
| Semiconductor device mounting method Grant 9,793,221 - Kira , et al. October 17, 2 | 2017-10-17 |
| Semiconductor Mounting Apparatus, Head Thereof, And Method For Manufacturing Laminated Chip App 20170186721 - Kira; Hidehiko ; et al. | 2017-06-29 |
| Heating header of semiconductor mounting apparatus and bonding method for semiconductor Grant 9,536,857 - Kira , et al. January 3, 2 | 2017-01-03 |
| Semiconductor Device Mounting Method App 20160284566 - Kira; Hidehiko ; et al. | 2016-09-29 |
| Method of determining reinforcement position of circuit substrate and substrate assembly Grant 9,053,262 - Kobayashi , et al. June 9, 2 | 2015-06-09 |
| Circuit Board Device And Electronic Device App 20140078700 - MASUYAMA; Takumi ; et al. | 2014-03-20 |
| Heat Transfer Cap And Repairing Apparatus And Method App 20130322057 - OKADA; Toru ; et al. | 2013-12-05 |
| Wiring Board And Method For Manufacturing Wiring Board App 20130256022 - KOBAYASHI; Hiroshi ; et al. | 2013-10-03 |
| Method Of Determining Reinforcement Position Of Circuit Substrate And Substrate Assembly App 20130128477 - KOBAYASHI; Hiroshi ; et al. | 2013-05-23 |
| Solder Joint Structure, Electronic Device Using The Same, And Solder Bonding Method App 20100326726 - Tanaka; Hisao ; et al. | 2010-12-30 |
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