| Patent | Date |
|---|
Fan-out electronic device
Grant 11,410,875 - Nguyen , et al. August 9, 2 | 2022-08-09 |
Semiconductor Device Having Tapered Metal Coated Sidewalls
App 20220208689 - NOGUCHI; Tomoko ; et al. | 2022-06-30 |
Embedded Die Packaging With Integrated Ceramic Substrate
App 20220108955 - Kim; Woochan ; et al. | 2022-04-07 |
Embedded die packaging with integrated ceramic substrate
Grant 11,183,460 - Kim , et al. November 23, 2 | 2021-11-23 |
Stress buffer layer in embedded package
Grant 11,183,441 - Kim , et al. November 23, 2 | 2021-11-23 |
Embedded die package multichip module
Grant 11,158,595 - Kim , et al. October 26, 2 | 2021-10-26 |
Frame Design In Embedded Die Package
App 20210134729 - Kim; Woochan ; et al. | 2021-05-06 |
Metal-covered Chip Scale Packages
App 20210125959 - MATSUURA; Masamitsu ; et al. | 2021-04-29 |
Stress Buffer Layer in Embedded Package
App 20200203249 - Kim; Woochan ; et al. | 2020-06-25 |
Fan-out Electronic Device
App 20200203219 - Nguyen; Hau Thanh ; et al. | 2020-06-25 |
Embedded Die Packaging With Integrated Ceramic Substrate
App 20200091076 - Kim; Woochan ; et al. | 2020-03-19 |
Stress buffer layer in embedded package
Grant 10,580,715 - Kim , et al. | 2020-03-03 |
Stress Buffer Layer in Embedded Package
App 20190385924 - Kim; Woochan ; et al. | 2019-12-19 |
Embedded Die Package Multichip Module
App 20190013288 - KIM; WOOCHAN ; et al. | 2019-01-10 |
Dual Sided Embedded Die And Fabrication Of Same Background
App 20160240392 - Poddar; Anindya ; et al. | 2016-08-18 |
Structure and Method of Batch-Packaging Low Pin Count Embedded Semiconductor Chips
App 20160005705 - Masumoto; Mutsumi | 2016-01-07 |
Dual Sided Embedded Die And Fabrication Of Same Background
App 20150147845 - Poddar; Anindya ; et al. | 2015-05-28 |
Method And Structure Of Panelized Packaging Of Semiconductor Devices
App 20150008566 - Gerber; Mark A. ; et al. | 2015-01-08 |
Thin Semiconductor Chip Mounting
App 20140069989 - Masumoto; Mutsumi | 2014-03-13 |
Bonding a solder bump to a lead using compression and retraction forces
Grant 8,381,967 - Masumoto , et al. February 26, 2 | 2013-02-26 |
Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
Grant 8,298,947 - Masumoto October 30, 2 | 2012-10-30 |
Copper pillar bonding for fine pitch flip chip devices
Grant 8,115,310 - Masumoto , et al. February 14, 2 | 2012-02-14 |
Conductive pattern formation method
Grant 7,947,602 - Ito , et al. May 24, 2 | 2011-05-24 |
Semiconductor Device Having Solder-Free Gold Bump Contacts for Stability in Repeated Temperature Cycles
App 20110045641 - MASUMOTO; Mutsumi | 2011-02-24 |
Copper Pillar Bonding For Fine Pitch Flip Chip Devices
App 20100314745 - Masumoto; Kenji ; et al. | 2010-12-16 |
Semiconductor device singulation method
Grant 7,851,264 - Masumoto December 14, 2 | 2010-12-14 |
Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
Grant 7,847,399 - Masumoto December 7, 2 | 2010-12-07 |
Method for Mounting Flip Chip and Substrate Used Therein
App 20100269333 - MASUMOTO; Mutsumi ; et al. | 2010-10-28 |
Semiconductor Manufacturing Method
App 20100255641 - NAKANISHI; Noboru ; et al. | 2010-10-07 |
Structure and Method for Thin Single or Multichip Semiconductor QFN Packages
App 20100237511 - MASUMOTO; Mutsumi | 2010-09-23 |
Method for thin semiconductor packages
Grant 7,754,528 - Masumoto July 13, 2 | 2010-07-13 |
Electronic Part Manufacturing Method
App 20100090334 - MASUMOTO; Mutsumi | 2010-04-15 |
Assembling of Electronic Members on IC Chip
App 20100032802 - Togawa; Shinichi ; et al. | 2010-02-11 |
Mounting system
Grant 7,621,969 - Masumoto , et al. November 24, 2 | 2009-11-24 |
Semiconductor Device Singulation Method
App 20090197373 - Masumoto; Mutsumi | 2009-08-06 |
Semiconductor Device Having Solder-free Gold Bump Contacts For Stability In Repeated Temperature Cycles
App 20090146298 - Masumoto; Mutsumi | 2009-06-11 |
Method for manufacturing a semiconductor device
Grant 7,521,291 - Masumoto April 21, 2 | 2009-04-21 |
Structure And Method For Thin Single Or Multichip Semiconductor Qfn Packages
App 20090087946 - Masumoto; Mutsumi | 2009-04-02 |
Method For Manufacturing Semiconductor Device
App 20090017582 - MASUMOTO; MUTSUMI | 2009-01-15 |
Packaging system
App 20090011538 - Masumoto; Mutsumi ; et al. | 2009-01-08 |
Flip-chip semiconductor device manufacturing method
Grant 7,459,339 - Masumoto December 2, 2 | 2008-12-02 |
Conductive Pattern Formation Method
App 20080199988 - Ito; Chizuko ; et al. | 2008-08-21 |
Structure and method for thin single or multichip semiconductor QFN packages
App 20070132075 - Masumoto; Mutsumi | 2007-06-14 |
Semiconductor Device with Improved Stud Bump
App 20070117265 - Masumoto; Mutsumi | 2007-05-24 |
Flip-Chip Semiconductor Device Manufacturing Method
App 20070117264 - Masumoto; Mutsumi | 2007-05-24 |
Method for Manufacturing a Semiconductor Device
App 20070092991 - Masumoto; Mutsumi | 2007-04-26 |
Electronic Part Manufacturing Method
App 20070090160 - Masumoto; Mutsumi | 2007-04-26 |
Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion
Grant 7,157,363 - Suzuki , et al. January 2, 2 | 2007-01-02 |
Semiconductor package, semiconductor device and electronic device
Grant 7,023,088 - Suzuki , et al. April 4, 2 | 2006-04-04 |
Semiconductor package production method and semiconductor package
Grant 6,969,919 - Yajima , et al. November 29, 2 | 2005-11-29 |
Semiconductor device and its manufacturing method
Grant 6,929,971 - Murata , et al. August 16, 2 | 2005-08-16 |
Semiconductor device and manufacturing method
Grant 6,887,778 - Watanabe , et al. May 3, 2 | 2005-05-03 |
Semiconductor device and its manufacturing method
Grant 6,876,077 - Murata , et al. April 5, 2 | 2005-04-05 |
Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package
App 20050037539 - Suzuki, Takanao ; et al. | 2005-02-17 |
Semiconductor package production method and semiconductor package
App 20050003577 - Yajima, Kiyoshi ; et al. | 2005-01-06 |
Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package
Grant 6,835,595 - Suzuki , et al. December 28, 2 | 2004-12-28 |
Method for packaging a low profile semiconductor device
Grant 6,830,956 - Masumoto , et al. December 14, 2 | 2004-12-14 |
Thinning of semiconductor wafers
App 20040214432 - Masumoto, Mutsumi | 2004-10-28 |
Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges
Grant 6,780,749 - Masumoto , et al. August 24, 2 | 2004-08-24 |
Semiconductor package with a thermoset bond
Grant 6,774,496 - Yajima , et al. August 10, 2 | 2004-08-10 |
Semiconductor device and manufacturing method thereof
Grant 6,759,745 - Masumoto , et al. July 6, 2 | 2004-07-06 |
Back side coating of semiconductor wafers
Grant 6,734,532 - Koduri , et al. May 11, 2 | 2004-05-11 |
Method of forming a semiconductor package
Grant 6,716,674 - Yajima , et al. April 6, 2 | 2004-04-06 |
Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package
App 20030207494 - Suzuki, Takanao ; et al. | 2003-11-06 |
Semiconductor device and its manufacturing method
App 20030205725 - Masumoto, Kenji ; et al. | 2003-11-06 |
Semiconductor device and its manufacturing method
App 20030155652 - Murata, Kensho ; et al. | 2003-08-21 |
Semiconductor package production method and semiconductor package
App 20030153121 - Yajima, Kiyoshi ; et al. | 2003-08-14 |
Back side coating of semiconductor wafers
App 20030109082 - Koduri, Sreenivasan K. ; et al. | 2003-06-12 |
Semiconductor device and its manufacturing method
App 20030107054 - Murata, Kensho ; et al. | 2003-06-12 |
Semiconductor device and manufacturing method
App 20030068847 - Watanabe, Masako ; et al. | 2003-04-10 |
Semiconductor device and manufacturing method thereof
App 20030062613 - Masumoto, Kenji ; et al. | 2003-04-03 |
Semiconductor package production method and semiconductor package
App 20030049883 - Yajima, Kiyoshi ; et al. | 2003-03-13 |
Semiconductor device manufacturing method
App 20030036219 - Masumoto, Mutsumi ; et al. | 2003-02-20 |
Semiconductor device manufacturing method
App 20030036257 - Masumoto, Mutsumi ; et al. | 2003-02-20 |
Method for manufacturing a semiconductor device
Grant 6,482,730 - Masumoto , et al. November 19, 2 | 2002-11-19 |
Semiconductor device and its manufacturing method
App 20020145198 - Murata, Kensho ; et al. | 2002-10-10 |
Semiconductor devcice and its manufacturing method
App 20020050653 - Masumoto, Kenji ; et al. | 2002-05-02 |
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