loadpatents
name:-0.023013114929199
name:-0.013084173202515
name:-0.0027780532836914
Masuko; Shingo Patent Filings

Masuko; Shingo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Masuko; Shingo.The latest application filed is for "semiconductor device and dicing method".

Company Profile
2.14.24
  • Masuko; Shingo - Kanazawa Ishikawa JP
  • Masuko; Shingo - Ishikawa JP
  • MASUKO; Shingo - Kanazawa JP
  • Masuko; Shingo - Ishikawa Kanazawa JP
  • Masuko; Shingo - Kanazawa-Shi JP
  • Masuko; Shingo - Kanagawa JP
  • Masuko; Shingo - Kanagawa-ken JP
  • Masuko; Shingo - Tokyo JP
  • Masuko; Shingo - Kawasaki JP
  • Masuko; Shingo - Suzaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and dicing method
Grant 10,784,165 - Masuko , et al. Sept
2020-09-22
Semiconductor Device And Dicing Method
App 20190267288 - Masuko; Shingo ;   et al.
2019-08-29
Semiconductor device manufacturing method
Grant 9,966,311 - Masuko May 8, 2
2018-05-08
Semiconductor device and manufacturing method thereof
Grant 9,953,894 - Masuko , et al. April 24, 2
2018-04-24
Semiconductor Device And Manufacturing Method Thereof
App 20180082918 - MASUKO; Shingo ;   et al.
2018-03-22
Semiconductor Device Manufacturing Method
App 20170069535 - Masuko; Shingo
2017-03-09
Manufacturing method of semiconductor device
Grant 9,472,467 - Masuko October 18, 2
2016-10-18
Semiconductor device
Grant 9,412,825 - Yasumoto , et al. August 9, 2
2016-08-09
Semiconductor Device And Method Of Manufacturing The Semiconductor Device
App 20160218067 - MASUKO; Shingo ;   et al.
2016-07-28
Semiconductor Device And Manufacturing Method Thereof
App 20160211225 - MASUKO; Shingo ;   et al.
2016-07-21
Semiconductor Device And Method Of Manufacturing The Same
App 20160079120 - MASUKO; Shingo ;   et al.
2016-03-17
Manufacturing Method Of Semiconductor Device
App 20160079123 - MASUKO; Shingo
2016-03-17
Semiconductor Device And Method Of Manufacturing Same
App 20150263101 - Masuko; Shingo ;   et al.
2015-09-17
Power Supply Circuit
App 20150263630 - Naka; Toshiyuki ;   et al.
2015-09-17
Semiconductor Device
App 20150263152 - YASUMOTO; Takaaki ;   et al.
2015-09-17
Semiconductor Device
App 20150263700 - YASUMOTO; Takaaki ;   et al.
2015-09-17
HEMT semiconductor device
Grant 9,054,171 - Ohno , et al. June 9, 2
2015-06-09
Semiconductor Device
App 20150076506 - Yasumoto; Takaaki ;   et al.
2015-03-19
Semiconductor Device
App 20150069468 - Ohno; Tetsuya ;   et al.
2015-03-12
Semiconductor device and method for manufacturing semiconductor device
Grant 8,916,881 - Yanase , et al. December 23, 2
2014-12-23
Semiconductor Device And Strain Monitor
App 20140283618 - Yasumoto; Takaaki ;   et al.
2014-09-25
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20140014971 - YANASE; Naoko ;   et al.
2014-01-16
Semiconductor device and method for manufacturing semiconductor device
Grant 8,558,244 - Yanase , et al. October 15, 2
2013-10-15
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20110193101 - YANASE; Naoko ;   et al.
2011-08-11
Piezoelectric Device
App 20090302716 - OHARA; Ryoichi ;   et al.
2009-12-10
Surface acoustic wave device, package for the device, and method of fabricating the device
Grant 7,528,522 - Masuko , et al. May 5, 2
2009-05-05
Package for electronic device, base substrate, electronic device and fabrication method thereof
Grant 7,304,417 - Masuko , et al. December 4, 2
2007-12-04
Electronic Device
App 20070247260 - YANASE; Naoko ;   et al.
2007-10-25
Surface acoustic wave device, package for the device, and method of fabricating the device
Grant 7,215,065 - Masuko , et al. May 8, 2
2007-05-08
Method of packaging electronic parts
Grant 7,200,924 - Masuko April 10, 2
2007-04-10
Surface acoustic wave device, package for the device, and method of fabricating the device
Grant 7,180,228 - Masuko , et al. February 20, 2
2007-02-20
Electronic device
App 20050104192 - Masuko, Shingo ;   et al.
2005-05-19
Surface acoustic wave device, package for the device, and method of fabricating the device
App 20050099098 - Masuko, Shingo ;   et al.
2005-05-12
Surface acoustic wave device, package for the device, and method of fabricating the device
App 20050006987 - Masuko, Shingo ;   et al.
2005-01-13
Surface acoustic wave device, package for the device, and method of fabricating the device
App 20040251790 - Masuko, Shingo ;   et al.
2004-12-16
Package for electronic device, base substrate, electronic device and fabrication method thereof
App 20040226741 - Masuko, Shingo ;   et al.
2004-11-18
Method of fabricating electronic parts packaged with resin and baseboard used for the method
App 20040160750 - Masuko, Shingo
2004-08-19

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed