loadpatents
Patent applications and USPTO patent grants for Masuko; Shingo.The latest application filed is for "semiconductor device and dicing method".
Patent | Date |
---|---|
Semiconductor device and dicing method Grant 10,784,165 - Masuko , et al. Sept | 2020-09-22 |
Semiconductor Device And Dicing Method App 20190267288 - Masuko; Shingo ;   et al. | 2019-08-29 |
Semiconductor device manufacturing method Grant 9,966,311 - Masuko May 8, 2 | 2018-05-08 |
Semiconductor device and manufacturing method thereof Grant 9,953,894 - Masuko , et al. April 24, 2 | 2018-04-24 |
Semiconductor Device And Manufacturing Method Thereof App 20180082918 - MASUKO; Shingo ;   et al. | 2018-03-22 |
Semiconductor Device Manufacturing Method App 20170069535 - Masuko; Shingo | 2017-03-09 |
Manufacturing method of semiconductor device Grant 9,472,467 - Masuko October 18, 2 | 2016-10-18 |
Semiconductor device Grant 9,412,825 - Yasumoto , et al. August 9, 2 | 2016-08-09 |
Semiconductor Device And Method Of Manufacturing The Semiconductor Device App 20160218067 - MASUKO; Shingo ;   et al. | 2016-07-28 |
Semiconductor Device And Manufacturing Method Thereof App 20160211225 - MASUKO; Shingo ;   et al. | 2016-07-21 |
Semiconductor Device And Method Of Manufacturing The Same App 20160079120 - MASUKO; Shingo ;   et al. | 2016-03-17 |
Manufacturing Method Of Semiconductor Device App 20160079123 - MASUKO; Shingo | 2016-03-17 |
Semiconductor Device And Method Of Manufacturing Same App 20150263101 - Masuko; Shingo ;   et al. | 2015-09-17 |
Power Supply Circuit App 20150263630 - Naka; Toshiyuki ;   et al. | 2015-09-17 |
Semiconductor Device App 20150263152 - YASUMOTO; Takaaki ;   et al. | 2015-09-17 |
Semiconductor Device App 20150263700 - YASUMOTO; Takaaki ;   et al. | 2015-09-17 |
HEMT semiconductor device Grant 9,054,171 - Ohno , et al. June 9, 2 | 2015-06-09 |
Semiconductor Device App 20150076506 - Yasumoto; Takaaki ;   et al. | 2015-03-19 |
Semiconductor Device App 20150069468 - Ohno; Tetsuya ;   et al. | 2015-03-12 |
Semiconductor device and method for manufacturing semiconductor device Grant 8,916,881 - Yanase , et al. December 23, 2 | 2014-12-23 |
Semiconductor Device And Strain Monitor App 20140283618 - Yasumoto; Takaaki ;   et al. | 2014-09-25 |
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20140014971 - YANASE; Naoko ;   et al. | 2014-01-16 |
Semiconductor device and method for manufacturing semiconductor device Grant 8,558,244 - Yanase , et al. October 15, 2 | 2013-10-15 |
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20110193101 - YANASE; Naoko ;   et al. | 2011-08-11 |
Piezoelectric Device App 20090302716 - OHARA; Ryoichi ;   et al. | 2009-12-10 |
Surface acoustic wave device, package for the device, and method of fabricating the device Grant 7,528,522 - Masuko , et al. May 5, 2 | 2009-05-05 |
Package for electronic device, base substrate, electronic device and fabrication method thereof Grant 7,304,417 - Masuko , et al. December 4, 2 | 2007-12-04 |
Electronic Device App 20070247260 - YANASE; Naoko ;   et al. | 2007-10-25 |
Surface acoustic wave device, package for the device, and method of fabricating the device Grant 7,215,065 - Masuko , et al. May 8, 2 | 2007-05-08 |
Method of packaging electronic parts Grant 7,200,924 - Masuko April 10, 2 | 2007-04-10 |
Surface acoustic wave device, package for the device, and method of fabricating the device Grant 7,180,228 - Masuko , et al. February 20, 2 | 2007-02-20 |
Electronic device App 20050104192 - Masuko, Shingo ;   et al. | 2005-05-19 |
Surface acoustic wave device, package for the device, and method of fabricating the device App 20050099098 - Masuko, Shingo ;   et al. | 2005-05-12 |
Surface acoustic wave device, package for the device, and method of fabricating the device App 20050006987 - Masuko, Shingo ;   et al. | 2005-01-13 |
Surface acoustic wave device, package for the device, and method of fabricating the device App 20040251790 - Masuko, Shingo ;   et al. | 2004-12-16 |
Package for electronic device, base substrate, electronic device and fabrication method thereof App 20040226741 - Masuko, Shingo ;   et al. | 2004-11-18 |
Method of fabricating electronic parts packaged with resin and baseboard used for the method App 20040160750 - Masuko, Shingo | 2004-08-19 |
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