Masuko; Daisuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Masuko; Daisuke.The latest application filed is for "resin composition, adhesive tape, and method for producing adhesive tape".

Company Profile

1.7.8

Masuko; Daisuke - Tokyo JP
Masuko; Daisuke - Tochigi N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition, adhesive tape, and method for producing adhesive tape Grant 9,926,475 - Masuko , et al. March 27, 2	2018-03-27
Resin Composition, Adhesive Tape, and Method for Producing Adhesive Tape App 20150376470 - MASUKO; Daisuke ; et al.	2015-12-31
Method for producing an anisotropic conductive film Grant 9,155,207 - Ito , et al. October 6, 2	2015-10-06
Anisotropic Conductive Film, Method for Producing the Same, and Joined Structure Using the Same App 20120328794 - ITO; Masahiko ; et al.	2012-12-27
Latent curing agent for epoxy resin and method for manufacturing the same Grant 8,211,330 - Masuko , et al. July 3, 2	2012-07-03
Latent curing agent Grant 8,147,720 - Komuro , et al. April 3, 2	2012-04-03
Latent curing agent for epoxy resin and method for manufacturing the same Grant 8,128,837 - Masuko , et al. March 6, 2	2012-03-06
Anisotropic Conductive Film, Method For Producing The Same, And Joined Structure Using The Same App 20100188829 - Ito; Masahiko ; et al.	2010-07-29
Latent Curing Agent App 20090230360 - Komuro; Katsuhiko ; et al.	2009-09-17
Latent curing agent Grant 7,557,230 - Komuro , et al. July 7, 2	2009-07-07
Latent Curing Agent App 20090152504 - Komuro; Katsuhiko ; et al.	2009-06-18
Latent curing agent for epoxy resin and method for manufacturing the same App 20080249257 - Masuko; Daisuke ; et al.	2008-10-09
Latent curing agent for epoxy resin and method for manufacturing the same App 20080249258 - Masuko; Daisuke ; et al.	2008-10-09
Latent Curing Agent App 20080161589 - Komuro; Katsuhiko ; et al.	2008-07-03

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