Masui; Ryohei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Masui; Ryohei.The latest application filed is for "conductive particles, method for producing conductive particles, conductive material and connection structure".

Company Profile

0.6.4

Masui; Ryohei - Osaka JP
Masui; Ryohei - Mishima-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive particles, method for producing conductive particles, conductive material and connection structure Grant 9,446,484 - Masui , et al. September 20, 2	2016-09-20
Conductive Particles, Method For Producing Conductive Particles, Conductive Material And Connection Structure App 20150008022 - Masui; Ryohei ; et al.	2015-01-08
Adhesive for electronic components Grant 8,901,207 - Hayakawa , et al. December 2, 2	2014-12-02
Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles Grant 8,563,362 - Hayakawa , et al. October 22, 2	2013-10-22
Method Fo Producing Semiconductor Chip Stack, And Semiconductor Device App 20120021233 - Hayakawa; Akinobu ; et al.	2012-01-26
Adhesive For Electronic Components App 20120016057 - Hayakawa; Akinobu ; et al.	2012-01-19
Adhesive for electronic component Grant 7,838,577 - Hayakawa , et al. November 23, 2	2010-11-23
Adhesive For Electronic Component App 20100197830 - Hayakawa; Akinobu ; et al.	2010-08-05

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