Masuda; Tsugio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Masuda; Tsugio.The latest application filed is for "ultrasonic welding device and ultrasonic welding method".
- Masuda; Tsugio - Tochigi JP
- Masuda; Tsugio - Sayama JP
- Masuda, Tsugio - Sayama-shi JP
| Patent | Date |
|---|---|
| Ultrasonic Welding Device And Ultrasonic Welding Method App 20190131752 - Kunigami; Masaki ; et al. | 2019-05-02 |
| Electronic Circuit Board And Ultrasonic Bonding Method App 20190098766 - Fueki; Nobuhiro ; et al. | 2019-03-28 |
| Electronic Circuit Board And Ultrasonic Bonding Method App 20190084077 - Masuda; Tsugio ; et al. | 2019-03-21 |
| Ultrasonic Welding Device And Ultrasonic Welding Method App 20190084078 - Kunigami; Masaki ; et al. | 2019-03-21 |
| Semiconductor device having thermal endurance and method of manufacturing the same Grant 8,415,801 - Ogura , et al. April 9, 2 | 2013-04-09 |
| Semiconductor Device And Method Of Manufacturing The Same App 20100308465 - Ogura; Masami ; et al. | 2010-12-09 |
| Joining agent for metal or ceramic, and method for joining metal articles or ceramic articles using the same Grant 6,923,363 - Masuda August 2, 2 | 2005-08-02 |
| Joining agent for metal or ceramic, and method for joining metal articles or ceramic articles using the same App 20040195294 - Masuda, Tsugio | 2004-10-07 |
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