MASUDA; Takatoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for MASUDA; Takatoshi.The latest application filed is for "semiconductor module and manufacturing method therefor".
- MASUDA; Takatoshi - Tokyo JP
- Masuda; Takatoshi - Chiyoda-ku JP
- Masuda; Takatoshi - Ota-ku JP
| Patent | Date |
|---|---|
| Semiconductor Module And Manufacturing Method Therefor App 20220223531 - MASUDA; Takatoshi ; et al. | 2022-07-14 |
| Stator for rotating electric machine, and rotating electric machine Grant 11,095,173 - Kawamura , et al. August 17, 2 | 2021-08-17 |
| Stator for rotary electric machine, rotary electric machine, and method for manufacturing stator for rotary electric machine Grant 10,886,823 - Kawamura , et al. January 5, 2 | 2021-01-05 |
| Stator for rotary electric machine Grant 10,756,588 - Kawamura , et al. A | 2020-08-25 |
| Segment-core Coupled Body And Method Of Manufacturing Armature App 20200251968 - Kind Code | 2020-08-06 |
| Stator For Rotary Electric Machine App 20190260251 - KAWAMURA; Koji ; et al. | 2019-08-22 |
| Stator For Rotary Electric Machine, Rotary Electric Machine, And Method For Manufacturing Stator For Rotary Electric Machine App 20190097502 - KAWAMURA; Koji ; et al. | 2019-03-28 |
| Stator For Rotating Electric Machine, And Rotating Electric Machine App 20190036390 - Kawamura; Koji ; et al. | 2019-01-31 |
| Coil Forming Device And Coil Forming Method App 20180331605 - MOTOISHI; Naohiro ; et al. | 2018-11-15 |
| Armature And Rotating Electric Machine App 20180006512 - TSUIKI; Hironori ; et al. | 2018-01-04 |
| Dividing method for wafer Grant 9,159,622 - Matsuzaki , et al. October 13, 2 | 2015-10-13 |
| Dividing Method For Wafer App 20150044857 - Matsuzaki; Sakae ; et al. | 2015-02-12 |
| Vacuum Processing Apparatus App 20140209240 - Matsuzaki; Sakae ; et al. | 2014-07-31 |
| Stator of vehicle AC generator and method for manufacturing the same Grant 8,716,914 - Tanaka , et al. May 6, 2 | 2014-05-06 |
| Dividing method for wafer having die bonding film attached to the back side thereof Grant 8,415,232 - Kajiyama , et al. April 9, 2 | 2013-04-09 |
| Dividing Method For Wafer Having Die Bonding Film Attached To The Back Side Thereof App 20120100694 - Kajiyama; Keiichi ; et al. | 2012-04-26 |
| Stator Of Vehicle Ac Generator And Method For Manufacturing The Same App 20120062065 - Tanaka; Kazunori ; et al. | 2012-03-15 |
| Grinding method for wafer having crystal orientation Grant 8,100,742 - Masuda January 24, 2 | 2012-01-24 |
| Method of grinding wafer Grant 8,025,556 - Kajiyama , et al. September 27, 2 | 2011-09-27 |
| Processing method for wafer and processing apparatus therefor Grant 7,858,530 - Kajiyama , et al. December 28, 2 | 2010-12-28 |
| Processing method for wafer Grant 7,718,511 - Kajiyama , et al. May 18, 2 | 2010-05-18 |
| Grinding method for wafer Grant 7,677,955 - Kajiyama , et al. March 16, 2 | 2010-03-16 |
| Processing method of wafer Grant 7,622,328 - Masuda November 24, 2 | 2009-11-24 |
| Method for producing semiconductor package Grant 7,608,481 - Masuda October 27, 2 | 2009-10-27 |
| Grinding Method For Wafer Having Crystal Orientation App 20090247056 - Masuda; Takatoshi | 2009-10-01 |
| Method Of Grinding Wafer App 20090186562 - Kajiyama; Keiichi ; et al. | 2009-07-23 |
| Grinding Method For Wafer App 20090098808 - Kajiyama; Keiichi ; et al. | 2009-04-16 |
| Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform Grant 7,439,162 - Norimoto , et al. October 21, 2 | 2008-10-21 |
| Protective tape applying method App 20070249146 - Masuda; Takatoshi | 2007-10-25 |
| Processing method for wafer and processing apparatus therefor Grant 7,278,903 - Masuda October 9, 2 | 2007-10-09 |
| Processing method for wafer and processing apparatus therefor App 20070227655 - Kajiyama; Keiichi ; et al. | 2007-10-04 |
| Processing method for wafer App 20070231929 - Kajiyama; Keiichi ; et al. | 2007-10-04 |
| Method for producing semiconductor package App 20070218593 - Masuda; Takatoshi | 2007-09-20 |
| Processing method for wafer and processing apparatus therefor App 20070141955 - Masuda; Takatoshi | 2007-06-21 |
| Wafer dividing method App 20070123002 - Norimoto; Ryuji ; et al. | 2007-05-31 |
| Processing method of wafer App 20070077731 - Masuda; Takatoshi | 2007-04-05 |
| Wafer processing method App 20070004177 - Nakamura; Masaru ; et al. | 2007-01-04 |
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