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name:-0.070775032043457
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Masuda; Masachika Patent Filings

Masuda; Masachika

Patent Applications and Registrations

Patent applications and USPTO patent grants for Masuda; Masachika.The latest application filed is for "lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device".

Company Profile
1.77.63
  • Masuda; Masachika - Tokorozawa JP
  • MASUDA; Masachika - Tokorozawa-shi JP
  • Masuda; Masachika - Tokyo-to JP
  • Masuda; Masachika - Saitama N/A JP
  • Masuda; Masachika - Shinjuku-ku N/A JP
  • Masuda; Masachika - Tokyo JP
  • Masuda; Masachika - Saitama-Ken JP
  • Masuda; Masachika - Kodaira JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
Grant 9,870,983 - Shibasaki , et al. January 16, 2
2018-01-16
Lead Frame, Method For Manufacturing Lead Frame, Semiconductor Device, And Method For Manufacturing Semiconductor Device
App 20170077011 - SHIBASAKI; Satoshi ;   et al.
2017-03-16
Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
Grant 9,543,169 - Shibasaki , et al. January 10, 2
2017-01-10
Lead Frame, Method For Manufacturing Lead Frame, Semiconductor Device, And Method For Manufacturing Semiconductor Device
App 20160189978 - SHIBASAKI; Satoshi ;   et al.
2016-06-30
Resin-sealed semiconductor device and associated wiring and support structure
Grant 9,324,636 - Baba , et al. April 26, 2
2016-04-26
Method of manufacturing a semiconductor device
Grant RE45,931 - Wada , et al. March 15, 2
2016-03-15
Semiconductor device and manufacturing method therefor
Grant 9,263,374 - Masuda , et al. February 16, 2
2016-02-16
Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
Grant 9,257,306 - Shibasaki , et al. February 9, 2
2016-02-09
Semiconductor device and a method of manufacturing the same
Grant 9,159,706 - Masuda , et al. October 13, 2
2015-10-13
Semiconductor Device And A Method Of Manufacturing The Same
App 20150001538 - Masuda; Masachika ;   et al.
2015-01-01
Lead Frame, Method For Manufacturing Lead Frame, Semiconductor Device, And Method For Manufacturing Semiconductor Device
App 20140319663 - SHIBASAKI; Satoshi ;   et al.
2014-10-30
Wiring Device For Semiconductor Device, Composite Wiring Device For Semiconductor Device, And Resin-sealed Semiconductor Device
App 20140299995 - BABA; Susumu ;   et al.
2014-10-09
Semiconductor device and a method of manufacturing the same
Grant 8,853,864 - Masuda , et al. October 7, 2
2014-10-07
Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
Grant 8,796,832 - Baba , et al. August 5, 2
2014-08-05
Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
Grant 8,742,554 - Shimazaki , et al. June 3, 2
2014-06-03
Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
Grant 8,739,401 - Shimazaki , et al. June 3, 2
2014-06-03
Plastic package and method of fabricating the same
Grant 8,653,647 - Masuda , et al. February 18, 2
2014-02-18
Semiconductor Device And A Method Of Manufacturing The Same
App 20130328046 - MASUDA; Masachika ;   et al.
2013-12-12
Semiconductor device and a method of manufacturing the same
Grant 8,502,395 - Masuda , et al. August 6, 2
2013-08-06
Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
Grant 8,471,371 - Baba , et al. June 25, 2
2013-06-25
Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member
Grant 8,420,446 - Yo , et al. April 16, 2
2013-04-16
Semiconductor device and method for manufacturing metallic shielding plate
Grant 8,247,888 - Masuda , et al. August 21, 2
2012-08-21
Wiring Device For Semiconductor Device, Composite Wiring Device For Semiconductor Device, And Resin-sealed Semiconductor Device
App 20120175759 - Baba; Susumu ;   et al.
2012-07-12
Semiconductor Device And A Method Of Manufacturing The Same
App 20120168965 - MASUDA; Masachika ;   et al.
2012-07-05
Semiconductor and a method of manufacturing the same
Grant 8,159,062 - Masuda , et al. April 17, 2
2012-04-17
Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
Grant 8,148,804 - Baba , et al. April 3, 2
2012-04-03
Semiconductor Device And Manufacturing Method Therefor
App 20120074544 - MASUDA; Masachika ;   et al.
2012-03-29
Semiconductor And A Method Of Manufacturing The Same
App 20120013027 - MASUDA; Masachika ;   et al.
2012-01-19
Semiconductor device and a method of manufacturing the same
Grant 8,067,251 - Masuda , et al. November 29, 2
2011-11-29
Semiconductor Device And A Method Of Manufacturing The Same
App 20110195530 - Masuda; Masachika ;   et al.
2011-08-11
Circuit Member, Manufacturing Method Of The Circuit Member, And Semiconductor Device Including The Circuit Member
App 20110117704 - Shimazaki; Yo ;   et al.
2011-05-19
Semiconductor device and a method of manufacturing the same
Grant 7,879,647 - Masuda , et al. February 1, 2
2011-02-01
Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
App 20110006410 - Baba; Susumu ;   et al.
2011-01-13
Circuit Member, Manufacturing Method For Circuit Members, Semiconductor Device, And Surface Lamination Structure For Circuit Member
App 20100325885 - Shimazaki; Yo ;   et al.
2010-12-30
Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device
Grant 7,851,902 - Masuda , et al. December 14, 2
2010-12-14
Plastic package and method of fabricating the same
App 20100276806 - Masuda; Masachika ;   et al.
2010-11-04
Semiconductor device and method for manufacturing metallic shielding plate
App 20100270660 - Masuda; Masachika ;   et al.
2010-10-28
Semiconductor Device And A Method Of Manufacturing The Same
App 20100068850 - Masuda; Masachika ;   et al.
2010-03-18
Semiconductor device and a method of manufacturing the same
Grant 7,633,146 - Masuda , et al. December 15, 2
2009-12-15
Semiconductor Device and a Method of Manufacturing the Same
App 20090283885 - Wada; Tamaki ;   et al.
2009-11-19
Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
App 20090189263 - Baba; Susumu ;   et al.
2009-07-30
Circuit Member, Manufacturing Method Of The Circuit Member, And Semiconductor Device Including The Circuit Member
App 20090146280 - Shimazaki; Yo ;   et al.
2009-06-11
Resin-sealed Semiconductor Device, Manufacturing Method Thereof, Base Material For The Semiconductor Device, And Layered And Resin-sealed Semiconductor Device
App 20090140411 - Masuda; Masachika ;   et al.
2009-06-04
Circuit Member, Manufacturing Method For Circuit Members, Semiconductor Device, And Surface Lamination Structure For Circuit Member
App 20090039486 - Shimazaki; Yo ;   et al.
2009-02-12
Semiconductor Device And A Method Of Manufacturing The Same
App 20080290488 - Masuda; Masachika ;   et al.
2008-11-27
Plastic package and method of fabricating the same
App 20080251902 - Masuda; Masachika ;   et al.
2008-10-16
Plastic package and method of fabricating the same
Grant 7,405,468 - Masuda , et al. July 29, 2
2008-07-29
Semiconductor device fabricating apparatus and semiconductor device fabricating method
Grant 7,365,441 - Ikenaga , et al. April 29, 2
2008-04-29
Semiconductor device and method of manufacturing the same
Grant 7,348,668 - Masuda , et al. March 25, 2
2008-03-25
Memory card with connecting portions for connection to an adapter
Grant 7,294,918 - Wada , et al. November 13, 2
2007-11-13
Memory card with connecting portions for connection to an adapter
Grant 7,271,475 - Wada , et al. September 18, 2
2007-09-18
Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus
Grant 7,271,471 - Masuda , et al. September 18, 2
2007-09-18
Memory card with a cap having indented portions
Grant 7,239,011 - Wada , et al. July 3, 2
2007-07-03
Memory card with an adaptor
Grant 7,233,058 - Wada , et al. June 19, 2
2007-06-19
Semiconductor device and a memory system including a plurality of IC chips in a common package
Grant 7,227,251 - Sakuma , et al. June 5, 2
2007-06-05
Stacked semiconductor device including improved lead frame arrangement
Grant 7,122,883 - Masuda , et al. October 17, 2
2006-10-17
Memory card
App 20060220203 - Wada; Tamaki ;   et al.
2006-10-05
Memory card
App 20060220204 - Wada; Tamaki ;   et al.
2006-10-05
Semiconductor device and a method of manufacturing the same
App 20060170084 - Masuda; Masachika ;   et al.
2006-08-03
Semiconductor device fabricating apparatus and semiconductor device fabricating method
App 20060145363 - Ikenaga; Chikao ;   et al.
2006-07-06
Semiconductor device fabricating apparatus and semiconductor device fabricating method
Grant 7,064,011 - Ikenaga , et al. June 20, 2
2006-06-20
Semiconductor device and a method of manufacturing the same
Grant 7,061,105 - Masuda , et al. June 13, 2
2006-06-13
Memory card
Grant 7,053,471 - Wada , et al. May 30, 2
2006-05-30
Stacked semiconductor device including improved lead frame arrangement
Grant 7,012,321 - Masuda , et al. March 14, 2
2006-03-14
Memory card
App 20060033191 - Wada; Tamaki ;   et al.
2006-02-16
Memory card
App 20050280131 - Wada, Tamaki ;   et al.
2005-12-22
Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus
App 20050275071 - Masuda, Masachika ;   et al.
2005-12-15
Semiconductor device and a memory system including a plurality of IC chips in a common package
App 20050184380 - Sakuma, Kazuki ;   et al.
2005-08-25
Memory card
Grant 6,924,547 - Kanemoto , et al. August 2, 2
2005-08-02
Plastic package and method of fabricating the same
App 20050093117 - Masuda, Masachika ;   et al.
2005-05-05
Stacked semiconductor device including improved lead frame arrangement
App 20050094433 - Masuda, Masachika ;   et al.
2005-05-05
Semiconductor device and a memory system including a plurality of IC chips in a common package
Grant 6,885,092 - Sakuma , et al. April 26, 2
2005-04-26
Semiconductor device and a method of manufacturing the same
Grant 6,858,925 - Wada , et al. February 22, 2
2005-02-22
Semiconductor device and method of manufacturing the same
Grant 6,853,089 - Ujiie , et al. February 8, 2
2005-02-08
Method of manufacturing a semiconductor device
App 20050026323 - Wada, Tsutomu ;   et al.
2005-02-03
Semiconductor device and method of manufacturing the same
App 20040197959 - Ujiie, Mikako ;   et al.
2004-10-07
Method of manufacturing a semiconductor device
Grant 6,797,539 - Wada , et al. September 28, 2
2004-09-28
Semiconductor device fabricating apparatus and semiconductor device fabricating method
App 20040164387 - Ikenaga, Chikao ;   et al.
2004-08-26
Semiconductor device and a method of manufacturing the same
App 20040135262 - Masuda, Masachika ;   et al.
2004-07-15
Semiconductor device and process for manufacturing the same
Grant 6,750,080 - Masuda , et al. June 15, 2
2004-06-15
Semiconductor device and a method of manufacturing the same
Grant 6,686,663 - Masuda , et al. February 3, 2
2004-02-03
Memory card and a method of manufacturing the same
App 20030227075 - Kanemoto, Kouichi ;   et al.
2003-12-11
Method of manufacturing a semiconductor device
App 20030199122 - Wada, Tsutomu ;   et al.
2003-10-23
Semiconductor device
Grant 6,617,196 - Iwaya , et al. September 9, 2
2003-09-09
Stacked semiconductor device including improved lead frame arrangement
App 20030164542 - Masuda, Masachika ;   et al.
2003-09-04
Method of fabricating a semiconductor device
Grant 6,610,561 - Tsubosaki , et al. August 26, 2
2003-08-26
Semiconductor device
App 20030151134 - Nishizawa, Hirotaka ;   et al.
2003-08-14
Method of manufacturing a semiconductor device
Grant 6,602,734 - Wada , et al. August 5, 2
2003-08-05
Semiconductor device and process for manufacturing the same
App 20030122262 - Masuda, Masachika ;   et al.
2003-07-03
Semiconductor device and a method of manufacturing the same
App 20030117785 - Wada, Tamaki ;   et al.
2003-06-26
Stacked semiconductor device including improved lead frame arrangement
Grant 6,555,918 - Masuda , et al. April 29, 2
2003-04-29
Semiconductor device and a method of manufacturing the same
Grant 6,538,331 - Masuda , et al. March 25, 2
2003-03-25
Semiconductor device and method of manufacturing the same
App 20030052419 - Ujiie, Mikako ;   et al.
2003-03-20
Semiconductor device and a method of manufacturing the same
App 20030049887 - Wada, Tamaki ;   et al.
2003-03-13
Semiconductor device
Grant 6,531,773 - Nishizawa , et al. March 11, 2
2003-03-11
Semiconductor device
Grant 6,492,727 - Nishizawa , et al. December 10, 2
2002-12-10
Semiconductor device and a method of manufacturing the same
App 20020180060 - Masuda, Masachika ;   et al.
2002-12-05
Semiconductor device
Grant 6,452,266 - Iwaya , et al. September 17, 2
2002-09-17
Semiconductor device
App 20020109215 - Iwaya, Akihiko ;   et al.
2002-08-15
Stacked semiconductor device including improved lead frame arrangement
App 20020102763 - Masuda, Masachika ;   et al.
2002-08-01
Semiconductor device and a method of manufacturing the same and an electronic device
Grant 6,410,987 - Kanemoto , et al. June 25, 2
2002-06-25
Semiconductor device
App 20020056911 - Iwaya, Akihiko ;   et al.
2002-05-16
Semiconductor device
App 20020053732 - Iwaya, Akihiko ;   et al.
2002-05-09
Semiconductor device
App 20020043719 - Iwaya, Akihiko ;   et al.
2002-04-18
Semiconductor device
App 20020030270 - Nishizawa, Hirotaka ;   et al.
2002-03-14
Semiconductor device and a method of manufacturing the same
App 20020017722 - Masuda, Masachika
2002-02-14
Semiconductor device
App 20020017720 - Nishizawa, Hirotaka ;   et al.
2002-02-14
Semiconductor device and a method of manufacturing the same and an electronic device
App 20020014686 - Kanemoto, Kouichi ;   et al.
2002-02-07
Semiconductor Device
App 20020011650 - Nishizawa, Hirotaka ;   et al.
2002-01-31
Semiconductor device and a method of manufacturing the same
Grant 6,337,521 - Masuda January 8, 2
2002-01-08
Semiconductor device
App 20010040284 - Iwaya, Akihiko ;   et al.
2001-11-15
Semiconducator device and a method of manufacturing the same
App 20010031513 - Masuda, Masachika ;   et al.
2001-10-18
Semiconductor device and method for manufacturing the same
Grant 6,297,544 - Nakamura , et al. October 2, 2
2001-10-02
Stacked semiconductor device including improved lead frame arrangement
App 20010023088 - Masuda, Masachika ;   et al.
2001-09-20
Method of fabricating a semiconductor device
App 20010016371 - Tsubosaki, Kunihiro ;   et al.
2001-08-23
Semiconductor device and a method of manufacturing the same
App 20010010397 - Masuda, Masachika ;   et al.
2001-08-02
Semiconductor device
App 20010001504 - Sugiyama, Michiaki ;   et al.
2001-05-24
Semiconductor device
Grant 6,169,325 - Azuma , et al. January 2, 2
2001-01-02
Semiconductor device
Grant 6,153,922 - Sugiyama , et al. November 28, 2
2000-11-28
Lead on chip semiconductor device and method of fabricating the same
Grant 6,137,159 - Tsubosaki , et al. October 24, 2
2000-10-24
Semiconductor device having adhesive between lead and chip
Grant 6,097,081 - Masuda , et al. August 1, 2
2000-08-01
Thin type semiconductor device, module structure using the device and method of mounting the device on board
Grant 5,895,969 - Masuda , et al. April 20, 1
1999-04-20
Semiconductor device structure
Grant 5,811,877 - Miyano , et al. September 22, 1
1998-09-22
Thin type semiconductor device, module structure using the device and method of mounting the device on board
Grant 5,723,903 - Masuda , et al. March 3, 1
1998-03-03
Thin type semiconductor device and module structure using the device
Grant 5,446,313 - Masuda , et al. August 29, 1
1995-08-29
Resin-encapsulated semiconductor device having a particular mounting structure
Grant 5,150,193 - Yasuhara , et al. September 22, 1
1992-09-22
Process of producing semiconductor device
Grant 4,994,411 - Naito , et al. February 19, 1
1991-02-19
Semiconductor device and method of manufacturing the same
Grant 4,989,068 - Yasuhara , et al. January 29, 1
1991-01-29
Semiconductor device and method of manufacturing the same
Grant 4,987,474 - Yasuhara , et al. January 22, 1
1991-01-22
Lead frame and semiconductor device using the same
Grant 4,951,120 - Hagiwara , et al. August 21, 1
1990-08-21
Semiconductor device lead frame with etched through holes
Grant 4,862,246 - Masuda , et al. August 29, 1
1989-08-29
Semiconductor device and method of producing the same
Grant 4,706,105 - Masuda , et al. November 10, 1
1987-11-10

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