Master; Raj N.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Master; Raj N..The latest application filed is for "graphic formation via material ablation".
Company Profile
0.28.20
- Master; Raj N. - San Jose CA
- MASTER, RAJ N - SAN JOSE CA
- Master; Raj N. - Dutchess County NY
- Master; Raj N. - Wappingers Falls NY
Patent Activity
| Patent | Date |
|---|---|
| Graphic formation via material ablation Grant 9,661,770 - McCormack , et al. May 23, 2 | 2017-05-23 |
| Graphic Formation via Material Ablation App 20160143170 - McCormack; Mark Thomas ; et al. | 2016-05-19 |
| Metal alloy injection molding Grant 9,205,486 - Bornemann , et al. December 8, 2 | 2015-12-08 |
| Metal Alloy Injection Molding App 20150202682 - Bornemann; Paul C. ; et al. | 2015-07-23 |
| Metal alloy injection molding overflows Grant 9,027,631 - Bornemann , et al. May 12, 2 | 2015-05-12 |
| Metal alloy injection molding protrusions Grant 8,991,473 - Bornemann , et al. March 31, 2 | 2015-03-31 |
| Graphic Formation via Material Ablation App 20140248506 - McCormack; Mark Thomas ; et al. | 2014-09-04 |
| Metal Alloy Injection Molding Overflows App 20140166227 - Bornemann; Paul C. ; et al. | 2014-06-19 |
| Metal Alloy Injection Molding App 20140158317 - Bornemann; Paul C. ; et al. | 2014-06-12 |
| Metal Alloy Injection Techniques App 20140150982 - Bornemann; Paul C. ; et al. | 2014-06-05 |
| Metal Alloy Injection Molding Protrusions App 20140154523 - Bornemann; Paul C. ; et al. | 2014-06-05 |
| Metal alloy injection molding protrusions Grant 8,733,423 - Bornemann , et al. May 27, 2 | 2014-05-27 |
| Metal Alloy Injection Molding Protrusions App 20140131000 - Bornemann; Paul C. ; et al. | 2014-05-15 |
| Integrated circuit socket Grant 8,297,986 - Too , et al. October 30, 2 | 2012-10-30 |
| Void reduction in indium thermal interface material Grant 7,999,394 - Too , et al. August 16, 2 | 2011-08-16 |
| Semiconductor chip with solder joint protection ring Grant 7,923,850 - Khan , et al. April 12, 2 | 2011-04-12 |
| Void Reduction in Indium Thermal Interface Material App 20100117222 - Too; Seah Sun ; et al. | 2010-05-13 |
| Semiconductor Chip with Solder Joint Protection Ring App 20100052188 - Khan; Mohammad ; et al. | 2010-03-04 |
| Void reduction in indium thermal interface material Grant 7,651,938 - Too , et al. January 26, 2 | 2010-01-26 |
| Method for forming solder joints for a flip chip assembly Grant 7,601,612 - Master , et al. October 13, 2 | 2009-10-13 |
| Reduction of damage to thermal interface material due to asymmetrical load Grant 7,544,542 - Too , et al. June 9, 2 | 2009-06-09 |
| Integrated Circuit Socket App 20080227310 - Too; Seah Sun ; et al. | 2008-09-18 |
| Reduction of Damage to Thermal Interface Material Due to Asymmetrical Load App 20080124841 - Too; Seah Sun ; et al. | 2008-05-29 |
| Void Reduction in Indium Thermal Interface Material App 20070284737 - Too; Seah Sun ; et al. | 2007-12-13 |
| Lead-free semiconductor package Grant 7,215,030 - Master , et al. May 8, 2 | 2007-05-08 |
| Lead-free semiconductor package App 20060289977 - Master; Raj N. ; et al. | 2006-12-28 |
| Organic packages having low tin solder connections Grant 6,812,570 - Master , et al. November 2, 2 | 2004-11-02 |
| Controlled and programmed deposition of flux on a flip-chip die by spraying Grant 6,722,553 - Master , et al. April 20, 2 | 2004-04-20 |
| Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps Grant 6,709,963 - Halderman , et al. March 23, 2 | 2004-03-23 |
| Method of fabricating reliable laminate flip-chip assembly Grant 6,632,690 - Master , et al. October 14, 2 | 2003-10-14 |
| Method of reflowing organic packages using no-clean flux Grant 6,617,195 - Master , et al. September 9, 2 | 2003-09-09 |
| Method of fabricating reliable laminate flip-chip assembly App 20030077852 - Master, Raj N. ; et al. | 2003-04-24 |
| Universal ball attach manufacturing process App 20030052155 - Master, Raj N. ; et al. | 2003-03-20 |
| Boat for ball attach manufacturing process App 20030047527 - Master, Raj N. ; et al. | 2003-03-13 |
| Organic packages having low tin solder connections App 20030037959 - Master, Raj N. ; et al. | 2003-02-27 |
| Organic Packages With Solders For Reliable Flip Chip Connections App 20020170746 - MASTER, RAJ N ; et al. | 2002-11-21 |
| Method to reduce occurrences of fillet cracking in flip-chip underfill Grant 6,372,544 - Halderman , et al. April 16, 2 | 2002-04-16 |
| Controlled and programmed deposition of flux on a flip-chip die by spraying App 20020031861 - Master, Raj N. ; et al. | 2002-03-14 |
| Hot vacuum device removal process and apparatus Grant 5,605,277 - Jackson , et al. February 25, 1 | 1997-02-25 |
| Method and structure for repairing electrical lines Grant 5,153,408 - Handford , et al. October 6, 1 | 1992-10-06 |
| Method of making multilayered ceramic structures having an internal distribution of copper-based conductors Grant 4,885,038 - Anderson, Jr. , et al. December 5, 1 | 1989-12-05 |
| Method of controlling the sintering of metal particles Grant 4,776,978 - Herron , et al. October 11, 1 | 1988-10-11 |
| Bonding of pure metal films to ceramics Grant 4,764,341 - Flaitz , et al. August 16, 1 | 1988-08-16 |
| Method of controlling the sintering of metal particles Grant 4,671,928 - Herron , et al. June 9, 1 | 1987-06-09 |
| Method for removal of carbonaceous residues from ceramic structures having internal metallurgy Grant 4,627,160 - Herron , et al. December 9, 1 | 1986-12-09 |
| Material and process set for fabrication of molecular matrix print head Grant 4,504,340 - Tummala , et al. March 12, 1 | 1985-03-12 |
| Process for flattening glass-ceramic substrates Grant 4,340,436 - Dubetsky , et al. July 20, 1 | 1982-07-20 |
| Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors Grant 4,234,367 - Herron , et al. November 18, 1 | 1980-11-18 |
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