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Patent applications and USPTO patent grants for Mashiyama; Hisashi.The latest application filed is for "semiconductor wafer and semiconductor device wafer".
Patent | Date |
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Semiconductor wafer and semiconductor device wafer Grant 8,796,820 - Nemoto , et al. August 5, 2 | 2014-08-05 |
Semiconductor Wafer And Semiconductor Device Wafer App 20120187547 - Nemoto; Shusei ;   et al. | 2012-07-26 |
Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method Grant 7,267,604 - Yoshizawa , et al. September 11, 2 | 2007-09-11 |
Semiconductor wafer cleaning method and wafer cleaned by same method App 20060185688 - Uematsu; Satoshi ;   et al. | 2006-08-24 |
Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method App 20050205836 - Yoshizawa, Chie ;   et al. | 2005-09-22 |
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