Mashino; Naohiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mashino; Naohiro.The latest application filed is for "wiring board and method of manufacturing wiring board".

Company Profile

0.25.32

Mashino; Naohiro - Nagano-shi JP
Mashino; Naohiro - Nagano JP
Mashino; Naohiro - Mobara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring Board And Method Of Manufacturing Wiring Board App 20220046800 - Mashino; Naohiro	2022-02-10
Printed circuit board, method of fabricating printed circuit board, and semiconductor device Grant 8,179,689 - Mashino May 15, 2	2012-05-15
Stacked semiconductor device and method of manufacturing the same Grant 8,101,461 - Takano , et al. January 24, 2	2012-01-24
Hydrophilic treatment method and wiring pattern forming method Grant 8,007,649 - Mashino August 30, 2	2011-08-30
Inductor device, and method of manufacturing the same Grant 8,004,382 - Mashino August 23, 2	2011-08-23
Capacitor built-in substrate and method of manufacturing the same and electronic component device Grant 7,936,568 - Mashino May 3, 2	2011-05-03
Inductor built-in wiring board having shield function Grant 7,929,320 - Mashino April 19, 2	2011-04-19
Method for filling through hole Grant 7,909,976 - Mashino March 22, 2	2011-03-22
Inductor Device, And Method Of Manufacturing The Same App 20100231344 - MASHINO; Naohiro	2010-09-16
Capacitor built-in interposer and method of manufacturing the same and electronic component device Grant 7,755,910 - Mashino July 13, 2	2010-07-13
Semiconductor Device And Method Of Manufacturing The Same App 20100148340 - TAKANO; Akihito ; et al.	2010-06-17
Semiconductor device and method of manufacturing the same Grant 7,655,504 - Mashino February 2, 2	2010-02-02
Printed Circuit Board, Method Of Fabricating Printed Circuit Board, And Semiconductor Device App 20090290317 - MASHINO; Naohiro	2009-11-26
Semiconductor Device And Method Of Manufacturing The Same And Semiconductor Device Mounting Structure App 20090243035 - MASHINO; Naohiro	2009-10-01
Electronic parts packaging structure and method of manufacturing the same Grant 7,530,163 - Sunohara , et al. May 12, 2	2009-05-12
Inductor Built-in Wiring Board Having Shield Function App 20090008148 - Mashino; Naohiro	2009-01-08
Capacitor built-in substrate and method of manufacturing the same and electronic component device App 20080291649 - Mashino; Naohiro	2008-11-27
Semiconductor device and method of manufacturing the same App 20080233677 - Mashino; Naohiro	2008-09-25
Inductance Element App 20080164967 - MASHINO; Naohiro	2008-07-10
Capacitor built-in interposer and method of manufacturing the same and electronic component device App 20080030968 - Mashino; Naohiro	2008-02-07
Method for filling through hole App 20070170065 - Mashino; Naohiro	2007-07-26
Electronic parts packaging structure and method of manufacturing the same Grant 7,217,888 - Sunohara , et al. May 15, 2	2007-05-15
Process for manufacturing a wiring board having a via Grant 7,205,230 - Mashino April 17, 2	2007-04-17
Method of producing of circuit board; for semiconductor device Grant 7,114,251 - Mashino October 3, 2	2006-10-03
Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate Grant 7,084,009 - Sunohara , et al. August 1, 2	2006-08-01
Electronic parts packaging structure and method of manufacturing the same App 20060073639 - Sunohara; Masahiro ; et al.	2006-04-06
Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film Grant 6,943,442 - Sunohara , et al. September 13, 2	2005-09-13
Hydrophilic treatment method and wiring pattern forming method App 20050173251 - Mashino, Naohiro	2005-08-11
Method of manufacturing micro-semiconductor element Grant 6,872,634 - Koizumi , et al. March 29, 2	2005-03-29
Process for manufacturing a wiring board having a via App 20050048770 - Mashino, Naohiro	2005-03-03
Method of plugging through-holes in silicon substrate Grant 6,815,348 - Mashino November 9, 2	2004-11-09
Electronic Parts Packaging Structure And Method Of Manufacturing The Same App 20040209399 - SUNOHARA, Masahiro ; et al.	2004-10-21
Electronic parts packaging structure and method of manufacturing the same App 20040113260 - Sunohara, Masahiro ; et al.	2004-06-17
Electronic parts packaging structure and method of manufacturing the same App 20040113261 - Sunohara, Masahiro ; et al.	2004-06-17
Semiconductor device and method of production of same Grant 6,703,310 - Mashino , et al. March 9, 2	2004-03-09
Semiconductor device and method of production of same Grant 6,699,787 - Mashino , et al. March 2, 2	2004-03-02
Method of forming through-hole or recess in silicon substrate Grant 6,670,269 - Mashino December 30, 2	2003-12-30
Method of plugging through-holes in silicon substrate App 20030235982 - Mashino, Naohiro	2003-12-25
Semiconductor module structure incorporating antenna App 20030230797 - Mashino, Naohiro	2003-12-18
Method of machining silicon wafer App 20030232580 - Mashino, Naohiro	2003-12-18
Semiconductor device and method of manufacturing the same App 20030232486 - Mashino, Naohiro	2003-12-18
Method of manufacturing micro-semiconductor element App 20030228719 - Koizumi, Naoyuki ; et al.	2003-12-11
Semiconductor device including primary connecting plug and an auxiliary connecting plug Grant 6,661,077 - Mashino December 9, 2	2003-12-09
Method of manufacturing semiconductor device and its device App 20030092256 - Mashino, Naohiro	2003-05-15
Interposer for semiconductor, method for manufacturing same, and semiconductor device using same App 20030086248 - Mashino, Naohiro	2003-05-08
Method of forming through-hole or recess in silicon substrate App 20030073299 - Mashino, Naohiro	2003-04-17
Semiconductor device and production process thereof Grant 6,548,891 - Mashino April 15, 2	2003-04-15
Multilayer wiring board and semiconductor device Grant 6,545,353 - Mashino April 8, 2	2003-04-08
Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer Grant 6,507,497 - Mashino January 14, 2	2003-01-14
Semiconductor device and method of production of same App 20020190371 - Mashino, Naohiro ; et al.	2002-12-19
Semiconductor device and method of production of same App 20020190375 - Mashino, Naohiro ; et al.	2002-12-19
Method of production of circuit board, semiconductor device, and plating system App 20020170173 - Mashino, Naohiro	2002-11-21
Semiconductor device and production process thereof App 20020053730 - Mashino, Naohiro	2002-05-09
Assembly of plurality of semiconductor devices App 20020003296 - Mashino, Naohiro ; et al.	2002-01-10
Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer App 20010040272 - Mashino, Naohiro	2001-11-15
Multilayer wiring board, semiconductor device and methods for manufacturing such multilayer wiring board and semiconductor device App 20010038145 - Mashino, Naohiro	2001-11-08
Liquid crystal display device having a side edge type back light system with a hue layer in the vicinity of the light source Grant 5,886,759 - Mashino , et al. March 23, 1	1999-03-23

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