Mase; Yasukazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mase; Yasukazu.The latest application filed is for "chemical mechanical polishing apparatus and method".

Company Profile

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Mase; Yasukazu - Yokohama JP
Mase; Yasukazu - Fujisawa JP
Mase; Yasukazu - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical mechanical polishing apparatus and method Grant 6,015,754 - Mase , et al. January 18, 2	2000-01-18
Polishing apparatus Grant 5,655,954 - Oishi , et al. August 12, 1	1997-08-12
Method of forming multilayered wiring structure of semiconductor device Grant 5,258,328 - Sunada , et al. November 2, 1	1993-11-02
Method of determining end of cleaning of semiconductor manufacturing apparatus Grant 5,169,407 - Mase , et al. December 8, 1	1992-12-08
Multi-layered wiring structure of semiconductor integrated circuit device Grant 5,103,287 - Mase , et al. April 7, 1	1992-04-07
Plasma chemical vapor deposition apparatus Grant 5,044,311 - Mase , et al. September 3, 1	1991-09-03
Method of determining end of cleaning of semiconductor manufacturing apparatus Grant 5,016,663 - Mase , et al. May 21, 1	1991-05-21
Photolithographic method for manufacturing semiconductor wiring patterns Grant 4,952,528 - Abe , et al. August 28, 1	1990-08-28
Method of forming holes in semiconductor integrated circuit device Grant 4,857,141 - Abe , et al. August 15, 1	1989-08-15
Method of making multilayered interconnects using hillock studs formed by sintering Grant 4,728,627 - Mase , et al. March 1, 1	1988-03-01
Method for planarizing the surface of an interlayer insulating film in a semiconductor device Grant 4,634,496 - Mase , et al. January 6, 1	1987-01-06
Semiconductor device of multilayer wiring structure Grant 4,613,888 - Mase , et al. September 23, 1	1986-09-23

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