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name:-0.063821077346802
name:-0.021497964859009
name:-0.0018069744110107
Marzen; Vincent P. Patent Filings

Marzen; Vincent P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Marzen; Vincent P..The latest application filed is for "planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination".

Company Profile
0.20.11
  • Marzen; Vincent P. - Robins IA US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
Grant 9,573,327 - Sampica , et al. February 21, 2
2017-02-21
Substrate lamination system and method
Grant 8,936,057 - Sampica , et al. January 20, 2
2015-01-20
System and method for completing lamination of rigid-to-rigid substrate by the controlled application of pressure
Grant 8,746,311 - Sampica , et al. June 10, 2
2014-06-10
Substrate lamination system and method
Grant 8,691,043 - Sampica , et al. April 8, 2
2014-04-08
Planarization Treatment Of Pressure Sensitive Adhesive For Rigid-to-rigid Substrate Lamination
App 20140057012 - Sampica; James D. ;   et al.
2014-02-27
Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
Grant 8,603,288 - Sampica , et al. December 10, 2
2013-12-10
System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
Grant 8,540,002 - Sampica , et al. September 24, 2
2013-09-24
Polarizer Assembly With Adhesive Layers
App 20120275024 - Marzen; Vincent P. ;   et al.
2012-11-01
System And Method For Completing Lamination Of Rigid-to-rigid Substrates By The Controlled Application Of Pressure
App 20120168086 - Sampica; James D. ;   et al.
2012-07-05
System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
Grant 8,137,498 - Sampica , et al. March 20, 2
2012-03-20
System and method for disassembling laminated substrates
Grant 8,118,075 - Sampica , et al. February 21, 2
2012-02-21
Alignment system and method thereof
Grant 7,814,676 - Sampica , et al. October 19, 2
2010-10-19
Method and apparatus for data entry for a liquid crystal display
Grant 7,573,466 - Marzen , et al. August 11, 2
2009-08-11
Process for glass-to-glass sealing OLEDs with dry film adhesive
Grant 7,566,254 - Sampica , et al. July 28, 2
2009-07-28
System and method for disassembling laminated substrates
App 20090183615 - Sampica; James D. ;   et al.
2009-07-23
Alignment system and method thereof
App 20090183381 - Sampica; James D. ;   et al.
2009-07-23
Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
App 20090186218 - Sampica; James D. ;   et al.
2009-07-23
System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
App 20090126872 - Sampica; James D. ;   et al.
2009-05-21
Substrate lamination system and method
App 20090120585 - Sampica; James D. ;   et al.
2009-05-14
Substrate lamination system and method
App 20090120572 - Sampica; James D. ;   et al.
2009-05-14
Process for glass-to-glass sealing OLEDs with dry film adhesive
App 20090117809 - Sampica; James D. ;   et al.
2009-05-07
Method of sealing OLED cover with liquid adhesive
Grant 7,452,258 - Marzen , et al. November 18, 2
2008-11-18
Panel-to-panel lamination method for improved uniformity
Grant 7,435,311 - Marzen , et al. October 14, 2
2008-10-14
Process for applying a protective cover on an organic light-emitting diode using a liquid adhesive
Grant 7,381,110 - Sampica , et al. June 3, 2
2008-06-03

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