| Patent | Date |
|---|
Semiconductor device formed by a replacement gate approach based on an early work function metal
Grant 8,383,500 - Marxsen , et al. February 26, 2 | 2013-02-26 |
CMP system and method using individually controlled temperature zones
Grant 8,182,709 - Heinrich , et al. May 22, 2 | 2012-05-22 |
Reduced defectivity in contacts of a semiconductor device comprising replacement gate electrode structures by using an intermediate cap layer
Grant 8,183,139 - Marxsen , et al. May 22, 2 | 2012-05-22 |
System and method for optical endpoint detection during CMP by using an across-substrate signal
Grant 8,152,595 - Schlicker , et al. April 10, 2 | 2012-04-10 |
Superior fill conditions in a replacement gate approach by performing a polishing process based on a sacrificial fill material
Grant 8,138,038 - Heinrich , et al. March 20, 2 | 2012-03-20 |
Reduced Defectivity in Contacts of a Semiconductor Device Comprising Replacement Gate Electrode Structures by Using an Intermediate Cap Layer
App 20110269303 - Marxsen; Gerd ; et al. | 2011-11-03 |
Semiconductor Device Formed By A Replacement Gate Approach Based On An Early Work Function Metal
App 20110186931 - Marxsen; Gerd ; et al. | 2011-08-04 |
Technique for electrochemically depositing an alloy having a chemical order
Grant 7,985,329 - Preusse , et al. July 26, 2 | 2011-07-26 |
Superior Fill Conditions In A Replacement Gate Approach By Performing A Polishing Process Based On A Sacrificial Fill Material
App 20110076844 - Heinrich; Jens ; et al. | 2011-03-31 |
Polishing head using zone control
Grant 7,905,764 - Heinrich , et al. March 15, 2 | 2011-03-15 |
Method Of Reducing Non-uniformities During Chemical Mechanical Polishing Of Microstructure Devices By Using Cmp Pads In A Glazed Mode
App 20100112816 - Marxsen; Gerd ; et al. | 2010-05-06 |
System And Method For Optical Endpoint Detection During Cmp By Using An Across-substrate Signal
App 20090275264 - Schlicker; Mike ; et al. | 2009-11-05 |
Cmp System And Method Using Individually Controlled Temperature Zones
App 20090170320 - Heinrich; Jens ; et al. | 2009-07-02 |
Polishing Head Using Zone Control
App 20090061745 - Heinrich; Jens ; et al. | 2009-03-05 |
Method And System For Controlling Chemical Mechanical Polishing By Taking Zone Specific Substrate Data Into Account
App 20080242196 - Marxsen; Gerd ; et al. | 2008-10-02 |
Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
Grant 7,268,000 - Wollstein , et al. September 11, 2 | 2007-09-11 |
Technique for electrochemically depositing an alloy having a chemical order
App 20060219565 - Preusse; Axel ; et al. | 2006-10-05 |
Method for forming a defined recess in a damascene structure using a CMP process and a damascene structure
App 20060172527 - Marxsen; Gerd ; et al. | 2006-08-03 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process
Grant 6,958,247 - Marxsen , et al. October 25, 2 | 2005-10-25 |
Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
Grant 6,957,997 - Marxsen , et al. October 25, 2 | 2005-10-25 |
Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
App 20050070209 - Marxsen, Gerd ; et al. | 2005-03-31 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process
App 20040214423 - Marxsen, Gerd ; et al. | 2004-10-28 |
Method and system for improving the manufacturing of metal damascene structures
Grant 6,774,030 - Marxsen , et al. August 10, 2 | 2004-08-10 |
Apparatus and method for electrochemical metal deposition
Grant 6,761,812 - Preusse , et al. July 13, 2 | 2004-07-13 |
Retaining ring having reduced wear and contamination rate for a polishing head of a CMP tool
App 20040123951 - Kramer, Jens ; et al. | 2004-07-01 |
Apparatus and method for chemical mechanical polishing of a substrate
Grant 6,752,697 - Stoeckgen , et al. June 22, 2 | 2004-06-22 |
Apparatus and method for reducing oxidation of polished metal surfaces in a chemical mechanical polishing process
App 20040009670 - Preusse, Axel ; et al. | 2004-01-15 |
System and method for reducing the chemical reactivity of water and other chemicals used in the fabrication of integrated circuits
App 20040000234 - Preusse, Axel ; et al. | 2004-01-01 |
Apparatus and method for electrochemical metal deposition
App 20040000485 - Preusse, Axel ; et al. | 2004-01-01 |
Method and system for improving the manufacturing of metal damascene structures
App 20030224596 - Marxsen, Gerd ; et al. | 2003-12-04 |
Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
App 20030186546 - Wollstein, Dirk ; et al. | 2003-10-02 |
Method of forming metal lines having improved uniformity on a substrate
Grant 6,620,726 - Preusse , et al. September 16, 2 | 2003-09-16 |
Method Of Forming Metal Lines Having Improved Uniformity On A Substrate
App 20030162385 - Preusse, Axel ; et al. | 2003-08-28 |
Method for multiple phase polishing of a conductive layer in a semidonductor wafer
Grant 6,184,141 - Avanzino , et al. February 6, 2 | 2001-02-06 |
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