Maruo; Hiroki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maruo; Hiroki.The latest application filed is for "auxiliary joining agent and method for producing the same".

Company Profile

0.22.23

Maruo; Hiroki - Hyogo JP
Maruo; Hiroki - Fukuoka JP
Maruo; Hiroki - Osaka JP
Maruo; Hiroki - Sakura N/A JP
MARUO; Hiroki - Sakura-shi JP
Maruo; Hiroki - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mounting Method of a semiconductor device using a colored auxiliary joining agent Grant 10,786,876 - Kojio , et al. September 29, 2	2020-09-29
Connecting method of circuit member Grant 10,464,153 - Kishi , et al. No	2019-11-05
Conductive particle, and connection material, connection structure, and connecting method of circuit member Grant 10,412,838 - Kishi , et al. Sept	2019-09-10
Mounting structure and method for manufacturing same Grant 10,412,834 - Kishi , et al. Sept	2019-09-10
Auxiliary Joining Agent And Method For Producing The Same App 20180236613 - Kojio; Teppei ; et al.	2018-08-23
Connection structure and connecting method of circuit member Grant 10,037,960 - Kishi , et al. July 31, 2	2018-07-31
Mounting Structure And Method For Manufacturing Same App 20170374743 - KISHI; Arata ; et al.	2017-12-28
Electrode joining method, production method of electrode joined structure Grant 9,839,143 - Motomura , et al. December 5, 2	2017-12-05
Conductive Particle, And Connection Material, Connection Structure, And Connecting Method Of Circuit Member App 20170347463 - KISHI; ARATA ; et al.	2017-11-30
Connection Structure And Connecting Method Of Circuit Member App 20170345782 - KISHI; ARATA ; et al.	2017-11-30
Connecting Method Of Circuit Member App 20170326663 - KISHI; ARATA ; et al.	2017-11-16
Mounting structure and method for manufacturing same Grant 9,795,036 - Kishi , et al. October 17, 2	2017-10-17
Electronic component mounting line and electronic component mounting method Grant 9,439,335 - Maeda , et al. September 6, 2	2016-09-06
Method and system for producing component mounting board Grant 9,237,686 - Motomura , et al. January 12, 2	2016-01-12
Electronic component mounting line and electronic component mounting method Grant 9,125,329 - Maeda , et al. September 1, 2	2015-09-01
Mounting Structure And Method For Manufacturing Same App 20150116970 - Kishi; Arata ; et al.	2015-04-30
Auxiliary Joining Agent And Method For Producing The Same App 20150096651 - Kojio; Teppei ; et al.	2015-04-09
Electrode Joining Method, Production Method Of Electrode Joined Structure, And Production System Of Electrode Joined Structure App 20150047185 - Motomura; Koji ; et al.	2015-02-19
Substrate backing device and substrate thermocompression-bonding device Grant 8,851,138 - Maruo , et al. October 7, 2	2014-10-07
Electronic Component Mounting Line And Electronic Component Mounting Method App 20140208587 - Maeda; Tadashi ; et al.	2014-07-31
Method And System For Producing Component Mounting Board App 20140158751 - Motomura; Koji ; et al.	2014-06-12
Electronic component mounting line and electronic component mounting method Grant 8,673,685 - Maeda , et al. March 18, 2	2014-03-18
Electronic Component Mounting Line And Electronic Component Mounting Method App 20140073088 - Maeda; Tadashi ; et al.	2014-03-13
Electronic Component Mounting Line And Electronic Component Mounting Method App 20140053398 - Maeda; Tadashi ; et al.	2014-02-27
Printed wiring board, method for forming the printed wiring board, and board interconnection structure Grant 8,492,657 - Kitada , et al. July 23, 2	2013-07-23
Printed wiring board and connection configuration of the same Grant 8,345,436 - Kitada , et al. January 1, 2	2013-01-01
Substrate Receiving Device And Substrate Thermocompression-bonding Device App 20120234496 - Maruo; Hiroki ; et al.	2012-09-20
Printed wiring board, method for forming the printed wiring board, and board interconnection structure Grant 8,222,531 - Kitada , et al. July 17, 2	2012-07-17
Selegiline-containing Adhesive Preparation App 20110223236 - AMEYAMA; Satoshi ; et al.	2011-09-15
Print circuit substrate and connection configuration of the same Grant 8,003,892 - Maruo August 23, 2	2011-08-23
Printed wiring board and connection configuration of the same Grant 7,974,104 - Kitada , et al. July 5, 2	2011-07-05
Printed wiring board, method for forming the printed wiring board, and board interconnection structure Grant 7,964,800 - Kitada , et al. June 21, 2	2011-06-21
Printed Wiring Board, Method For Forming The Printed Wiring Board, And Board Interconnection Structure App 20100282501 - KITADA; Tomofumi ; et al.	2010-11-11
Printed Wiring Board, Method For Forming The Printed Wiring Board, And Board Interconnection Structure App 20100282499 - KITADA; Tomofumi ; et al.	2010-11-11
Printed wiring board, method for forming the printed wiring board, and board interconnection structure Grant 7,829,265 - Kitada , et al. November 9, 2	2010-11-09
Printed Wiring Board And Connection Configuration Of The Same App 20100027229 - Kitada; Tomofumi ; et al.	2010-02-04
Connection configuration for rigid substrates Grant 7,642,466 - Nikaido , et al. January 5, 2	2010-01-05
Printed Wiring Board, Method For Forming The Printed Wiring Board, And Board Interconnection Structure App 20090042144 - KITADA; Tomofumi ; et al.	2009-02-12
Soldering Structure Between Circuit Boards App 20080251280 - SHI; Honmo ; et al.	2008-10-16
Printed Wiring Board, Method For Forming The Printed Wiring Board, And Board Interconnection Structure App 20070273045 - Kitada; Tomofumi ; et al.	2007-11-29
Print Circuit Substrate And Connection Configuration Of The Same App 20070254497 - Maruo; Hiroki	2007-11-01
Connection Configuration For Rigid Substrates App 20070202306 - Nikaldo; Shinichi ; et al.	2007-08-30
Printed Wiring Board And Connection Configuration Of The Same App 20070197058 - Kitada; Tomofumi ; et al.	2007-08-23

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