Marumo; Shinya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Marumo; Shinya.The latest application filed is for "semiconductor device".
- Marumo; Shinya - Osaka JP
- Marumo; Shinya - Higashiosaka JP
- Marumo; Shinya - Higashiosaka-shi JP
| Patent | Date |
|---|---|
| Semiconductor device Grant 10,297,516 - Nagamatsu , et al. | 2019-05-21 |
| Semiconductor Device App 20180197802 - NAGAMATSU; MASAYUKI ; et al. | 2018-07-12 |
| Component mounting method, component mounting apparatus, and ultrasonic bonding head Grant 7,861,908 - Minamitani , et al. January 4, 2 | 2011-01-04 |
| Component mounting apparatus and component mounting method Grant 7,748,112 - Hirata , et al. July 6, 2 | 2010-07-06 |
| Component Mounting Apparatus And Component Mounting Method App 20080127486 - Hirata; Shuichi ; et al. | 2008-06-05 |
| Component mounting method, component mounting apparatus, and ultrasonic bonding head App 20070187457 - Minamitani; Shozo ; et al. | 2007-08-16 |
| Electronic component mounting method and apparatus and ultrasonic bonding head Grant 7,229,854 - Minamitani , et al. June 12, 2 | 2007-06-12 |
| Electronic component mounting method and apparatus and ultrasondic bonding head App 20050227429 - Minamitani, Shozo ; et al. | 2005-10-13 |
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