Martinez; Liane
Patent Applications and Registrations
Patent applications and USPTO patent grants for Martinez; Liane.The latest application filed is for "thermal management circuit board for stacked semiconductor chip device".
- Martinez; Liane - New Market CA
- Martinez; Liane - Ontario N/A CA
- Martinez; Liane - North York N/A CA
- Martinez; Liane - Newmarket CA
| Patent | Date |
|---|---|
| Semiconductor chip package with undermount passive devices Grant 9,607,935 - Martinez , et al. March 28, 2 | 2017-03-28 |
| Thermal management circuit board for stacked semiconductor chip device Grant 9,209,106 - Shi , et al. December 8, 2 | 2015-12-08 |
| Face-to-face (F2F) hybrid structure for an integrated circuit Grant 8,637,983 - Martinez , et al. January 28, 2 | 2014-01-28 |
| Thermal Management Circuit Board For Stacked Semiconductor Chip Device App 20130343000 - Shi; Xiao Ling ; et al. | 2013-12-26 |
| Circuit board component shim structure Grant 8,564,122 - McLellan , et al. October 22, 2 | 2013-10-22 |
| Circuit Board Component Shim Structure App 20130147012 - McLellan; Neil R. ; et al. | 2013-06-13 |
| Heatsink Interposer App 20130147026 - TOPACIO; Roden R. ; et al. | 2013-06-13 |
| Method of manufacturing substrates having asymmetric buildup layers Grant 8,298,945 - Leung , et al. October 30, 2 | 2012-10-30 |
| Method Of Manufacturing Substrates Having Asymmetric Buildup Layers App 20110225813 - Leung; Andrew ; et al. | 2011-09-22 |
| Semiconductor chip substrate with multi-capacitor footprint Grant 8,012,874 - Li , et al. September 6, 2 | 2011-09-06 |
| Method Of Manufacturing Substrates Having Asymmetric Buildup Layers App 20110024898 - Leung; Andrew ; et al. | 2011-02-03 |
| Multi-site probe Grant 7,847,568 - Gangoso , et al. December 7, 2 | 2010-12-07 |
| Semiconductor Chip Package with Undermount Passive Devices App 20100265682 - Martinez; Liane ; et al. | 2010-10-21 |
| Face-to-face (f2f) Hybrid Structure For An Integrated Circuit App 20100155938 - Martinez; Liane ; et al. | 2010-06-24 |
| Hybrid Semiconductor Chip Package App 20100102457 - Topacio; Roden R. ; et al. | 2010-04-29 |
| Semiconductor Chip Substrate with Multi-Capacitor Footprint App 20090152690 - Li; Yue ; et al. | 2009-06-18 |
| Multi-Site Probe App 20090045827 - Gangoso; Andrew ; et al. | 2009-02-19 |
| Circuit Substrate With Plated Through Hole Structure And Method App 20080245555 - Li; Yue ; et al. | 2008-10-09 |
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