Marshall; Scott Duncan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Marshall; Scott Duncan.The latest application filed is for "methods of fabricating leadless power amplifier packages including topside terminations".
- Marshall; Scott Duncan - CHANDLER AZ
| Patent | Date |
|---|---|
| Methods Of Fabricating Leadless Power Amplifier Packages Including Topside Terminations App 20220238450 - Wei; Yun ; et al. | 2022-07-28 |
| Leadless power amplifier packages including topside terminations and methods for the fabrication thereof Grant 11,342,275 - Wei , et al. May 24, 2 | 2022-05-24 |
| Leadless Power Amplifier Packages Including Topside Terminations And Methods For The Fabrication Thereof App 20220130768 - Wei; Yun ; et al. | 2022-04-28 |
| Bond wire array for packaged semiconductor device Grant 11,049,837 - Vaswani , et al. June 29, 2 | 2021-06-29 |
| Bond Wire Array For Packaged Semiconductor Device App 20210035942 - VASWANI; Jitesh ; et al. | 2021-02-04 |
| Power Amplifier Packages And Systems Incorporating Design-flexible Package Platforms App 20200328721 - Nanan; Jean-Christophe ; et al. | 2020-10-15 |
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