Marrs; Robert C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Marrs; Robert C..The latest application filed is for "method of making a packaged semiconductor die including heat sink with locking feature".

Company Profile

0.10.0

Marrs; Robert C. - Scottsdale AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making a packaged semiconductor die including heat sink with locking feature Grant 5,722,161 - Marrs March 3, 1	1998-03-03
Packaged semiconductor die including heat sink with locking feature Grant 5,701,034 - Marrs December 23, 1	1997-12-23
Ball grid array integrated circuit package with thermal conductor Grant 5,583,378 - Marrs , et al. December 10, 1	1996-12-10
Semiconductor device having a thermal dissipator and electromagnetic shielding Grant 5,485,037 - Marrs January 16, 1	1996-01-16
Integrated circuit package with via interconnections formed in a substrate Grant 5,483,100 - Marrs , et al. January 9, 1	1996-01-09
Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding Grant 5,482,898 - Marrs January 9, 1	1996-01-09
Method for interconnection of integrated circuit chip and substrate Grant 5,478,007 - Marrs December 26, 1	1995-12-26
Plastic molded package with heat sink for integrated circuit devices Grant 5,455,462 - Marrs October 3, 1	1995-10-03
Method for forming an integrated circuit package with via interconnection Grant 5,378,869 - Marrs , et al. January 3, 1	1995-01-03
Ball grid array with via interconnection Grant 5,355,283 - Marrs , et al. October 11, 1	1994-10-11

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