Marks; Howard Lee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Marks; Howard Lee.The latest application filed is for "flip chip semiconductor die internal signal access system and method".

Company Profile

0.10.8

Marks; Howard Lee - Gilroy CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating a flip chip semiconductor die with internal signal access Grant 8,951,814 - Schieck , et al. February 10, 2	2015-02-10
Flip Chip Semiconductor Die Internal Signal Access System And Method App 20130221354 - Schieck; Brian S. ; et al.	2013-08-29
Flip chip semiconductor die internal signal access system and method Grant 8,357,931 - Schieck , et al. January 22, 2	2013-01-22
Method of fabricating a pad over active circuit I.C. with frame support structure Grant 8,017,520 - Singh , et al. September 13, 2	2011-09-13
Flip chip semiconductor die internal signal access system and method Grant 7,842,948 - Schieck , et al. November 30, 2	2010-11-30
Pad over active circuit system and method with meshed support structure Grant 7,791,193 - Singh , et al. September 7, 2	2010-09-07
Pad over active circuit system and method with frame support structure Grant 7,649,269 - Singh , et al. January 19, 2	2010-01-19
Pad over active circuit system and method with frame support structure Grant 7,495,343 - Singh , et al. February 24, 2	2009-02-24
Pad over active circuit system and method with meshed support structure Grant 7,453,158 - Singh , et al. November 18, 2	2008-11-18
Method of fabricating a pad over active circuit I.C. with meshed support structure Grant 7,429,528 - Singh , et al. September 30, 2	2008-09-30
Flip chip semiconductor die internal signal access system and method App 20080128695 - Schieck; Brian S. ; et al.	2008-06-05
Pad Over Active Circuit System And Method With Meshed Support Structure App 20080067687 - Singh; Inderjit ; et al.	2008-03-20
Pad Over Active Circuit System And Method With Frame Support Structure App 20080062623 - Singh; Inderjit ; et al.	2008-03-13
Flip chip semiconductor die internal signal access system and method App 20050191770 - Schieck, Brian S. ; et al.	2005-09-01
Method of fabricating a pad over active circuit I.C. with meshed support structure App 20050164484 - Singh, Inderjit ; et al.	2005-07-28
Method of fabricating a pad over active circuit I.C. with frame support structure App 20050146012 - Singh, Inderjit ; et al.	2005-07-07
Pad over active circuit system and method with meshed support structure App 20050023700 - Singh, Inderjit ; et al.	2005-02-03

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