Markovich; Voya Rista

Patent Applications and Registrations

Patent applications and USPTO patent grants for Markovich; Voya Rista.The latest application filed is for "method of making an interposer sub-assembly in a printed wiring board".

Company Profile

0.28.6

Markovich; Voya Rista - Endwell NY
Markovich, Voya Rista - Endewell NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed wiring board interposer sub-assembly and method Grant 6,974,915 - Brodsky , et al. December 13, 2	2005-12-13
Method of making an interposer sub-assembly in a printed wiring board Grant 6,892,451 - Brodsky , et al. May 17, 2	2005-05-17
Method of making an interposer sub-assembly in a printed wiring board App 20050064740 - Brodsky, William Louis ; et al.	2005-03-24
Process of fabricating a circuitized structure Grant 6,739,048 - Jones , et al. May 25, 2	2004-05-25
Enhanced electrical/mechanical connection for electronic devices Grant 6,695,623 - Brodsky , et al. February 24, 2	2004-02-24
Circuitized structures produced by the methods of electroless plating Grant 6,680,440 - Russell , et al. January 20, 2	2004-01-20
Method of making an interposer sub-assembly in a printed wiring board App 20030116351 - Brodsky, William Louis ; et al.	2003-06-26
Printed wiring board interposer sub-assembly Grant 6,545,226 - Brodsky , et al. April 8, 2	2003-04-08
Printed wiring board interposer sub-assembly and method App 20020179331 - Brodsky, William Louis ; et al.	2002-12-05
Enhanced electrical/mechanical connection for electronic devices App 20020182900 - Brodsky, William Louis ; et al.	2002-12-05
Method and apparatus for in-situ testing of integrated circuit chips Grant 6,414,509 - Bhatt , et al. July 2, 2	2002-07-02
Process Of Fabricating A Circuitzed Structure App 20020078562 - Jones, Gerald Walter ; et al.	2002-06-27
Manufacturing computer systems with fine line circuitized substrates App 20010033889 - Bhatt, Anilkumar Chinuprasad ; et al.	2001-10-25
Manufacturing computer systems with fine line circuitized substrates Grant 6,268,016 - Bhatt , et al. July 31, 2	2001-07-31
Information handling system with circuit assembly having holes filled with filler material Grant 6,178,093 - Bhatt , et al. January 23, 2	2001-01-23
Method of surface finishes for eliminating surface irregularities and defects Grant 6,093,335 - Bhatt , et al. July 25, 2	2000-07-25
Process for manufacturing a circuit with filled holes Grant 6,000,129 - Bhatt , et al. December 14, 1	1999-12-14
Electronic device packages having glass free non conductive layers Grant 5,981,880 - Appelt , et al. November 9, 1	1999-11-09
Method of planarizing a curved substrate and resulting structure Grant 5,940,729 - Downes, Jr. , et al. August 17, 1	1999-08-17
Method of preparing a substrate surface for conformal plating Grant 5,922,517 - Bhatt , et al. July 13, 1	1999-07-13
Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making Grant 5,919,596 - Hedrick , et al. July 6, 1	1999-07-06
Method of preparing a substrate surface for conformal plating Grant 5,905,018 - Bhatt , et al. May 18, 1	1999-05-18
Modular circuit package having vertically aligned power and signal cores Grant 5,876,842 - Duffy , et al. March 2, 1	1999-03-02
Circuitized substrate with same surface conductors of different resolutions Grant 5,817,405 - Bhatt , et al. October 6, 1	1998-10-06
Via fill compositions for direct attach of devices and methods for applying same Grant 5,766,670 - Arldt , et al. June 16, 1	1998-06-16
Method for conditioning halogenated polymeric materials and structures fabricated therewith Grant 5,730,890 - Bickford , et al. March 24, 1	1998-03-24
Method for conditioning halogenated polymeric materials and structures fabricated therewith Grant 5,709,906 - Bickford , et al. January 20, 1	1998-01-20
Method of making a circuitized substrate using two different metallization processes Grant 5,707,893 - Bhatt , et al. January 13, 1	1998-01-13
Method of making printed circuit board Grant 5,685,070 - Alpaugh , et al. November 11, 1	1997-11-11
Method and apparatus for testing integrated circuit chips Grant 5,672,980 - Charlton , et al. September 30, 1	1997-09-30
Thermally stable photoimaging composition Grant 5,667,934 - Markovich , et al. September 16, 1	1997-09-16
Thermally stable photoimaging composition Grant 5,665,526 - Markovich , et al. September 9, 1	1997-09-09
Electroplating apparatus Grant 5,656,139 - Carey , et al. August 12, 1	1997-08-12
Encapsulated circuitized power core alignment and lamination Grant 5,229,550 - Bindra , et al. July 20, 1	1993-07-20

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