Markovich; Voya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Markovich; Voya.The latest application filed is for "semi-conductor chip with compressible contact structure and electronic package utilizing same".

Company Profile

0.27.14

Markovich; Voya - Endwell NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coreless layer buildup structure with LGA and joining layer Grant 9,351,408 - Markovich , et al. May 24, 2	2016-05-24
Coreless layer buildup structure Grant 8,541,687 - Markovich , et al. September 24, 2	2013-09-24
Coreless layer buildup structure with LGA Grant 8,536,459 - Markovich , et al. September 17, 2	2013-09-17
Semi-conductor chip with compressible contact structure and electronic package utilizing same Grant 8,198,739 - Lin , et al. June 12, 2	2012-06-12
Semi-conductor Chip With Compressible Contact Structure And Electronic Package Utilizing Same App 20120038046 - Lin; How ; et al.	2012-02-16
Method of making a multi-chip electronic package having laminate carrier Grant 7,665,207 - Fraley , et al. February 23, 2	2010-02-23
Method and system for tracking goods Grant 7,552,091 - Chan , et al. June 23, 2	2009-06-23
Information handling system including a circuitized substrate having a dielectric layer without continuous fibers Grant 7,508,076 - Japp , et al. March 24, 2	2009-03-24
Method of making circuitized substrate with signal wire shielding Grant 7,478,472 - Lauffer , et al. January 20, 2	2009-01-20
Method of making circuitized substrate Grant 7,416,996 - Japp , et al. August 26, 2	2008-08-26
Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making Grant 7,209,368 - Lauffer , et al. April 24, 2	2007-04-24
Stacked chip electronic package having laminate carrier and method of making same Grant 7,161,810 - Fraley , et al. January 9, 2	2007-01-09
Radio frequency device for tracking goods Grant 7,142,121 - Chan , et al. November 28, 2	2006-11-28
Method of making stacked chip electronic package having laminate carrier App 20060240594 - Fraley; Lawrence R. ; et al.	2006-10-26
Method of making circuitized substrate with signal wire shielding App 20060200977 - Lauffer; John M. ; et al.	2006-09-14
Joining member for Z-interconnect in electronic devices without conductive paste Grant 7,083,901 - Egitto , et al. August 1, 2	2006-08-01
Circuitized substrate Grant 7,078,816 - Japp , et al. July 18, 2	2006-07-18
Method of making circuitized substrate App 20060131755 - Japp; Robert ; et al.	2006-06-22
Information handling system App 20060125103 - Japp; Robert ; et al.	2006-06-15
Stacked chip electronic package having laminate carrier and method of making same App 20060023439 - Fraley; Lawrence R. ; et al.	2006-02-02
Stacked chip electronic package having laminate carrier and method of making same Grant 6,992,896 - Fraley , et al. January 31, 2	2006-01-31
Method and system for tracking goods App 20050289019 - Chan, Benson ; et al.	2005-12-29
Radio frequency device for tracking goods App 20050270160 - Chan, Benson ; et al.	2005-12-08
Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20050224985 - Japp, Robert ; et al.	2005-10-13
Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making App 20050195585 - Lauffer, John M. ; et al.	2005-09-08
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,929,900 - Farquhar , et al. August 16, 2	2005-08-16
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20040195001 - Farquhar, Donald S. ; et al.	2004-10-07
Stacked chip electronic package having laminate carrier and method of making same App 20040150095 - Fraley, Lawrence R. ; et al.	2004-08-05
Joining member for Z-interconnect in electronic devices without conductive paste App 20040063040 - Egitto, Frank D. ; et al.	2004-04-01
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,686,539 - Farquhar , et al. February 3, 2	2004-02-03
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20020084090 - Farquhar, Donald S. ; et al.	2002-07-04
Fluorinated polymeric composition, fabrication thereof and use thereof Grant 5,055,342 - Markovich , et al. October 8, 1	1991-10-08
Method of removing seed particles from circuit board substrate surface Grant 4,718,972 - Babu , et al. January 12, 1	1988-01-12
Electroless copper plating bath and improved stability Grant 4,655,833 - Amelio , et al. April 7, 1	1987-04-07
Process for manufacturing a concentrate of a palladium-tin colloidal catalyst Grant 4,593,016 - Amelio , et al. June 3, 1	1986-06-03
Method for conditioning a surface of a dielectric substrate for electroless plating Grant 4,554,182 - Bupp , et al. November 19, 1	1985-11-19
Deposition of copper from electroless plating compositions Grant 4,525,390 - Alpaugh , et al. June 25, 1	1985-06-25
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate Grant 4,478,883 - Bupp , et al. October 23, 1	1984-10-23

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