| Patent | Date |
|---|
Method For Connecting Cross-components At Optimised Density
App 20210280628 - MARION; Francois ; et al. | 2021-09-09 |
Method of producing a hybridized device including microelectronic components
Grant 10,002,842 - Marion June 19, 2 | 2018-06-19 |
Method of manufacturing a plurality of island-shaped dipoles having self-aligned electrodes
Grant 9,985,067 - Marion May 29, 2 | 2018-05-29 |
Hybrid electronic device protected against humidity and method of protecting a hybrid electronic device against humidity
Grant 9,793,141 - Marion , et al. October 17, 2 | 2017-10-17 |
Hybrid Electronic Device Protected Against Humidity And Method Of Protecting A Hybrid Electronic Device Against Humidity
App 20170229321 - Marion; Francois ; et al. | 2017-08-10 |
Method Of Manufacturing A Plurality Of Island-shaped Dipoles Having Self-aligned Electrodes
App 20160380017 - Marion; Francois | 2016-12-29 |
Connecting Component Equipped With Hollow Inserts
App 20160233186 - MARION; Francois | 2016-08-11 |
Flip-chip assembly process comprising pre-coating interconnect elements
Grant 9,406,662 - Marion , et al. August 2, 2 | 2016-08-02 |
Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method
Grant 9,368,473 - Marion June 14, 2 | 2016-06-14 |
Method For Configuring Devices In A Daisy Chain Communication Configuration
App 20160127173 - Gagnon; Dominic ; et al. | 2016-05-05 |
Flip-chip Assembly Process Comprising Pre-coating Interconnect Elements
App 20150380395 - MARION; Francois ; et al. | 2015-12-31 |
Connecting elements for producing hybrid electronic circuits
Grant 9,166,338 - Marion , et al. October 20, 2 | 2015-10-20 |
Assembly Method, of the Flip-Chip Type, for Connecting Two Electronic Components, Assembly Obtained by the Method
App 20150235985 - Marion; Francois | 2015-08-20 |
Method of making a connection component with hollow inserts
Grant 8,898,896 - Marion , et al. December 2, 2 | 2014-12-02 |
Detector system with an optical function and method for making such a system
Grant 8,735,819 - Fendler , et al. May 27, 2 | 2014-05-27 |
Connecting Component Equipped With Hollow Inserts
App 20140075747 - MARION; Francois | 2014-03-20 |
Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method
Grant 8,664,778 - Marion March 4, 2 | 2014-03-04 |
Connecting Elements For Producing Hybrid Electronic Circuits
App 20130267113 - MARION; Francois ; et al. | 2013-10-10 |
Method Of Flip-chip Hybridization For The Forming Of Tight Cavities And Systems Obtained By Such A Method
App 20130001807 - MARION; Francois | 2013-01-03 |
Nanoprinted device comprising metallic patterns and method of nanoprinting metallic patterns
Grant 8,329,311 - Marion , et al. December 11, 2 | 2012-12-11 |
Method for bonding two electronic components
Grant 8,291,586 - Marion October 23, 2 | 2012-10-23 |
Metal lip seal and machine fitted with same seal
Grant 8,272,556 - Marion September 25, 2 | 2012-09-25 |
Method of thinning a block transferred to a substrate
Grant 8,252,363 - Marion August 28, 2 | 2012-08-28 |
Airtight Assembly Of Two Components And Method For Producing Such An Assembly
App 20120120622 - Marion; Francois ; et al. | 2012-05-17 |
Method for producing a matrix of individual electronic components and matrix produced thereby
Grant 8,168,478 - Marion , et al. May 1, 2 | 2012-05-01 |
Method for soldering two elements together using a solder material
Grant 8,097,827 - Marion January 17, 2 | 2012-01-17 |
Connection by fitting together two soldered inserts
Grant 8,093,728 - Marion January 10, 2 | 2012-01-10 |
Method For Producing A Matrix Of Individual Electronic Components And Matrix Produced Thereby
App 20110300487 - Marion; Francois ; et al. | 2011-12-08 |
Method for producing a matrix of individual electronic components and matrix produced thereby
Grant 8,058,656 - Marion , et al. November 15, 2 | 2011-11-15 |
Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
Grant 7,938,311 - Marion May 10, 2 | 2011-05-10 |
Connection Component With Hollow Inserts And Method For Making Same
App 20110094789 - Marion; Francois ; et al. | 2011-04-28 |
Connection Component Provided With Inserts Comprising Compensating Blocks
App 20110041332 - Saint-Patrice; Damien ; et al. | 2011-02-24 |
Method For Bonding Two Electronic Components
App 20110035925 - MARION; Francois | 2011-02-17 |
Metal Lip Seal And Machine Fitted With Said Seal
App 20100243713 - MARION; Francois | 2010-09-30 |
Method of sealing or welding two elements to one another
Grant 7,772,041 - Marion August 10, 2 | 2010-08-10 |
Method for producing layers located on a hybrid circuit
Grant 7,759,261 - Marion , et al. July 20, 2 | 2010-07-20 |
Method Of Thinning A Block Transferred To A Substrate
App 20100124604 - Marion; Francois | 2010-05-20 |
Detector System With An Optical Function And Method For Making Such A System
App 20100123899 - Fendler; Manuel ; et al. | 2010-05-20 |
Electric component having microtips and ductile conducting bumps
Grant 7,717,718 - Davoine , et al. May 18, 2 | 2010-05-18 |
Method for manufacturing metal chips by plasma from a layer comprising several elements
Grant 7,691,735 - Grenouillet , et al. April 6, 2 | 2010-04-06 |
Connection By Fitting Together Two Soldered Inserts
App 20100072631 - MARION; Francois | 2010-03-25 |
Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit
Grant 7,645,686 - Fendler , et al. January 12, 2 | 2010-01-12 |
Method and device for connecting chips
Grant 7,569,940 - Marion August 4, 2 | 2009-08-04 |
Method For Manufacturing Metal Chips By Plasma From A Layer Comprising Several Elements
App 20090162657 - Grenouillet; Laurent ; et al. | 2009-06-25 |
Method For Soldering Two Elements Together Using A Solder Material
App 20090145885 - MARION; Francois | 2009-06-11 |
Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam
Grant 7,524,704 - Marion April 28, 2 | 2009-04-28 |
Method For Producing A Matrix Of Individual Electronic Components And Matrix Produced Thereby
App 20090085045 - Marion; Francois ; et al. | 2009-04-02 |
Method Of Bonding Chips On A Strained Substrate And Method Of Placing Under Strain A Semiconductor Reading Circuit
App 20090075423 - Fendler; Manuel ; et al. | 2009-03-19 |
Component Provided With A Set Of Hard Conducting Microttips And Process For Making An Electrical Connection Between This Component And A Component Proviced With Ductile Conducting Bumps
App 20080146071 - Davoine; Cecile ; et al. | 2008-06-19 |
Method Of Sealing Or Welding Two Elements To One Another
App 20080110013 - MARION; Francois | 2008-05-15 |
Nanoprinted Device Comprising Metallic Patterns and Method of Nanoprinting Metallic Patterns
App 20080107877 - Marion; Francois ; et al. | 2008-05-08 |
Method for Producing Layers Located on a Hybrid Circuit
App 20080045037 - Marion; Francois ; et al. | 2008-02-21 |
Method and device for connecting chips
App 20070111567 - Marion; Francois | 2007-05-17 |
Method for producing means of connecting and/or soldering a component
App 20070049065 - Marion; Francois | 2007-03-01 |
Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam
App 20070048905 - Marion; Francois | 2007-03-01 |
Method for hybridisation of two components by using different sized solder protrusions and a device that uses two components hybridised according to this method
App 20070045387 - Marion; Francois | 2007-03-01 |
Method and device for passive alignment of optical waveguides and optoelectronic components and optical system using said device
Grant 7,031,578 - Marion , et al. April 18, 2 | 2006-04-18 |
Process and device for the passive alignment of supports, particularly plates comprising optical components
App 20050213896 - Marion, Francois ; et al. | 2005-09-29 |
Device for multiplexing an array of optical channels, use for wavelength and add-drop multiplexing
App 20050074203 - Marion, Francois | 2005-04-07 |
Method and device for passive alignment of optical waveguides and optoelectronic components and optical system using said device
App 20040037507 - Marion, Francois ; et al. | 2004-02-26 |
Method and device for passive alignment of optical fibres and optoelectronic components
App 20040037514 - Marion, Francois ; et al. | 2004-02-26 |
Optic device comprising a plurality of resonant cavities of different lengths associated with different wavelengths
Grant 6,639,928 - Marion October 28, 2 | 2003-10-28 |
Process and device for connection/disconnection of an optical fiber with an optoelectronic component
App 20030128953 - Marion, Francois | 2003-07-10 |
Method for passive alignment of supports, particularly plates bearing optical components
App 20030077050 - Marion, Francois ; et al. | 2003-04-24 |
Method and device for passive alignment of optical fibres and componenets, using cross-shaped notches
App 20030001115 - Marion, Francois | 2003-01-02 |
Optic device comprising a plurality of resonant cavities of different lengths associated with different wavelengths
App 20020186737 - Marion, Francois | 2002-12-12 |
Hybrid device and a method of producing electrically active components by an assembly operation
App 20010026969 - Marion, Francois | 2001-10-04 |
Two wave band radiation detector having two facing photodetectors and method for making same
Grant 5,602,385 - Mathieu , et al. February 11, 1 | 1997-02-11 |
Assembly of parts forming an angle between them and process for obtaining said assembly
Grant 5,119,240 - Marion , et al. June 2, 1 | 1992-06-02 |
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