Marino; Jeffrey R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Marino; Jeffrey R..The latest application filed is for "interlevel dielectric layer and metal layer sealing".
- Marino; Jeffrey R. - Fishkill NY
- Marino; Jeffrey R. - Clifton Park NY
| Patent | Date |
|---|---|
| Interlevel dielectric layer and metal layer sealing Grant 7,214,608 - Angyal , et al. May 8, 2 | 2007-05-08 |
| Means of seeding and metallizing polyimide Grant 7,033,648 - Doany , et al. April 25, 2 | 2006-04-25 |
| Interlevel Dielectric Layer And Metal Layer Sealing App 20060024961 - Angyal; Matthew S. ; et al. | 2006-02-02 |
| Structure and method for reducing thermo-mechanical stress in stacked vias Grant 6,831,363 - Dalton , et al. December 14, 2 | 2004-12-14 |
| Sacrificial metal liner for copper App 20040152295 - Cooney, Edward C. III ; et al. | 2004-08-05 |
| Sacrificial Metal Liner For Copper App 20040150103 - Cooney, Edward C. III ; et al. | 2004-08-05 |
| Structure and method for reducing thermo-mechanical stress in stacked vias App 20040113278 - Dalton, Timothy J. ; et al. | 2004-06-17 |
| Ti liner for copper interconnect with low-k dielectric Grant 6,661,097 - Clevenger , et al. December 9, 2 | 2003-12-09 |
| Garden trellis wall system Grant 6,311,428 - Marino , et al. November 6, 2 | 2001-11-06 |
| Trellis bracket Grant D428,798 - Marino , et al. August 1, 2 | 2000-08-01 |
| Tee pee leg connector Grant D423,626 - Marino , et al. April 25, 2 | 2000-04-25 |
| Raised bed bracket Grant D422,885 - Marino , et al. April 18, 2 | 2000-04-18 |
| Gate electrode structure for field emission devices and method of making Grant 6,010,918 - Marino , et al. January 4, 2 | 2000-01-04 |
| Electronic devices having metallurgies containing copper-semiconductor compounds Grant 5,633,047 - Brady , et al. May 27, 1 | 1997-05-27 |
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