| Patent | Date |
|---|
Antenna in Embedded Wafer-Level Ball-Grid Array Package
App 20200219832 - Marimuthu; Pandi Chelvam ; et al. | 2020-07-09 |
Antenna in embedded wafer-level ball-grid array package
Grant 10,636,753 - Marimuthu , et al. | 2020-04-28 |
Method of packaging thin die and semiconductor device including thin die
Grant 10,510,632 - Choi , et al. Dec | 2019-12-17 |
Method of Packaging Thin Die and Semiconductor Device Including Thin Die
App 20190287873 - Choi; Won Kyoung ; et al. | 2019-09-19 |
Antenna in Embedded Wafer-Level Ball-Grid Array Package
App 20190088603 - Marimuthu; Pandi Chelvam ; et al. | 2019-03-21 |
Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units
Grant 9,837,303 - Lin , et al. December 5, 2 | 2017-12-05 |
Integrated circuit system with debonding adhesive and method of manufacture thereof
Grant 9,355,993 - Choi , et al. May 31, 2 | 2016-05-31 |
Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
Grant 9,343,396 - Lin , et al. May 17, 2 | 2016-05-17 |
Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package
Grant 9,318,404 - Lin , et al. April 19, 2 | 2016-04-19 |
Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer
Grant 9,224,647 - Koo , et al. December 29, 2 | 2015-12-29 |
Integrated Circuit System With Debonding Adhesive And Method Of Manufacture Thereof
App 20150311180 - Choi; Won Kyoung ; et al. | 2015-10-29 |
Integrated circuit system with debonding adhesive and method of manufacture thereof
Grant 9,076,724 - Choi , et al. July 7, 2 | 2015-07-07 |
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
Grant 9,029,193 - Marimuthu , et al. May 12, 2 | 2015-05-12 |
Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
Grant 8,951,839 - Lin , et al. February 10, 2 | 2015-02-10 |
Integrated circuit package system with post-passivation interconnection and integration
Grant 8,951,904 - Lin , et al. February 10, 2 | 2015-02-10 |
Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation
Grant 8,912,650 - Choi , et al. December 16, 2 | 2014-12-16 |
Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation
Grant 8,900,929 - Lin , et al. December 2, 2 | 2014-12-02 |
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units
Grant 8,810,024 - Lin , et al. August 19, 2 | 2014-08-19 |
Semiconductor Device and Method of Forming Stress Relieving Vias for Improved Fan-Out WLCSP Package
App 20140217597 - Lin; Yaojian ; et al. | 2014-08-07 |
Integrated passive device system
Grant 8,669,637 - Lin , et al. March 11, 2 | 2014-03-11 |
Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
Grant 8,587,120 - Choi , et al. November 19, 2 | 2013-11-19 |
Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
Grant 8,575,018 - Lin , et al. November 5, 2 | 2013-11-05 |
Semiconductor Method and Device of Forming a Fan-Out Device with PWB Vertical Interconnect Units
App 20130277851 - Lin; Yaojian ; et al. | 2013-10-24 |
Semiconductor Method of Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20130249101 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Method and Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20130249115 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation
App 20130249080 - Lin; Yaojian ; et al. | 2013-09-26 |
Integrated circuit leadframe and fabrication method therefor
Grant 8,536,688 - Ahn , et al. September 17, 2 | 2013-09-17 |
Semiconductor Device and Method of Forming Protective Coating Over Interconnect Structure to Inhibit Surface Oxidation
App 20130228919 - Choi; Won Kyoung ; et al. | 2013-09-05 |
Solder bump confinement system for an integrated circuit package
Grant 8,466,557 - Lin , et al. June 18, 2 | 2013-06-18 |
Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation
Grant 8,435,881 - Choi , et al. May 7, 2 | 2013-05-07 |
Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
Grant 8,399,306 - Koo , et al. March 19, 2 | 2013-03-19 |
Semiconductor Device and Method of Forming Protective Coating Over Interconnect Structure to Inhibit Surface Oxidation
App 20120326297 - Choi; Won Kyoung ; et al. | 2012-12-27 |
Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure
App 20120326296 - Choi; Won Kyoung ; et al. | 2012-12-27 |
Semiconductor device and method of providing common voltage bus and wire bondable redistribution
Grant 8,309,451 - Do , et al. November 13, 2 | 2012-11-13 |
Semiconductor Device and Method of Forming IPD in Fan-Out Wafer Level Chip Scale Package
App 20120267800 - Lin; Yaojian ; et al. | 2012-10-25 |
Integrated circuit package system with filled wafer recess
Grant 8,293,584 - Guillermo , et al. October 23, 2 | 2012-10-23 |
Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
App 20120261817 - Do; Byung Tai ; et al. | 2012-10-18 |
Integrated Circuit Packaging System With Transparent Encapsulation And Method Of Manufacture Thereof
App 20120241927 - Koo; JunMo ; et al. | 2012-09-27 |
Semiconductor device and method of forming an interposer package with through silicon vias
Grant 8,263,439 - Marimuthu , et al. September 11, 2 | 2012-09-11 |
Integrated Circuit Package System With Post-passivation Interconnection And Integration
App 20120205813 - Lin; Yaojian ; et al. | 2012-08-16 |
Semiconductor device and method of forming IPD in fan-out level chip scale package
Grant 8,241,952 - Lin , et al. August 14, 2 | 2012-08-14 |
Integrated circuit package system with post-passivation interconnection and integration
Grant 8,188,590 - Lin , et al. May 29, 2 | 2012-05-29 |
Semiconductor Device and Method of Forming TSV Interposer With Semiconductor Die and Build-Up Interconnect Structure on Opposing Surfaces of the Interposer
App 20120074585 - Koo; Jun Mo ; et al. | 2012-03-29 |
Wafer integrated with permanent carrier and method therefor
Grant 8,125,073 - Han , et al. February 28, 2 | 2012-02-28 |
Semiconductor Device and Method of Forming Conductive Vias Through Interconnect Structures and Encapsulant of WLCSP
App 20110221054 - Lin; Yaojian ; et al. | 2011-09-15 |
Semiconductor Device and Method of Forming IPD in Fan-Out Level Chip Scale Package
App 20110204509 - Lin; Yaojian ; et al. | 2011-08-25 |
Wafer Integrated With Permanent Carrier and Method Therefor
App 20110101509 - Han; Byung Joon ; et al. | 2011-05-05 |
Integrated circuit package system with interlock
Grant 7,936,055 - Dimaano, Jr. , et al. May 3, 2 | 2011-05-03 |
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias
App 20110024916 - Marimuthu; Pandi Chelvam ; et al. | 2011-02-03 |
Wafer integrated with permanent carrier and method therefor
Grant 7,880,293 - Han , et al. February 1, 2 | 2011-02-01 |
Method and apparatus for wafer level integration using tapered vias
Grant 7,863,721 - Suthiwongsunthorn , et al. January 4, 2 | 2011-01-04 |
Integrated circuit stacking system with integrated passive components
Grant 7,851,257 - Marimuthu , et al. December 14, 2 | 2010-12-14 |
Semiconductor device and method of forming an interposer package with through silicon vias
Grant 7,838,337 - Marimuthu , et al. November 23, 2 | 2010-11-23 |
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier
App 20100244241 - Marimuthu; Pandi Chelvam ; et al. | 2010-09-30 |
Semiconductor Device and Method of Forming an Interconnect Structure for 3-D Devices Using Encapsulant for Structural Support
App 20100221873 - Marimuthu; Pandi Chelvam ; et al. | 2010-09-02 |
Semiconductor Device and Method of Forming an Interconnect Structure for 3-D Devices Using Encapsulant for Structural Support
App 20100213610 - Marimuthu; Pandi Chelvam ; et al. | 2010-08-26 |
Solder Bump Confinement System For An Integrated Circuit Package
App 20100193226 - Lin; Yaojian ; et al. | 2010-08-05 |
Semiconductor Device and Method of Forming Compliant Polymer Layer Between UBM and Conformal Dielectric Layer/RDL for Stress Relief
App 20100140752 - Marimuthu; Pandi Chelvam ; et al. | 2010-06-10 |
Semiconductor Device And Method Of Forming An Interconnect Structure For 3-d Devices Using Encapsulant For Structural Support
App 20100140815 - Marimuthu; Pandi Chelvam ; et al. | 2010-06-10 |
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias
App 20100133704 - Marimuthu; Pandi Chelvam ; et al. | 2010-06-03 |
Solder bump confinement system for an integrated circuit package
Grant 7,723,225 - Lin , et al. May 25, 2 | 2010-05-25 |
Method and Apparatus for Wafer Level Integration Using Tapered Vias
App 20090309235 - Suthiwongsunthorn; Nathapong ; et al. | 2009-12-17 |
Wafer Integrated with Permanent Carrier and Method Therefor
App 20090243083 - Han; Byung Joon ; et al. | 2009-10-01 |
Multi-leadframe semiconductor package and method of manufacture
Grant 7,554,179 - Shim , et al. June 30, 2 | 2009-06-30 |
Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
App 20090032975 - Do; Byung Tai ; et al. | 2009-02-05 |
Integrated Circuit System With Pre-configured Bond Wire Ball
App 20080185737 - Marimuthu; Pandi Chelvam | 2008-08-07 |
Integrated circuit package system
Grant 7,378,300 - Marimuthu , et al. May 27, 2 | 2008-05-27 |
Integrated Circuit Package System With Interlock
App 20080054421 - Dimaano; Antonio B. ; et al. | 2008-03-06 |
Integrated Circuit Package System With Filled Recess
App 20080029847 - Guillermo; Dennis ; et al. | 2008-02-07 |
Integrated Circuit Package System With Post-passivation Interconnection And Integration
App 20070284726 - Lin; Yaojian ; et al. | 2007-12-13 |
Integrated Circuit Package System With Post-passivation Interconnection And Integration
App 20070235878 - Lin; Yaojian ; et al. | 2007-10-11 |
Solder Bump Confinement System For An Integrated Circuit Package
App 20070184578 - Lin; Yaojian ; et al. | 2007-08-09 |
Integrated Passive Device System
App 20070114634 - Lin; Yaojian ; et al. | 2007-05-24 |
Integrated Circuit Stacking System With Integrated Passive Components
App 20070114651 - Marimuthu; Pandi Chelvam ; et al. | 2007-05-24 |
Integrated circuit package system
App 20070080437 - Marimuthu; Pandi Chelvam ; et al. | 2007-04-12 |
Multi-leadframe semiconductor package and method of manufacture
App 20060175689 - Shim; Il Kwon ; et al. | 2006-08-10 |
Integrated circuit leadframe and fabrication method therefor
App 20050263861 - Ahn, Byung Hoon ; et al. | 2005-12-01 |
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