Marimuthu; Pandi C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Marimuthu; Pandi C..The latest application filed is for "semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded wlcsp".

Company Profile

12.65.62

Marimuthu; Pandi C. - Singapore SG
Marimuthu; Pandi C. - Sinagpore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP App 20220093417 - Lin; Yaojian ; et al.	2022-03-24
Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP Grant 11,222,793 - Lin , et al. January 11, 2	2022-01-11
Semiconductor device and method of forming double-sided fan-out wafer level package Grant 11,127,668 - Shim , et al. September 21, 2	2021-09-21
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging App 20210233815 - Strothmann; Thomas J. ; et al.	2021-07-29
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 11,024,561 - Shim , et al. June 1, 2	2021-06-01
Semiconductor device and method of using a standardized carrier in semiconductor packaging Grant 11,011,423 - Strothmann , et al. May 18, 2	2021-05-18
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages App 20200335478 - Lin; Yaojian ; et al.	2020-10-22
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20200294890 - Shim; Il Kwon ; et al.	2020-09-17
Semiconductor device and method of forming embedded wafer level chip scale packages Grant 10,777,528 - Lin , et al. Sept	2020-09-15
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages App 20200227383 - Han; Byung Joon ; et al.	2020-07-16
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 10,707,150 - Shim , et al.	2020-07-07
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages Grant 10,658,330 - Han , et al.	2020-05-19
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) Grant 10,622,293 - Yoon , et al.	2020-04-14
Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP App 20200090954 - Lin; Yaojian ; et al.	2020-03-19
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package App 20200006215 - Shim; Il Kwon ; et al.	2020-01-02
Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP Grant 10,515,828 - Lin , et al. Dec	2019-12-24
Semiconductor device and method of forming double-sided fan-out wafer level package Grant 10,453,785 - Shim , et al. Oc	2019-10-22
Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP Grant 10,446,523 - Marimuthu , et al. Oc	2019-10-15
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Grant 10,446,479 - Marimuthu , et al. Oc	2019-10-15
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits Grant 10,388,612 - Lin , et al. A	2019-08-20
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging App 20190109048 - Strothmann; Thomas J. ; et al.	2019-04-11
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package Grant 10,242,948 - Shim , et al.	2019-03-26
Semiconductor device and method of using a standardized carrier in semiconductor packaging Grant 10,181,423 - Strothmann , et al. Ja	2019-01-15
Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP Grant 10,141,222 - Lin , et al. Nov	2018-11-27
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20180331018 - Shim; Il Kwon ; et al.	2018-11-15
Double-sided semiconductor package and dual-mold method of making same Grant 10,115,672 - Shim , et al. October 30, 2	2018-10-30
Semiconductor device and method of forming conductive vias by backside via reveal with CMP Grant 10,115,701 - Zhao , et al. October 30, 2	2018-10-30
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 10,049,964 - Shim , et al. August 14, 2	2018-08-14
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units Grant 9,978,665 - Marimuthu , et al. May 22, 2	2018-05-22
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same App 20180076142 - Shim; Il Kwon ; et al.	2018-03-15
Semiconductor Device and Method of Forming a POP Device with Embedded Vertical Interconnect Units App 20180068937 - Marimuthu; Pandi C. ; et al.	2018-03-08
Double-sided semiconductor package and dual-mold method of making same Grant 9,893,017 - Shim , et al. February 13, 2	2018-02-13
Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation Grant 9,865,524 - Na , et al. January 9, 2	2018-01-09
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units Grant 9,865,525 - Lin , et al. January 9, 2	2018-01-09
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Grant 9,842,798 - Marimuthu , et al. December 12, 2	2017-12-12
Semiconductor device and method of forming a thin wafer without a carrier Grant 9,842,775 - Marimuthu , et al. December 12, 2	2017-12-12
Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits App 20170330840 - Lin; Yaojian ; et al.	2017-11-16
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages App 20170294406 - Han; Byung Joon ; et al.	2017-10-12
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages App 20170271305 - Lin; Yaojian ; et al.	2017-09-21
Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units App 20170271241 - Marimuthu; Pandi C. ; et al.	2017-09-21
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits Grant 9,754,897 - Lin , et al. September 5, 2	2017-09-05
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,721,921 - Kim , et al. August 1, 2	2017-08-01
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages Grant 9,721,862 - Han , et al. August 1, 2	2017-08-01
Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package Grant 9,721,922 - Marimuthu , et al. August 1, 2	2017-08-01
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units Grant 9,704,780 - Marimuthu , et al. July 11, 2	2017-07-11
Semiconductor device and method of forming embedded wafer level chip scale packages Grant 9,704,824 - Lin , et al. July 11, 2	2017-07-11
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 9,666,500 - Lin , et al. May 30, 2	2017-05-30
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging App 20170133270 - Strothmann; Thomas J. ; et al.	2017-05-11
Semiconductor device and method of using a standardized carrier in semiconductor packaging Grant 9,620,413 - Strothmann , et al. April 11, 2	2017-04-11
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package App 20170098610 - Shim; Il Kwon ; et al.	2017-04-06
Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation Grant 9,607,958 - Lin , et al. March 28, 2	2017-03-28
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package Grant 9,559,039 - Shim , et al. January 31, 2	2017-01-31
Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP App 20170011936 - Lin; Yaojian ; et al.	2017-01-12
Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP App 20160336299 - Marimuthu; Pandi C. ; et al.	2016-11-17
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier App 20160336230 - Marimuthu; Pandi C. ; et al.	2016-11-17
Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP Grant 9,496,195 - Lin , et al. November 15, 2	2016-11-15
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same App 20160300797 - Shim; Il Kwon ; et al.	2016-10-13
Semiconductor device and method of forming a thin wafer without a carrier Grant 9,443,762 - Marimuthu , et al. September 13, 2	2016-09-13
Semiconductor device having wire studs as vertical interconnect in FO-WLP Grant 9,443,797 - Marimuthu , et al. September 13, 2	2016-09-13
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20160163675 - Kim; KyungMoon ; et al.	2016-06-09
Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLB-MLP) App 20160141238 - Yoon; Seung Wook ; et al.	2016-05-19
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) Grant 9,293,401 - Yoon , et al. March 22, 2	2016-03-22
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,287,204 - Kim , et al. March 15, 2	2016-03-15
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package App 20160043047 - Shim; Il Kwon ; et al.	2016-02-11
Semiconductor device and method of simultaneous molding and thermalcompression bonding Grant 9,245,770 - Kim , et al. January 26, 2	2016-01-26
Semiconductor device and method of making bumpless flipchip interconnect structures Grant 9,240,331 - Kim , et al. January 19, 2	2016-01-19
Semiconductor Device and Method of Forming Conductive Vias by Backside Via Reveal with CMP App 20150380339 - Zhao; Xing ; et al.	2015-12-31
Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits App 20150348936 - Lin; Yaojian ; et al.	2015-12-03
Semiconductor device and method of forming thermal lid for balancing warpage and thermal management Grant 9,202,769 - Lin , et al. December 1, 2	2015-12-01
Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio Grant 9,184,139 - Choi , et al. November 10, 2	2015-11-10
Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Grant 9,153,544 - Pagaila , et al. October 6, 2	2015-10-06
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief App 20150228552 - Lin; Yaojian ; et al.	2015-08-13
Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure Grant 9,105,532 - Choi , et al. August 11, 2	2015-08-11
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 9,087,930 - Lin , et al. July 21, 2	2015-07-21
Semiconductor Device and Method of Forming Fine Pitch RDL Over Semiconductor Die in Fan-Out Package App 20150179570 - Marimuthu; Pandi C. ; et al.	2015-06-25
Semiconductor Device and Method of Reducing Warpage Using a Silicon to Encapsulant Ratio App 20150171024 - Choi; Won Kyoung ; et al.	2015-06-18
Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support Grant 9,054,083 - Suthiwongsunthorn , et al. June 9, 2	2015-06-09
Semiconductor Device and Method of Forming Conductive Vias Through Interconnect Structures and Encapsulant of WLCSP App 20150091145 - Lin; Yaojian ; et al.	2015-04-02
Semiconductor device and method of bonding different size semiconductor die at the wafer level Grant 8,993,377 - Koo , et al. March 31, 2	2015-03-31
Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation App 20150061123 - Lin; Yaojian ; et al.	2015-03-05
Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure App 20150054151 - Choi; Won Kyoung ; et al.	2015-02-26
Semiconductor Device and Method of Forming Thermal Lid for Balancing Warpage and Thermal Management App 20150021754 - Lin; Yaojian ; et al.	2015-01-22
Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure Grant 8,890,315 - Choi , et al. November 18, 2	2014-11-18
Semiconductor Method and Device of Forming a Fan-Out POP Device with PWB Vertical Interconnect Units App 20140319679 - Lin; Yaojian ; et al.	2014-10-30
Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation App 20140300002 - Na; Duk Ju ; et al.	2014-10-09
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief App 20140246779 - Lin; Yaojian ; et al.	2014-09-04
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages App 20140183761 - Lin; Yaojian ; et al.	2014-07-03
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages App 20140183718 - Han; Byung Joon ; et al.	2014-07-03
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20140175640 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Making Bumpless Flipchip Interconnect Structures App 20140175661 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die App 20140175623 - Pagaila; Reza A. ; et al.	2014-06-26
Semiconductor Device and Method of Simultaneous Molding and Thermalcompression Bonding App 20140175639 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 8,759,155 - Lin , et al. June 24, 2	2014-06-24
Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units App 20140159251 - Marimuthu; Pandi C. ; et al.	2014-06-12
Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Grant 8,710,635 - Pagaila , et al. April 29, 2	2014-04-29
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20140110861 - Suthiwongsunthorn; Nathapong ; et al.	2014-04-24
Semiconductor Device and Method of Forming a POP Device with Embedded Vertical Interconnect Units App 20140103527 - Marimuthu; Pandi C. ; et al.	2014-04-17
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging App 20140091455 - Strothmann; Thomas J. ; et al.	2014-04-03
Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP App 20140091482 - Lin; Yaojian ; et al.	2014-04-03
Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP App 20140077364 - Marimuthu; Pandi C. ; et al.	2014-03-20
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package App 20140077389 - Shim; Il Kwon ; et al.	2014-03-20
Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Grant 8,659,162 - Suthiwongsunthorn , et al. February 25, 2	2014-02-25
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20140048906 - Shim; Il Kwon ; et al.	2014-02-20
Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure App 20140008791 - Choi; Won Kyoung ; et al.	2014-01-09
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier App 20130285236 - Marimuthu; Pandi C. ; et al.	2013-10-31
Semiconductor device and method of forming a thin wafer without a carrier Grant 8,531,015 - Marimuthu , et al. September 10, 2	2013-09-10
Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLP-MLP) App 20130228917 - Yoon; Seung Wook ; et al.	2013-09-05
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20130175696 - Lin; Yaojian ; et al.	2013-07-11
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 8,456,002 - Lin , et al. June 4, 2	2013-06-04
Semiconductor Device And Method Of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20130113092 - Lin; Yaojian ; et al.	2013-05-09
Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die App 20120292749 - Pagaila; Reza A. ; et al.	2012-11-22
Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Grant 8,258,012 - Pagaila , et al. September 4, 2	2012-09-04
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20120112340 - Lin; Yaojian ; et al.	2012-05-10
Semiconductor Device and Method of Bonding Different Size Semiconductor Die at the Wafer Level App 20120074587 - Koo; Jun Mo ; et al.	2012-03-29
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20120013004 - Suthiwongsunthorn; Nathapong ; et al.	2012-01-19
Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support Grant 8,067,308 - Suthiwongsunthorn , et al. November 29, 2	2011-11-29
Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die App 20110278703 - Pagaila; Reza A. ; et al.	2011-11-17
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 8,049,328 - Marimuthu , et al. November 1, 2	2011-11-01
Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief Grant 8,017,515 - Marimuthu , et al. September 13, 2	2011-09-13
Semiconductor Device and Method of Forming an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20100308443 - Suthiwongsunthorn; Nathapong ; et al.	2010-12-09
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 7,741,148 - Marimuthu , et al. June 22, 2	2010-06-22