Marieb; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Marieb; Thomas.The latest application filed is for "cladded metal interconnects".

Company Profile

1.11.10

Marieb; Thomas - Portland OR
Marieb; Thomas - San Francisco CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cladded Metal Interconnects App 20200098619 - Marieb; Thomas ; et al.	2020-03-26
Three-dimensional stacked substrate arrangements Grant 8,421,225 - Ramanathan , et al. April 16, 2	2013-04-16
Three-dimensional Stacked Substrate Arrangements App 20120280387 - Ramanathan; Shriram ; et al.	2012-11-08
Three-dimensional stacked substrate arrangements Grant 8,203,208 - Ramanathan , et al. June 19, 2	2012-06-19
Three-dimensional Stacked Substrate Arrangements App 20110260319 - Ramanathan; Shriram ; et al.	2011-10-27
Three-dimensional stacked substrate arrangements Grant 7,973,407 - Ramanathan , et al. July 5, 2	2011-07-05
Three-dimensional stacked substrate arrangements App 20090174070 - Ramanathan; Shriram ; et al.	2009-07-09
Three-dimensional stacked substrate arrangements App 20050003650 - Ramanathan, Shriram ; et al.	2005-01-06
Forming defect prevention trenches in dicing streets Grant 6,838,299 - Mulligan , et al. January 4, 2	2005-01-04
Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement Grant 6,794,755 - Maiz , et al. September 21, 2	2004-09-21
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same Grant 6,740,427 - Datta , et al. May 25, 2	2004-05-25
Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement App 20040056329 - Maiz, Jose A. ; et al.	2004-03-25
A Method Of Forming Surface Alteration Of Metal Interconnect In Integrated Circuits For Electromigration And Adhesion Improvement App 20040056366 - Maiz, Jose A. ; et al.	2004-03-25
Thermally coupling electrically decoupling cooling device for integrated circuits Grant 6,646,340 - Deeter , et al. November 11, 2	2003-11-11
Thermally Coupling Electrically Decoupling Cooling Device For Integrated Circuits App 20030151131 - Deeter, Timothy L. ; et al.	2003-08-14
Forming defect prevention trenches in dicing streets App 20030100143 - Mulligan, Rose A. ; et al.	2003-05-29
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same App 20030059644 - Datta, Madhav ; et al.	2003-03-27
Thermally coupling electrically decoupling cooling device for integrated circuits Grant 6,525,419 - Deeter , et al. February 25, 2	2003-02-25
Fabricating low K dielectric interconnect systems by using dummy structures to enhance process Grant 6,309,956 - Chiang , et al. October 30, 2	2001-10-30
Cladding of an interconnect for improved electromigration performance Grant 5,909,635 - Marieb , et al. June 1, 1	1999-06-01

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