Marcoux; Phil P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Marcoux; Phil P..The latest application filed is for "dual interconnection in stacked memory and controller module".

Company Profile

0.7.9

Marcoux; Phil P. - Mountain View CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Connection for off-chip electrostatic discharge protection Grant 8,053,898 - Marcoux November 8, 2	2011-11-08
Dual Interconnection in Stacked Memory and Controller Module App 20110169171 - Marcoux; Phil P.	2011-07-14
Connection for Off-Chip Electrostatic Discharge Protection App 20110079912 - Marcoux; Phil P.	2011-04-07
Semiconductor with Bottom-Side Wrap-Around Flange Contact App 20100327448 - Marcoux; Phil P.	2010-12-30
Semiconductor with bottom-side wrap-around flange contact Grant 7,858,512 - Marcoux December 28, 2	2010-12-28
Dual Interconnection in Stacked Memory and Controller Module App 20100270668 - Marcoux; Phil P.	2010-10-28
Semiconductor With Top-side Wrap-around Flange Contact App 20090324906 - Marcoux; Phil P.	2009-12-31
Semiconductor With Bottom-side Wrap-around Flange Contact App 20090321930 - Marcoux; Phil P.	2009-12-31
Integrated passive components and package with posts Grant 6,954,130 - Marcoux , et al. October 11, 2	2005-10-11
Integrated passive components and package with posts Grant 6,946,734 - Marcoux , et al. September 20, 2	2005-09-20
Integrated passive components and package with posts Grant 6,833,986 - Marcoux , et al. December 21, 2	2004-12-21
Integrated passive components and package with posts App 20040160727 - Marcoux, Phil P. ; et al.	2004-08-19
Integrated passive components and package with posts App 20040160299 - Marcoux, Phil P. ; et al.	2004-08-19
Integrated passive components and package with posts App 20020101329 - Marcoux, Phil P. ; et al.	2002-08-01
Wafer fabrication of die-bottom contacts for electronic devices Grant 6,221,751 - Chen , et al. April 24, 2	2001-04-24
Wafer fabrication of die-bottom contacts for electronic devices Grant 5,910,687 - Chen , et al. June 8, 1	1999-06-08

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