Marcello; Heike
Patent Applications and Registrations
Patent applications and USPTO patent grants for Marcello; Heike.The latest application filed is for "photoimageable dielectric epoxy resin system film".
- Marcello; Heike - Brackney PA
| Patent | Date |
|---|---|
| Photoimageable dielectric epoxy resin system film Grant 6,835,533 - Foster , et al. December 28, 2 | 2004-12-28 |
| Photoimageable dielectric epoxy resin system film App 20040161702 - Foster, Elizabeth ; et al. | 2004-08-19 |
| Method of fabricating circuitized structures Grant 6,706,464 - Foster , et al. March 16, 2 | 2004-03-16 |
| Circuitized structures produced by the methods of electroless plating Grant 6,680,440 - Russell , et al. January 20, 2 | 2004-01-20 |
| Method of fabricating circuitized structures App 20030129536 - Foster, Elizabeth ; et al. | 2003-07-10 |
| Method of fabricating circuitized structures Grant 6,528,218 - Foster , et al. March 4, 2 | 2003-03-04 |
| Methods for selectively filling apertures Grant 6,376,158 - Jones , et al. April 23, 2 | 2002-04-23 |
| Method of forming a chip carrier by joining a laminate layer and stiffener App 20010018799 - Lauffer, John M. ; et al. | 2001-09-06 |
| Laminate substrate having joining layer of photoimageable material Grant 6,195,264 - Lauffer , et al. February 27, 2 | 2001-02-27 |
| Organic electronic package and method of applying palladium-tin seed layer thereto Grant 5,866,237 - Angelopoulos , et al. February 2, 1 | 1999-02-02 |
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