Marcadal; Christophe

Patent Applications and Registrations

Patent applications and USPTO patent grants for Marcadal; Christophe.The latest application filed is for "method for increasing the verticality of pillars".

Company Profile

1.37.43

Marcadal; Christophe - Santa Clara CA
Marcadal; Christophe - Sunnyvale CA
Marcadal, Christophe - Sant Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Increasing The Verticality Of Pillars App 20190355621 - Marcadal; Christophe ; et al.	2019-11-21
Apparatus and process for plasma-enhanced atomic layer deposition Grant 9,032,906 - Ma , et al. May 19, 2	2015-05-19
Ampoule with a thermally conductive coating Grant 8,951,478 - Chu , et al. February 10, 2	2015-02-10
Apparatus For Deposition Of Materials On A Substrate App 20120270384 - SANCHEZ; ERROL ANTONIO C. ; et al.	2012-10-25
Gas coupler for substrate processing chamber Grant 8,216,374 - Huston , et al. July 10, 2	2012-07-10
Method and apparatus for generating a precursor for a semiconductor processing system Grant 8,062,422 - Chen , et al. November 22, 2	2011-11-22
Apparatus and process for plasma-enhanced atomic layer deposition Grant 7,850,779 - Ma , et al. December 14, 2	2010-12-14
Deposition and densification process for titanium nitride barrier layers Grant 7,838,441 - Khandelwal , et al. November 23, 2	2010-11-23
Method of recovering valuable material from exhaust gas stream of a reaction chamber Grant 7,833,358 - Chu , et al. November 16, 2	2010-11-16
Chemical delivery apparatus for CVD or ALD Grant 7,832,432 - Nakashima , et al. November 16, 2	2010-11-16
Chemical delivery apparatus for CVD or ALD Grant 7,748,400 - Nakashima , et al. July 6, 2	2010-07-06
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA Grant 7,691,742 - Marcadal , et al. April 6, 2	2010-04-06
Apparatus and process for plasma-enhanced atomic layer deposition Grant 7,682,946 - Ma , et al. March 23, 2	2010-03-23
Chemical Delivery Apparatus For Cvd Or Ald App 20100006167 - Nakashima; Norman ; et al.	2010-01-14
Chemical Delivery Apparatus For Cvd Or Ald App 20090314370 - Nakashima; Norman ; et al.	2009-12-24
Deposition And Densification Process For Titanium Nitride Barrier Layers App 20090280640 - KHANDELWAL; AMIT ; et al.	2009-11-12
Chemical precursor ampoule for vapor deposition processes Grant 7,597,758 - Chen , et al. October 6, 2	2009-10-06
Apparatus and method for generating a chemical precursor Grant 7,588,736 - Chen , et al. September 15, 2	2009-09-15
Multi-step barrier deposition method Grant 7,576,002 - Chen , et al. August 18, 2	2009-08-18
Atomic Layer Deposition Of Tantalum-containing Materials Using The Tantalum Precursor Taimata App 20090202710 - Marcadal; Christophe ; et al.	2009-08-13
Chemical delivery apparatus for CVD or ALD Grant 7,568,495 - Nakashima , et al. August 4, 2	2009-08-04
Chemical delivery apparatus for CVD or ALD Grant 7,562,672 - Nakashima , et al. July 21, 2	2009-07-21
Method And Apparatus For Generating A Precursor For A Semiconductor Processing System App 20090151633 - Chen; Ling ; et al.	2009-06-18
Method and apparatus for generating a precursor for a semiconductor processing system Grant 7,524,374 - Chen , et al. April 28, 2	2009-04-28
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA Grant 7,524,762 - Marcadal , et al. April 28, 2	2009-04-28
Deposition and densification process for titanium nitride barrier layers Grant 7,521,379 - Khandelwal , et al. April 21, 2	2009-04-21
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20080268171 - MA; PAUL ; et al.	2008-10-30
Chemical Precursor Ampoule For Vapor Deposition Processes App 20080216743 - CHEN; LING ; et al.	2008-09-11
Ampoule With A Thermally Conductive Coating App 20080149031 - CHU; SCHUBERT S. ; et al.	2008-06-26
Deposition And Densification Process For Titanium Nitride Barrier Layers App 20080085611 - KHANDELWAL; AMIT ; et al.	2008-04-10
Chemical Delivery Apparatus For Cvd Or Ald App 20080041311 - Nakashima; Norman ; et al.	2008-02-21
Atomic Layer Deposition Of Tantalum-containing Materials Using The Tantalum Precursor Taimata App 20080032041 - Marcadal; Christophe ; et al.	2008-02-07
Method of recovering valuable material from exhaust gas stream of a reaction chamber App 20070235059 - Chu; Schubert S. ; et al.	2007-10-11
Chemical delivery apparatus for CVD or ALD App 20070235085 - Nakashima; Norman ; et al.	2007-10-11
Method and apparatus of generating PDMAT precursor Grant 7,270,709 - Chen , et al. September 18, 2	2007-09-18
Reduction of copper dewetting by transition metal deposition Grant 7,265,048 - Chung , et al. September 4, 2	2007-09-04
Integration of ALD/CVD barriers with porous low k materials Grant 7,244,683 - Chung , et al. July 17, 2	2007-07-17
Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA Grant 7,241,686 - Marcadal , et al. July 10, 2	2007-07-10
Reliability Barrier Integration For Cu Application App 20070151861 - XI; MING ; et al.	2007-07-05
Gas Coupler For Substrate Processing Chamber App 20070144436 - Huston; Joel ; et al.	2007-06-28
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070128863 - Ma; Paul ; et al.	2007-06-07
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070128862 - Ma; Paul ; et al.	2007-06-07
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070128864 - MA; PAUL ; et al.	2007-06-07
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070119370 - MA; PAUL ; et al.	2007-05-31
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070119371 - MA; PAUL ; et al.	2007-05-31
Atomic Layer Deposition Processes For Ruthenium Materials App 20070077750 - Ma; Paul ; et al.	2007-04-05
Method and apparatus for generating a precursor for a semiconductor processing system App 20070067609 - Chen; Ling ; et al.	2007-03-22
Atomic Layer Deposition Processes For Ruthenium Materials App 20070054487 - MA; PAUL ; et al.	2007-03-08
Apparatus And Method For Generating A Chemical Precursor App 20060257295 - Chen; Ling ; et al.	2006-11-16
Reduction of copper dewetting by transition metal deposition App 20060199372 - Chung; Hua ; et al.	2006-09-07
Reliability barrier integration for Cu application Grant 7,026,238 - Xi , et al. April 11, 2	2006-04-11
Atomic layer deposition of tantalum-containing materials using the tantalum precursor taimata App 20060019495 - Marcadal; Christophe ; et al.	2006-01-26
Multi-step barrier deposition method App 20050255690 - Chen, Ling ; et al.	2005-11-17
CVD TiSiN barrier for copper integration Grant 6,958,296 - Chen , et al. October 25, 2	2005-10-25
Tantalum barrier layer for copper metallization Grant 6,953,742 - Chen , et al. October 11, 2	2005-10-11
Method and apparatus of generating PDMAT precursor App 20050189072 - Chen, Ling ; et al.	2005-09-01
Method and apparatus of generating PDMAT precursor Grant 6,905,541 - Chen , et al. June 14, 2	2005-06-14
Tantalum barrier layer for copper metallization App 20050074968 - Chen, Ling ; et al.	2005-04-07
Integration of ALD/CVD barriers with porous low k materials App 20040256351 - Chung, Hua ; et al.	2004-12-23
Reliability barrier integration for Cu application App 20040209460 - Xi, Ming ; et al.	2004-10-21
CVD TiSiN barrier for copper integration App 20040197492 - Chen, Ling ; et al.	2004-10-07
Method and apparatus of generating PDMAT precursor App 20040014320 - Chen, Ling ; et al.	2004-01-22
Titanium silicon nitride (TISIN) barrier layer for copper diffusion App 20040009336 - Marcadal, Christophe ; et al.	2004-01-15
Process for removing an underlying layer and depositing a barrier layer in one reactor Grant 6,660,622 - Chen , et al. December 9, 2	2003-12-09
Copper interconnect barrier layer structure and formation method Grant 6,607,976 - Chen , et al. August 19, 2	2003-08-19
CVD TiSiN barrier for copper integration Grant 6,596,643 - Chen , et al. July 22, 2	2003-07-22
Methods and apparatus for improved vaporization of deposition material in a substrate processing system Grant 6,596,085 - Schmitt , et al. July 22, 2	2003-07-22
Barrier layer structure for copper metallization and method of forming the structure Grant 6,562,715 - Chen , et al. May 13, 2	2003-05-13
Process for removing an underlying layer and depositing a barrier layer in one reactor App 20030087520 - Chen, Ling ; et al.	2003-05-08
Copper interconnect barrier layer structure and formation method App 20030059980 - Chen, Ling ; et al.	2003-03-27
CVD TiSiN barrier for copper integration App 20030022507 - Chen, Ling ; et al.	2003-01-30
Method of using a barrier sputter reactor to remove an underlying barrier layer Grant 6,498,091 - Chen , et al. December 24, 2	2002-12-24
Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition App 20020192952 - Itoh, Toshio ; et al.	2002-12-19
W-CVD with fluorine-free tungsten nucleation App 20020190379 - Jian, Ping ; et al.	2002-12-19
Method of obtaining low temperature alpha-ta thin films using wafer bias App 20020142589 - Sundarrajan, Arvind ; et al.	2002-10-03
Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition Grant 6,455,421 - Itoh , et al. September 24, 2	2002-09-24
Reliability barrier integration for Cu application App 20020060363 - Xi, Ming ; et al.	2002-05-23
CVD method of depositing copper films by using improved organocopper precursor blend Grant 6,110,530 - Chen , et al. August 29, 2	2000-08-29

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