Mao; Yi-Chao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mao; Yi-Chao.The latest application filed is for "integrated circuit structure, and method for forming thereof".

Company Profile

8.20.24

Mao; Yi-Chao - Taoyuan City TW
MAO; Yi-Chao - Zhongli City TW
Mao; Yi-Chao - Zhongli TW
Mao; Yi-Chao - Taoyuan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Structure, And Method For Forming Thereof App 20220302054 - Mao; Yi-Chao ; et al.	2022-09-22
Package Structure With Stacked Semiconductor Dies App 20220157743 - MAO; Yi-Chao ; et al.	2022-05-19
Structure and formation method of package structure with stacked semiconductor dies Grant 11,239,180 - Mao , et al. February 1, 2	2022-02-01
System For Thinning Substrate App 20210335629 - Mao; Yi-Chao ; et al.	2021-10-28
Methods and structures for packaging semiconductor dies Grant 11,069,653 - Mao , et al. July 20, 2	2021-07-20
Apparatus For Detecting End Point App 20210217671 - Mao; Yi-Chao ; et al.	2021-07-15
Method for substrate thinning Grant 11,056,364 - Mao , et al. July 6, 2	2021-07-06
Apparatus and method for detecting end point Grant 10,964,609 - Mao , et al. March 30, 2	2021-03-30
Method For Substrate Thinning App 20200294818 - Mao; Yi-Chao ; et al.	2020-09-17
Apparatus And Method For Detecting End Point App 20200176337 - Mao; Yi-Chao ; et al.	2020-06-04
Method and system for substrate thinning Grant 10,672,631 - Mao , et al.	2020-06-02
Method And System For Substrate Thinning App 20200058520 - Mao; Yi-Chao ; et al.	2020-02-20
Structure And Formation Method Of Package Structure With Stacked Semiconductor Dies App 20200035618 - MAO; Yi-Chao ; et al.	2020-01-30
Grinding element, grinding wheel and manufacturing method of semiconductor package using the same Grant 10,518,387 - Mao , et al. Dec	2019-12-31
Grinding Element, Grinding Wheel And Manufacturing Method Of Semiconductor Package Using The Same App 20190022827 - Mao; Yi-Chao ; et al.	2019-01-24
End point detection in grinding Grant 9,960,088 - Mao , et al. May 1, 2	2018-05-01
Fan-out packages and methods of forming same Grant 9,847,269 - Lin , et al. December 19, 2	2017-12-19
Methods and Structures for Packaging Semiconductor Dies App 20170301648 - Mao; Yi-Chao ; et al.	2017-10-19
Methods and structures for packaging semiconductor dies Grant 9,698,121 - Mao , et al. July 4, 2	2017-07-04
Fan-out Packages And Methods Of Forming Same App 20170033063 - Lin; Jing-Cheng ; et al.	2017-02-02
Package with a fan-out structure and method of forming the same Grant 9,406,598 - Mao , et al. August 2, 2	2016-08-02
Grinding wheel design with elongated teeth arrangement Grant 9,358,660 - Su , et al. June 7, 2	2016-06-07
Method of packaging a semiconductor device Grant 9,312,148 - Lin , et al. April 12, 2	2016-04-12
Grinding Wheel Design with Elongated Teeth Arrangement App 20150258657 - Su; Chun-Hsing ; et al.	2015-09-17
Methods and Structures for Packaging Semiconductor Dies App 20150214186 - Mao; Yi-Chao ; et al.	2015-07-30
Method Of Packaging A Semiconductor Device App 20150187605 - LIN; Jing-Cheng ; et al.	2015-07-02
Packaging methods and structures using a die attach film Grant 9,064,879 - Hung , et al. June 23, 2	2015-06-23
Packaged semiconductor device with a molding compound and a method of forming the same Grant 9,000,584 - Lin , et al. April 7, 2	2015-04-07
Package with a Fan-out Structure and Method of Forming the Same App 20140312492 - Mao; Yi-Chao ; et al.	2014-10-23
Package with a fan-out structure and method of forming the same Grant 8,785,299 - Mao , et al. July 22, 2	2014-07-22
Package With A Fan-out Structure And Method Of Forming The Same App 20140151890 - Mao; Yi-Chao ; et al.	2014-06-05
Methods for de-bonding carriers Grant 8,629,043 - Wang , et al. January 14, 2	2014-01-14
Packaged Semiconductor Device And Method Of Packaging The Semiconductor Device App 20130168848 - LIN; Jing-Cheng ; et al.	2013-07-04
Methods for De-Bonding Carriers App 20130122689 - Wang; Chung Yu ; et al.	2013-05-16
End Point Detection in Grinding App 20130115854 - Mao; Yi-Chao ; et al.	2013-05-09
Packaging Methods and Structures Using a Die Attach Film App 20130062760 - Hung; Jui-Pin ; et al.	2013-03-14

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