loadpatents
Patent applications and USPTO patent grants for Mao; Yi-Chao.The latest application filed is for "integrated circuit structure, and method for forming thereof".
Patent | Date |
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Integrated Circuit Structure, And Method For Forming Thereof App 20220302054 - Mao; Yi-Chao ;   et al. | 2022-09-22 |
Package Structure With Stacked Semiconductor Dies App 20220157743 - MAO; Yi-Chao ;   et al. | 2022-05-19 |
Structure and formation method of package structure with stacked semiconductor dies Grant 11,239,180 - Mao , et al. February 1, 2 | 2022-02-01 |
System For Thinning Substrate App 20210335629 - Mao; Yi-Chao ;   et al. | 2021-10-28 |
Methods and structures for packaging semiconductor dies Grant 11,069,653 - Mao , et al. July 20, 2 | 2021-07-20 |
Apparatus For Detecting End Point App 20210217671 - Mao; Yi-Chao ;   et al. | 2021-07-15 |
Method for substrate thinning Grant 11,056,364 - Mao , et al. July 6, 2 | 2021-07-06 |
Apparatus and method for detecting end point Grant 10,964,609 - Mao , et al. March 30, 2 | 2021-03-30 |
Method For Substrate Thinning App 20200294818 - Mao; Yi-Chao ;   et al. | 2020-09-17 |
Apparatus And Method For Detecting End Point App 20200176337 - Mao; Yi-Chao ;   et al. | 2020-06-04 |
Method and system for substrate thinning Grant 10,672,631 - Mao , et al. | 2020-06-02 |
Method And System For Substrate Thinning App 20200058520 - Mao; Yi-Chao ;   et al. | 2020-02-20 |
Structure And Formation Method Of Package Structure With Stacked Semiconductor Dies App 20200035618 - MAO; Yi-Chao ;   et al. | 2020-01-30 |
Grinding element, grinding wheel and manufacturing method of semiconductor package using the same Grant 10,518,387 - Mao , et al. Dec | 2019-12-31 |
Grinding Element, Grinding Wheel And Manufacturing Method Of Semiconductor Package Using The Same App 20190022827 - Mao; Yi-Chao ;   et al. | 2019-01-24 |
End point detection in grinding Grant 9,960,088 - Mao , et al. May 1, 2 | 2018-05-01 |
Fan-out packages and methods of forming same Grant 9,847,269 - Lin , et al. December 19, 2 | 2017-12-19 |
Methods and Structures for Packaging Semiconductor Dies App 20170301648 - Mao; Yi-Chao ;   et al. | 2017-10-19 |
Methods and structures for packaging semiconductor dies Grant 9,698,121 - Mao , et al. July 4, 2 | 2017-07-04 |
Fan-out Packages And Methods Of Forming Same App 20170033063 - Lin; Jing-Cheng ;   et al. | 2017-02-02 |
Package with a fan-out structure and method of forming the same Grant 9,406,598 - Mao , et al. August 2, 2 | 2016-08-02 |
Grinding wheel design with elongated teeth arrangement Grant 9,358,660 - Su , et al. June 7, 2 | 2016-06-07 |
Method of packaging a semiconductor device Grant 9,312,148 - Lin , et al. April 12, 2 | 2016-04-12 |
Grinding Wheel Design with Elongated Teeth Arrangement App 20150258657 - Su; Chun-Hsing ;   et al. | 2015-09-17 |
Methods and Structures for Packaging Semiconductor Dies App 20150214186 - Mao; Yi-Chao ;   et al. | 2015-07-30 |
Method Of Packaging A Semiconductor Device App 20150187605 - LIN; Jing-Cheng ;   et al. | 2015-07-02 |
Packaging methods and structures using a die attach film Grant 9,064,879 - Hung , et al. June 23, 2 | 2015-06-23 |
Packaged semiconductor device with a molding compound and a method of forming the same Grant 9,000,584 - Lin , et al. April 7, 2 | 2015-04-07 |
Package with a Fan-out Structure and Method of Forming the Same App 20140312492 - Mao; Yi-Chao ;   et al. | 2014-10-23 |
Package with a fan-out structure and method of forming the same Grant 8,785,299 - Mao , et al. July 22, 2 | 2014-07-22 |
Package With A Fan-out Structure And Method Of Forming The Same App 20140151890 - Mao; Yi-Chao ;   et al. | 2014-06-05 |
Methods for de-bonding carriers Grant 8,629,043 - Wang , et al. January 14, 2 | 2014-01-14 |
Packaged Semiconductor Device And Method Of Packaging The Semiconductor Device App 20130168848 - LIN; Jing-Cheng ;   et al. | 2013-07-04 |
Methods for De-Bonding Carriers App 20130122689 - Wang; Chung Yu ;   et al. | 2013-05-16 |
End Point Detection in Grinding App 20130115854 - Mao; Yi-Chao ;   et al. | 2013-05-09 |
Packaging Methods and Structures Using a Die Attach Film App 20130062760 - Hung; Jui-Pin ;   et al. | 2013-03-14 |
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