MAO; Sen

Patent Applications and Registrations

Patent applications and USPTO patent grants for MAO; Sen.The latest application filed is for "electrical device with terminal notches and method for manufacturing the same".

Company Profile

1.17.16

MAO; Sen - New Taipei City TW
Mao; Sen - Kaohsiung TW
Mao; Sen - New Taipei TW
MAO; Sen - Kaohsiung City TW
Mao; Sen - Kaoshiung City TW
Mao; Sen - Kaoshiung N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical Device With Terminal Notches And Method For Manufacturing The Same App 20210082792 - CHEN; Chien-Chung ; et al.	2021-03-18
Method for fabricating stack die package Grant 10,546,840 - Terrill , et al. Ja	2020-01-28
Integrated packaging structure Grant 10,090,298 - Chen , et al. October 2, 2	2018-10-02
Common-source packaging structure Grant 10,056,355 - Chen , et al. August 21, 2	2018-08-21
Integrated Packaging Structure App 20180211953 - CHEN; Chien-Chung ; et al.	2018-07-26
Common-source Packaging Structure App 20180166423 - CHEN; Chien-Chung ; et al.	2018-06-14
Common-source Packaging Structure App 20180166422 - CHEN; Chien-Chung ; et al.	2018-06-14
Common-source packaging structure Grant 9,997,500 - Chen , et al. June 12, 2	2018-06-12
Stack die package Grant 9,966,330 - Terrill , et al. May 8, 2	2018-05-08
Method For Fabricating Stack Die Package App 20170162403 - TERRILL; Kyle ; et al.	2017-06-08
Method for fabricating stack die package Grant 9,589,929 - Terrill , et al. March 7, 2	2017-03-07
Complete Power Management System Implemented In A Single Surface Mount Package App 20150331438 - Owyang; King ; et al.	2015-11-19
Complete power management system implemented in a single surface mount package Grant 9,093,359 - Owyang , et al. July 28, 2	2015-07-28
Complete power management system implemented in a single surface mount package Grant 8,928,138 - Owyang , et al. January 6, 2	2015-01-06
Stack Die Package App 20140264804 - TERRILL; Kyle ; et al.	2014-09-18
Method For Fabricating Stack Die Package App 20140273344 - TERRILL; Kyle ; et al.	2014-09-18
Semiconductor packages including die and L-shaped lead and method of manufacture Grant 8,586,419 - Jaunay , et al. November 19, 2	2013-11-19
Complete power management system implemented in a single surface mount package Grant 8,471,381 - Owyang , et al. June 25, 2	2013-06-25
Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture App 20110175217 - Jaunay; Serge ; et al.	2011-07-21
Complete Power Management System Implemented In A Single Surface Mount Package App 20100219519 - Owyang; King ; et al.	2010-09-02
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys Grant 7,394,150 - Kasem , et al. July 1, 2	2008-07-01
Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys Grant 7,238,551 - Kasem , et al. July 3, 2	2007-07-03
Complete power management system implemented in a single surface mount package App 20070063340 - Owyang; King ; et al.	2007-03-22
Complete power management system implemented in a single surface mount package App 20070063341 - Owyang; King ; et al.	2007-03-22
Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys App 20060110856 - Kasem; Mohammed ; et al.	2006-05-25
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys App 20060108671 - Kasem; Mohammed ; et al.	2006-05-25
Leadframe having slots in a die pad Grant 6,744,119 - Kuo , et al. June 1, 2	2004-06-01
Leadframe having slots in a die pad App 20020056894 - Kuo, Frank ; et al.	2002-05-16
Power semiconductor device App 20010052641 - Kuo, Frank ; et al.	2001-12-20

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