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name:-0.017853975296021
name:-0.001507043838501
name:-0.00049591064453125
Mao Bang Electronic Co., Ltd. Patent Filings

Mao Bang Electronic Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mao Bang Electronic Co., Ltd..The latest application filed is for "flip-chip led, method for manufacturing the same and flip-chip package of the same".

Company Profile
0.2.17
  • Mao Bang Electronic Co., Ltd. - Taoyuan County N/A TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flip-chip LED, method for manufacturing the same and flip-chip package of the same
Grant 9,559,265 - Chyu , et al. January 31, 2
2017-01-31
Flip-chip Led, Method For Manufacturing The Same And Flip-chip Package Of The Same
App 20150270448 - CHYU; Christopher ;   et al.
2015-09-24
Attachment Card For Subscriber Identity Module Card And Method For Manufacturing The Same
App 20150031222 - SUNG; Ta-Lun
2015-01-29
Multi-Layered Circuit Board Device
App 20120181065 - Chu; Kuei-Wu
2012-07-19
Layered Integrated Circuit Apparatus
App 20120091595 - MA; Sung Chuan ;   et al.
2012-04-19
Circuit Board Packaged with Die through Surface Mount Technology
App 20120074558 - LU; Hsuan Yu ;   et al.
2012-03-29
Silicon Chip Having Penetrative Connection Holes
App 20110291291 - Lai; Tung-Sheng ;   et al.
2011-12-01
Wafer-Bump Structure
App 20110260300 - Chu; Kuei-Wu ;   et al.
2011-10-27
Integrated Circuit Card
App 20110228487 - Chu; Tse Min ;   et al.
2011-09-22
Image-Processing Integrated Circuit
App 20110176021 - Chu; Tse Ming ;   et al.
2011-07-21
Method for Making an Aperture in a Carrier and Electrically Connecting Two Opposite Faces of the Carrier
App 20110143536 - Chu; Tse Ming
2011-06-16
Integrated Circuit
App 20110108983 - Lu; Leo ;   et al.
2011-05-12
Chip Stacking Device Having Re-Distribution Layer
App 20110062590 - Lu; Leo ;   et al.
2011-03-17
Chip for Reliable Stacking on another Chip
App 20110062586 - Lu; Leo ;   et al.
2011-03-17
Die Package
App 20110057318 - MA; Sung Chuan ;   et al.
2011-03-10
Stacked Integrated Circuit Device
App 20110031635 - Chu; Tse Ming ;   et al.
2011-02-10
Easily Stackable Dies
App 20110023574 - Lu; Leo ;   et al.
2011-02-03
Flash memory
App 20110019457 - Chu; Kuei-Wu ;   et al.
2011-01-27

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