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Patent applications and USPTO patent grants for Mao Bang Electronic Co., Ltd..The latest application filed is for "flip-chip led, method for manufacturing the same and flip-chip package of the same".
Patent | Date |
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Flip-chip LED, method for manufacturing the same and flip-chip package of the same Grant 9,559,265 - Chyu , et al. January 31, 2 | 2017-01-31 |
Flip-chip Led, Method For Manufacturing The Same And Flip-chip Package Of The Same App 20150270448 - CHYU; Christopher ;   et al. | 2015-09-24 |
Attachment Card For Subscriber Identity Module Card And Method For Manufacturing The Same App 20150031222 - SUNG; Ta-Lun | 2015-01-29 |
Multi-Layered Circuit Board Device App 20120181065 - Chu; Kuei-Wu | 2012-07-19 |
Layered Integrated Circuit Apparatus App 20120091595 - MA; Sung Chuan ;   et al. | 2012-04-19 |
Circuit Board Packaged with Die through Surface Mount Technology App 20120074558 - LU; Hsuan Yu ;   et al. | 2012-03-29 |
Silicon Chip Having Penetrative Connection Holes App 20110291291 - Lai; Tung-Sheng ;   et al. | 2011-12-01 |
Wafer-Bump Structure App 20110260300 - Chu; Kuei-Wu ;   et al. | 2011-10-27 |
Integrated Circuit Card App 20110228487 - Chu; Tse Min ;   et al. | 2011-09-22 |
Image-Processing Integrated Circuit App 20110176021 - Chu; Tse Ming ;   et al. | 2011-07-21 |
Method for Making an Aperture in a Carrier and Electrically Connecting Two Opposite Faces of the Carrier App 20110143536 - Chu; Tse Ming | 2011-06-16 |
Integrated Circuit App 20110108983 - Lu; Leo ;   et al. | 2011-05-12 |
Chip Stacking Device Having Re-Distribution Layer App 20110062590 - Lu; Leo ;   et al. | 2011-03-17 |
Chip for Reliable Stacking on another Chip App 20110062586 - Lu; Leo ;   et al. | 2011-03-17 |
Die Package App 20110057318 - MA; Sung Chuan ;   et al. | 2011-03-10 |
Stacked Integrated Circuit Device App 20110031635 - Chu; Tse Ming ;   et al. | 2011-02-10 |
Easily Stackable Dies App 20110023574 - Lu; Leo ;   et al. | 2011-02-03 |
Flash memory App 20110019457 - Chu; Kuei-Wu ;   et al. | 2011-01-27 |
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