MANIWA; Susumu

Patent Applications and Registrations

Patent applications and USPTO patent grants for MANIWA; Susumu.The latest application filed is for "glass core multilayer wiring board and method of producing the same".

Company Profile

1.15.13

MANIWA; Susumu - Tokyo JP
Maniwa; Susumu - Kasukabe JP
MANIWA; Susumu - Kasukabe-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Glass Core Multilayer Wiring Board And Method Of Producing The Same App 20220279651 - MANIWA; Susumu ; et al.	2022-09-01
Circuit board Grant 11,303,261 - Shirasaki , et al. April 12, 2	2022-04-12
Multilayer Circuit Board With Lc Resonant Circuit And Electronic Component Package Including Multilayer Circuit Board With Lc Resonant Circuit App 20220109416 - KANOU; Noriko ; et al.	2022-04-07
Circuit Board App 20210143787 - SHIRASAKI; Tomoyuki ; et al.	2021-05-13
Manufacturing method of lead frame substrate Grant 8,703,598 - Maniwa , et al. April 22, 2	2014-04-22
Manufacturing Method Of Lead Frame Substrate App 20140021162 - Maniwa; Susumu ; et al.	2014-01-23
Lead frame substrate and method of manufacturing the same, and semiconductor device Grant 8,558,363 - Tsukamoto , et al. October 15, 2	2013-10-15
Manufacturing method of lead frame substrate and semiconductor apparatus Grant 8,546,940 - Maniwa , et al. October 1, 2	2013-10-01
Method for manufacturing substrate for semiconductor element Grant 8,535,979 - Toda , et al. September 17, 2	2013-09-17
Method of manufacturing substrate for semiconductor element, and semiconductor device Grant 8,535,987 - Maniwa , et al. September 17, 2	2013-09-17
Method for manufacturing substrate for semiconductor element, and semiconductor device Grant 8,466,547 - Maniwa , et al. June 18, 2	2013-06-18
Method For Manufacturing Substrate For Semiconductor Element App 20130112652 - TODA; Junko ; et al.	2013-05-09
Lead frame substrate, manufacturing method thereof, and semiconductor apparatus Grant 8,390,105 - Toda , et al. March 5, 2	2013-03-05
Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device Grant 8,319,322 - Toda , et al. November 27, 2	2012-11-27
Lead frame substrate and method of manufacturing the same Grant 8,304,294 - Tsukamoto , et al. November 6, 2	2012-11-06
Method For Manufacturing Substrate For Semiconductor Element, And Semiconductor Device App 20120061829 - MANIWA; Susumu ; et al.	2012-03-15
Method For Manufacturing Substrate For Semiconductor Element, And Semiconductor Device App 20120061809 - TODA; Junko ; et al.	2012-03-15
Method For Manufacturing Substrate For Semiconductor Element, And Semiconductor Device App 20120018860 - MANIWA; Susumu ; et al.	2012-01-26
Substrate For Semiconductor Element, Method For Manufacturing Substrate For Semiconductor Element, And Semiconductor Device App 20120018867 - Toda; Junko ; et al.	2012-01-26
Lead frame substrate and method of manufacturing the same App 20110169153 - Tsukamoto; Takehito ; et al.	2011-07-14
Manufacturing Method Of Lead Frame Substrate And Semiconductor Apparatus App 20110169145 - Maniwa; Susumu ; et al.	2011-07-14
Lead Frame Substrate, Manufacturing Method Thereof, And Semiconductor Apparatus App 20110163433 - Toda; Junko ; et al.	2011-07-07
Lead frame substrate and method of manufacturing the same, and semiconductor device App 20110163435 - Tsukamoto; Takehito ; et al.	2011-07-07

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