| Patent | Date |
|---|
Interconnects having air gap spacers
Grant 11,430,690 - Cheng , et al. August 30, 2 | 2022-08-30 |
Pillar bump with noble metal seed layer for advanced heterogeneous integration
Grant 11,380,641 - Maniscalco , et al. July 5, 2 | 2022-07-05 |
Magneto-resistive Random Access Memory With Laterally-recessed Free Layer
App 20220190235 - van der Straten; Oscar ; et al. | 2022-06-16 |
Pillar Bump With Noble Metal Seed Layer For Advanced Heterogeneous Integration
App 20220139858 - Maniscalco; Joseph F. ; et al. | 2022-05-05 |
Fully-aligned top-via structures with top-via trim
Grant 11,282,768 - Cheng , et al. March 22, 2 | 2022-03-22 |
Encapsulated Top Via Interconnects
App 20220044967 - van der Straten; Oscar ; et al. | 2022-02-10 |
Dual Damascene Crossbar Array For Disabling A Defective Resistive Switching Device In The Array
App 20210375389 - Maniscalco; Joseph F. ; et al. | 2021-12-02 |
Interconnects with enlarged contact area
Grant 11,183,455 - Motoyama , et al. November 23, 2 | 2021-11-23 |
Encapsulated top via interconnects
Grant 11,177,171 - van der Straten , et al. November 16, 2 | 2021-11-16 |
Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap
Grant 11,158,538 - Maniscalco , et al. October 26, 2 | 2021-10-26 |
Interconnects With Enlarged Contact Area
App 20210327803 - Motoyama; Koichi ; et al. | 2021-10-21 |
Interconnect Structures With Cobalt-infused Ruthenium Liner And A Cobalt Cap
App 20210242082 - Maniscalco; Joseph F. ; et al. | 2021-08-05 |
Hybrid sidewall barrier facilitating low resistance interconnection
Grant 11,069,566 - van der Straten , et al. July 20, 2 | 2021-07-20 |
Fully-aligned Top-via Structures With Top-via Trim
App 20210143085 - Cheng; Kenneth C. K. ; et al. | 2021-05-13 |
Interconnects Having Air Gap Spacers
App 20210118722 - Cheng; Kenneth Chun Kuen ; et al. | 2021-04-22 |
Encapsulated Top Via Interconnects
App 20210098293 - van der Straten; Oscar ; et al. | 2021-04-01 |
Interconnects Having Air Gap Spacers
App 20210090938 - Cheng; Kenneth Chun Kuen ; et al. | 2021-03-25 |
Interconnects having air gap spacers
Grant 10,950,493 - Cheng , et al. March 16, 2 | 2021-03-16 |
Advanced interconnects containing an IMT liner
Grant 10,930,589 - Maniscalco , et al. February 23, 2 | 2021-02-23 |
Void-free metallic interconnect structures with self-formed diffusion barrier layers
Grant 10,903,116 - Maniscalco , et al. January 26, 2 | 2021-01-26 |
Low resistance metal-insulator-metal capacitor electrode
Grant 10,840,325 - Maniscalco , et al. November 17, 2 | 2020-11-17 |
Copper Metallization Fill
App 20200350201 - Motoyama; Koichi ; et al. | 2020-11-05 |
Back end of line metallization structures
Grant 10,741,748 - Maniscalco , et al. A | 2020-08-11 |
Back end of line metallization structures
Grant 10,686,126 - Maniscalco , et al. | 2020-06-16 |
Hybrid Sidewall Barrier Facilitating Low Resistance Interconnection
App 20200118870 - van der Straten; Oscar ; et al. | 2020-04-16 |
Back End Of Line Metallization Structures
App 20200083435 - Maniscalco; Joseph F. ; et al. | 2020-03-12 |
Low resistance interconnect structure with partial seed enhancement liner
Grant 10,546,815 - van der Straten , et al. Ja | 2020-01-28 |
Advanced Interconnects Containing An Imt Liner
App 20200027829 - Maniscalco; Joseph F. ; et al. | 2020-01-23 |
Void-free Metallic Interconnect Structures With Self-formed Diffusion Barrier Layers
App 20200020581 - Maniscalco; Joseph F. ; et al. | 2020-01-16 |
Void-free Metallic Interconnect Structures With Self-formed Diffusion Barrier Layers
App 20200020577 - Maniscalco; Joseph F. ; et al. | 2020-01-16 |
Void-free metallic interconnect structures with self-formed diffusion barrier layers
Grant 10,529,622 - Maniscalco , et al. J | 2020-01-07 |
Back End Of Line Metallization Structures
App 20190393409 - Maniscalco; Joseph F. ; et al. | 2019-12-26 |
Low Resistance Interconnect Structure With Partial Seed Enhancement Liner
App 20190371735 - van der Straten; Oscar ; et al. | 2019-12-05 |
Advanced interconnects containing an IMT liner
Grant 10,468,346 - Maniscalco , et al. No | 2019-11-05 |
Low Resistance Metal-insulator-metal Capacitor Electrode
App 20190319088 - Maniscalco; Joseph F. ; et al. | 2019-10-17 |
Advanced Interconnects Containing An Imt Liner
App 20190311985 - Maniscalco; Joseph F. ; et al. | 2019-10-10 |
Low resistance seed enhancement spacers for voidless interconnect structures
Grant 10,431,542 - Adusumilli , et al. O | 2019-10-01 |
Low Resistance Seed Enhancement Spacers For Voidless Interconnect Structures
App 20180233445 - Adusumilli; Praneet ; et al. | 2018-08-16 |
Low Resistance Seed Enhancement Spacers For Voidless Interconnect Structures
App 20180233444 - Adusumilli; Praneet ; et al. | 2018-08-16 |
Low resistance seed enhancement spacers for voidless interconnect structures
Grant 10,049,980 - Adusumilli , et al. August 14, 2 | 2018-08-14 |
Processing System For Combined Metal Deposition And Reflow Anneal For Forming Interconnect Structures
App 20140216342 - Yang; Chih-Chao ; et al. | 2014-08-07 |
Processing System For Combined Metal Deposition And Reflow Anneal For Forming Interconnect Structures
App 20140220777 - Yang; Chih-Chao ; et al. | 2014-08-07 |
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