Mangrum; Marc Alan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mangrum; Marc Alan.The latest application filed is for "flip chip self-alignment features for substrate and leadframe applications".

Company Profile

3.21.15

Mangrum; Marc Alan - Manchaca TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flip Chip Self-alignment Features For Substrate And Leadframe Applications App 20210265247 - Mangrum; Marc Alan	2021-08-26
Packaged Electronic Device Having Integrated Antenna And Locking Structure App 20210151854 - MANGRUM; Marc Alan ; et al.	2021-05-20
Packaged electronic device having integrated antenna and locking structure Grant 10,923,800 - Mangrum February 16, 2	2021-02-16
Embedded vibration management system having an array of vibration absorbing structures Grant 10,861,798 - Baloglu , et al. December 8, 2	2020-12-08
Flip chip self-alignment features for substrate and leadframe applications Grant 10,861,776 - Mangrum December 8, 2	2020-12-08
Packaged Electronic Device Having Integrated Antenna And Locking Structure App 20200153082 - MANGRUM; Marc Alan	2020-05-14
Packaged electronic device having integrated antenna and locking structure Grant 10,566,680 - Mangrum Feb	2020-02-18
Semiconductor package having inspection structure and related methods Grant 10,490,487 - Mangrum Nov	2019-11-26
Semiconductor Package Having Inspection Structure And Related Methods App 20190122964 - Mangrum; Marc Alan	2019-04-25
Semiconductor package having inspection structure and related methods Grant 10,211,128 - Mangrum Feb	2019-02-19
Flip Chip Self-alignment Features For Substrate And Leadframe Applications App 20190043789 - Mangrum; Marc Alan	2019-02-07
Embedded Vibration Management System App 20180374800 - Baloglu; Bora ; et al.	2018-12-27
Semiconductor Package Having Inspection Structure And Related Methods App 20180350726 - Mangrum; Marc Alan	2018-12-06
Embedded vibration management system Grant 10,032,726 - Baloglu , et al. July 24, 2	2018-07-24
Flip chip self-alignment features for substrate and leadframe applications Grant 10,032,699 - Mangrum July 24, 2	2018-07-24
Packaged Electronic Device Having Integrated Antenna And Locking Structure App 20180191055 - MANGRUM; Marc Alan	2018-07-05
Packaged electronic device having integrated antenna and locking structure Grant 9,966,652 - Mangrum , et al. May 8, 2	2018-05-08
Method of forming a semiconductor package with conductive interconnect frame and structure Grant 9,917,039 - Mangrum , et al. March 13, 2	2018-03-13
Semiconductor package with clip alignment notch Grant 9,870,985 - Mangrum January 16, 2	2018-01-16
Semiconductor Package With Clip Alignment Notch App 20180012829 - Mangrum; Marc Alan	2018-01-11
Method Of Forming A Semiconductor Package With Conductive Interconnect Frame And Structure App 20170309554 - Mangrum; Marc Alan ; et al.	2017-10-26
Packaged Electronic Device Having Integrated Antenna And Locking Structure App 20170125881 - Mangrum; Marc Alan ; et al.	2017-05-04
Shielding technique for semiconductor package including metal lid Grant 9,362,209 - Mangrum June 7, 2	2016-06-07
Shielding technique for semiconductor package including metal lid and metalized contact area Grant 9,153,543 - Mangrum , et al. October 6, 2	2015-10-06
IC package with integrated electrostatic discharge protection Grant 8,633,575 - Mangrum January 21, 2	2014-01-21
Circuit device with at least partial packaging and method for forming Grant 8,072,062 - Leal , et al. December 6, 2	2011-12-06
Circuit Device With At Least Partial Packaging And Method For Forming App 20080142960 - Leal; George R. ; et al.	2008-06-19
Circuit device with at least partial packaging and method for forming Grant 7,361,987 - Leal , et al. April 22, 2	2008-04-22
Circuit device with at least partial packaging and method for forming App 20060012036 - Leal; George R. ; et al.	2006-01-19
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane Grant 6,921,975 - Leal , et al. July 26, 2	2005-07-26
Circuit device with at least partial packaging and method for forming Grant 6,838,776 - Leal , et al. January 4, 2	2005-01-04
Circuit device with at least partial packaging and method for forming App 20040207068 - Leal, George R. ; et al.	2004-10-21
Circuit device with at least partial packaging and method for forming App 20040207077 - Leal, George R. ; et al.	2004-10-21

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