| Patent | Date |
|---|
Dielectric-to-metal Adhesion Promotion Material
App 20220293509 - Manepalli; Rahul ; et al. | 2022-09-15 |
Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures
Grant 11,445,616 - Nad , et al. September 13, 2 | 2022-09-13 |
Hybrid Fan-out Architecture With Emib And Glass Core For Heterogeneous Die Integration Applications
App 20220254721 - PIETAMBARAM; Srinivas ; et al. | 2022-08-11 |
Chiplet First Architecture For Die Tiling Applications
App 20220238458 - PIETAMBARAM; Srinivas ; et al. | 2022-07-28 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications
Grant 11,355,438 - Pietambaram , et al. June 7, 2 | 2022-06-07 |
Chiplet First Architecture For Die Tiling Applications
App 20220115334 - PIETAMBARAM; Srinivas ; et al. | 2022-04-14 |
Electroless Plating Process
App 20220010452 - NAIR; Chandrasekharan ; et al. | 2022-01-13 |
Package architecture with improved via drill process and method for forming such package
Grant 11,177,234 - Nad , et al. November 16, 2 | 2021-11-16 |
Copperless Regions To Control Plating Growth
App 20210082852 - MARIN; Bradon C. ; et al. | 2021-03-18 |
Glass Core Patch With In Situ Fabricated Fan-out Layer To Enable Die Tiling Applications
App 20210028080 - PIETAMBARAM; Srinivas ; et al. | 2021-01-28 |
Nested Interposer Package For Ic Chips
App 20210005542 - MALLIK; Debendra ; et al. | 2021-01-07 |
Multi-package Assemblies Having Foam Structures For Warpage Control
App 20200402920 - Yu; Mufei ; et al. | 2020-12-24 |
Hybrid Fine Line Spacing Architecture For Bump Pitch Scaling
App 20200312665 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Copper Interface Features For High Speed Interconnect Applications
App 20200315023 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Patternable Die Attach Materials And Processes For Patterning
App 20200312771 - NIE; Bai ; et al. | 2020-10-01 |
Controlled Organic Layers To Enhance Adhesion To Organic Dielectrics And Process For Forming Such
App 20200312768 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Novel Customizable Release Layers To Enable Low Warpage Architectures For Advanced Packaging Applications
App 20200312698 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Chiplet First Architecture For Die Tiling Applications
App 20200258847 - A1 | 2020-08-13 |
Selective Metal Deposition By Patterning Direct Electroless Metal Plating
App 20200251332 - Kind Code | 2020-08-06 |
Hybrid Fan-out Architecture With Emib And Glass Core For Heterogeneous Die Integration Applications
App 20200006232 - PIETAMBARAM; Srinivas ; et al. | 2020-01-02 |
Package Architecture With Improved Via Drill Process And Method For Forming Such Package
App 20190393183 - NAD; Suddhasattwa ; et al. | 2019-12-26 |
Interfacial Layer For High Resolution Lithography (hrl) And High Speed Input/output (io Or I/o) Architectures
App 20190320537 - NAD; Suddhasattwa ; et al. | 2019-10-17 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,569,108 - Xu , et al. October 29, 2 | 2013-10-29 |
Flip chip package containing novel underfill materials
Grant 8,377,550 - Swaminathan , et al. February 19, 2 | 2013-02-19 |
Coating For A Microelectronic Device, Treatment Comprising Same,and Method Of Managing A Thermal Profile Of A Microelectronic Die
App 20130017650 - Xu; Dingying ; et al. | 2013-01-17 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,287,996 - Xu , et al. October 16, 2 | 2012-10-16 |
Flip chip package containing novel underfill materials
App 20110159228 - Swaminathan; Rajasekaran ; et al. | 2011-06-30 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
App 20110151624 - Xu; Dingying ; et al. | 2011-06-23 |
Low stress stacked die packages
App 20070152314 - Manepalli; Rahul ; et al. | 2007-07-05 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material
Grant 7,202,304 - Jayaraman , et al. April 10, 2 | 2007-04-10 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material
App 20060154080 - Jayaraman; Saikumar ; et al. | 2006-07-13 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material
Grant 7,041,736 - Jayaraman , et al. May 9, 2 | 2006-05-09 |
Surface treatment for microelectronic device substrate
Grant 6,794,225 - Manepalli , et al. September 21, 2 | 2004-09-21 |
Surface treatment for microelectronic device substrate
App 20040121512 - Manepalli, Rahul ; et al. | 2004-06-24 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material
App 20040106770 - Jayaraman, Saikumar ; et al. | 2004-06-03 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material
Grant 6,620,512 - Jayaraman , et al. September 16, 2 | 2003-09-16 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material
App 20030118835 - Jayaraman, Saikumar ; et al. | 2003-06-26 |
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