Mandel; Larry M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mandel; Larry M..The latest application filed is for "interlocking overmold for electronic assembly".
- Mandel; Larry M. - Noblesville IN
- Mandel; Larry M - Noblesville IN
- Mandel; Larry M - Nobelsville IN
| Patent | Date |
|---|---|
| Wrap-around overmold for electronic assembly Grant 7,616,448 - Degenkolb , et al. November 10, 2 | 2009-11-10 |
| Interlocking overmold for electronic assembly App 20090197478 - Mandel; Larry M. ; et al. | 2009-08-06 |
| Wrap-around overmold for electronic assembly App 20090073663 - Degenkolb; Thomas A. ; et al. | 2009-03-19 |
| Overmolded electronic assembly Grant 7,462,077 - Chow , et al. December 9, 2 | 2008-12-09 |
| Overmolded electronic assembly with metal seal ring Grant 7,455,552 - Fang , et al. November 25, 2 | 2008-11-25 |
| Electronic assembly having a substrate laminated within a backplate cavity Grant 7,416,011 - Mandel , et al. August 26, 2 | 2008-08-26 |
| Overmolded electronic assembly App 20080124987 - Chow; Kin Yean ; et al. | 2008-05-29 |
| Flip chip heat sink package and method Grant 7,352,585 - Mandel , et al. April 1, 2 | 2008-04-01 |
| Overmolded electronic assembly with insert molded heat sinks Grant 7,230,829 - Mandel , et al. June 12, 2 | 2007-06-12 |
| Flip chip heat sink package and method App 20070064399 - Mandel; Larry M. ; et al. | 2007-03-22 |
| Flip chip heat sink package and method Grant 7,180,745 - Mandel , et al. February 20, 2 | 2007-02-20 |
| Overmolded electronic assembly with insert molded heat sinks App 20060171120 - Mandel; Larry M. ; et al. | 2006-08-03 |
| Electronic assembly having a substrate laminated within a backplate cavity App 20060164818 - Mandel; Larry M. ; et al. | 2006-07-27 |
| Circuit board surface mount package App 20050173152 - Post, Scott E. ; et al. | 2005-08-11 |
| Technique for connector to printed circuit board decoupling to eliminate flexure Grant 6,905,349 - Brandenburg , et al. June 14, 2 | 2005-06-14 |
| Flip chip heat sink package and method App 20050078456 - Mandel, Larry M. ; et al. | 2005-04-14 |
| Semiconductor device heat sink package and method App 20050077614 - Chengalva, Suresh K. ; et al. | 2005-04-14 |
| Electronic assembly for removing heat from a flip chip Grant 6,700,195 - Mandel March 2, 2 | 2004-03-02 |
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