| Patent | Date |
|---|
Molded Packaging For Wide Band Gap Semiconductor Devices
App 20220238421 - QUINONES; Maria Clemens Ypil ; et al. | 2022-07-28 |
Concealed Gate Terminal Semiconductor Packages And Related Methods
App 20220102248 - ALMAGRO; Erwin Ian Vamenta ; et al. | 2022-03-31 |
Semiconductor Device Package With Clip Interconnect And Dual Side Cooling
App 20210351099 - ESTACIO; Maria Cristina ; et al. | 2021-11-11 |
Semiconductor device package with clip interconnect and dual side cooling
Grant 11,088,046 - Estacio , et al. August 10, 2 | 2021-08-10 |
Semiconductor Device Package With Clip Interconnect And Dual Side Cooling
App 20190393119 - ESTACIO; Maria Cristina ; et al. | 2019-12-26 |
Wireless module with active devices
Grant 9,698,143 - Flores , et al. July 4, 2 | 2017-07-04 |
Wireless Module With Active Devices
App 20140071650 - Flores; Allan Tungul ; et al. | 2014-03-13 |
Wireless Module With Active And Passive Components
App 20140070329 - Flores; Allan Tungul ; et al. | 2014-03-13 |
Methods and Designs for Localized Wafer Thinning
App 20120168947 - Kim; Suku ; et al. | 2012-07-05 |
Methods and designs for localized wafer thinning
Grant 8,158,506 - Kim , et al. April 17, 2 | 2012-04-17 |
Package Assembly For Semiconductor Devices
App 20110244633 - Madrid; Ruben P. ; et al. | 2011-10-06 |
Robust leaded molded packages and methods for forming the same
Grant 7,906,837 - Cabahug , et al. March 15, 2 | 2011-03-15 |
Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
Grant 7,816,784 - Son , et al. October 19, 2 | 2010-10-19 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
Grant 7,816,178 - Madrid , et al. October 19, 2 | 2010-10-19 |
Package Assembly For Semiconductor Devices
App 20100164078 - Madrid; Ruben ; et al. | 2010-07-01 |
Power Quad Flat No-lead Semiconductor Die Packages With Isolated Heat Sink For High-voltage, High-power Applications, Systems Using The Same, And Methods Of Making The Same
App 20100148328 - Son; Joon-Seo ; et al. | 2010-06-17 |
Methods And Designs For Localized Wafer Thinning
App 20090273082 - Kim; Suku ; et al. | 2009-11-05 |
Packaged Semiconductor Device With Dual Exposed Surfaces And Method Of Manufacturing
App 20090269885 - Madrid; Ruben P. ; et al. | 2009-10-29 |
Robust Leaded Molded Packages And Methods For Forming The Same
App 20090236714 - Cabahug; Elsie Agdon ; et al. | 2009-09-24 |
Alternative flip chip in leaded molded package design and method for manufacture
Grant 7,586,178 - Manatad September 8, 2 | 2009-09-08 |
Flip chip in leaded molded package and method of manufacture thereof
Grant 7,582,956 - Joshi , et al. September 1, 2 | 2009-09-01 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
Grant 7,576,429 - Madrid , et al. August 18, 2 | 2009-08-18 |
Robust leaded molded packages and methods for forming the same
Grant 7,560,311 - Cabahug , et al. July 14, 2 | 2009-07-14 |
Flip Chip In Leaded Molded Package And Method Of Manufacture Thereof
App 20080036056 - Joshi; Rajeev ; et al. | 2008-02-14 |
Alternative Flip Chip In Leaded Molded Package Design And Method For Manufacture
App 20070241431 - Manatad; Romel N. | 2007-10-18 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
App 20070161151 - Madrid; Ruben P. ; et al. | 2007-07-12 |
Alternative flip chip in leaded molded package design and method for manufacture
Grant 7,217,594 - Manatad May 15, 2 | 2007-05-15 |
Flip chip in leaded molded package and method of manufacture thereof
Grant 7,215,011 - Joshi , et al. May 8, 2 | 2007-05-08 |
Flip chip in leaded molded package and method of manufacture thereof
Grant 7,154,168 - Joshi , et al. December 26, 2 | 2006-12-26 |
Robust leaded molded packages and methods for forming the same
App 20060231933 - Cabahug; Elsie Agdon ; et al. | 2006-10-19 |
Robust leaded molded packages and methods for forming the same
Grant 7,122,884 - Cabahug , et al. October 17, 2 | 2006-10-17 |
Flip chip in leaded molded package and method of manufacture thereof
App 20050280126 - Joshi, Rajeev ; et al. | 2005-12-22 |
Method for maintaining solder thickness in flipchip attach packaging processes
App 20050224940 - Tangpuz, Consuelo N. ; et al. | 2005-10-13 |
Flip chip in leaded molded package and method of manufacture thereof
Grant 6,949,410 - Joshi , et al. September 27, 2 | 2005-09-27 |
Method for maintaining solder thickness in flipchip attach packaging processes
Grant 6,943,434 - Tangpuz , et al. September 13, 2 | 2005-09-13 |
Filp chip in leaded molded package and method of manufacture thereof
App 20050167848 - Joshi, Rajeev ; et al. | 2005-08-04 |
Alternative flip chip in leaded molded package design and method for manufacture
App 20040157372 - Manatad, Romel N. | 2004-08-12 |
Method for maintaining solder thickness in flipchip attach packaging processes
App 20040130009 - Tangpuz, Consuelo N. ; et al. | 2004-07-08 |
Flip chip in leaded molded package and method of manufacture thereof
Grant 6,720,642 - Joshi , et al. April 13, 2 | 2004-04-13 |
Flip chip in leaded molded package and method of manufacture thereof
App 20040056364 - Joshi, Rajeev ; et al. | 2004-03-25 |
Robust leaded molded packages and methods for forming the same
App 20030193080 - Cabahug, Elsie Agdon ; et al. | 2003-10-16 |
| 