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Patent applications and USPTO patent grants for MANATAD; Romel.The latest application filed is for "vertical and horizontal circuit assemblies".
Patent | Date |
---|---|
Vertical And Horizontal Circuit Assemblies App 20220059443 - TEYSSEYRE; Jerome ;   et al. | 2022-02-24 |
Vertical and horizontal circuit assemblies Grant 11,177,203 - Teysseyre , et al. November 16, 2 | 2021-11-16 |
Vertical And Horizontal Circuit Assemblies App 20190181083 - TEYSSEYRE; Jerome ;   et al. | 2019-06-13 |
Vertical and horizontal circuit assemblies Grant 10,256,178 - Teysseyre , et al. | 2019-04-09 |
Vertical And Horizontal Circuit Assemblies App 20180068935 - TEYSSEYRE; Jerome ;   et al. | 2018-03-08 |
Methods and designs for localized wafer thinning Grant 8,624,393 - Kim , et al. January 7, 2 | 2014-01-07 |
Method to manufacture a universal footprint for a package with exposed chip Grant 7,256,479 - Noquil , et al. August 14, 2 | 2007-08-14 |
Method to manufacture a universal footprint for a package with exposed chip App 20060151861 - Noquil; Jonathan A. ;   et al. | 2006-07-13 |
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