loadpatents
name:-0.041807889938354
name:-0.035719156265259
name:-0.0004420280456543
Mamitsu; Kuniaki Patent Filings

Mamitsu; Kuniaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mamitsu; Kuniaki.The latest application filed is for "semiconductor device including cooler".

Company Profile
0.35.32
  • Mamitsu; Kuniaki - Okazaki JP
  • Mamitsu; Kuniaki - Nukata-gun JP
  • MAMITSU; Kuniaki - Okazaki-city JP
  • MAMITSU; Kuniaki - Okazaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant 10,079,226 - Mamitsu , et al. September 18, 2
2018-09-18
Semiconductor device including cooler
Grant 9,070,666 - Mamitsu , et al. June 30, 2
2015-06-30
Semiconductor device with surface electrodes
Grant 8,963,315 - Fukuoka , et al. February 24, 2
2015-02-24
Semiconductor device including cooler
Grant 8,957,517 - Mamitsu , et al. February 17, 2
2015-02-17
Semiconductor Device Including Cooler
App 20140361425 - MAMITSU; Kuniaki ;   et al.
2014-12-11
Semiconductor device including cooler
Grant 8,884,426 - Mamitsu , et al. November 11, 2
2014-11-11
Semiconductor Device Including Cooler
App 20140203426 - MAMITSU; Kuniaki ;   et al.
2014-07-24
Semiconductor Device Including Cooler
App 20140015120 - MAMITSU; Kuniaki ;   et al.
2014-01-16
Semiconductor package cooled by grounded cooler
Grant 8,558,375 - Mamitsu , et al. October 15, 2
2013-10-15
Fixing structure and fixing method of circuit board with embedded electronic parts to cooler
Grant 8,547,697 - Fukutani , et al. October 1, 2
2013-10-01
Semiconductor module and method of manufacturing the same
Grant 8,497,572 - Fukutani , et al. July 30, 2
2013-07-30
Semiconductor device having semiconductor chip and metal plate
Grant 8,441,122 - Fukuoka , et al. May 14, 2
2013-05-14
Semiconductor apparatus having a two-side heat radiation structure
Grant 8,278,747 - Mamitsu , et al. October 2, 2
2012-10-02
Semiconductor Device
App 20120119347 - MAMITSU; Kuniaki ;   et al.
2012-05-17
Semiconductor device
Grant 8,125,781 - Mamitsu , et al. February 28, 2
2012-02-28
Semiconductor Module And Method Of Manufacturing The Same
App 20120001308 - Fukutani; Keita ;   et al.
2012-01-05
Semiconductor Device
App 20120001318 - MAMITSU; Kuniaki ;   et al.
2012-01-05
Fixing Structure And Fixing Method Of Circuit Board With Embedded Electronic Parts To Cooler
App 20110317366 - FUKUTANI; Keita ;   et al.
2011-12-29
Semiconductor Device And Method Of Manufacturing The Same
App 20110186981 - Fukuoka; Daisuke ;   et al.
2011-08-04
Semiconductor module
Grant 7,957,135 - Ohkouchi , et al. June 7, 2
2011-06-07
Semiconductor module molded by resin with heat radiation plate opened outside from mold
Grant 7,944,045 - Noritake , et al. May 17, 2
2011-05-17
Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same
App 20110042741 - Fukuoka; Daisuke ;   et al.
2011-02-24
Resin mold type semiconductor device
Grant 7,728,413 - Iwade , et al. June 1, 2
2010-06-01
Semiconductor apparatus having both-side heat radiation structure and method for manufacturing the same
App 20090289351 - Mamitsu; Kuniaki ;   et al.
2009-11-26
Semiconductor Module And Method Of Manufacturing The Same
App 20090224398 - NORITAKE; Chikage ;   et al.
2009-09-10
Semiconductor Module
App 20090201708 - OHKOUCHI; Yasuyuki ;   et al.
2009-08-13
Power semiconductor device
Grant 7,573,687 - Mamitsu August 11, 2
2009-08-11
Semiconductor device
Grant 7,470,939 - Mochida , et al. December 30, 2
2008-12-30
Power semiconductor device
App 20080117557 - Mamitsu; Kuniaki
2008-05-22
Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same
Grant 7,345,369 - Hirasawa , et al. March 18, 2
2008-03-18
Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same
App 20070236891 - Mamitsu; Kuniaki
2007-10-11
Semiconductor device having heat radiation plate and bonding member
Grant 7,239,016 - Hirano , et al. July 3, 2
2007-07-03
Semiconductor device having metallic plate with groove
Grant 7,235,876 - Okumura , et al. June 26, 2
2007-06-26
Semiconductor device having metallic plate with groove
App 20070057373 - Okumura; Tomomi ;   et al.
2007-03-15
Resin mold type semiconductor device
App 20070052072 - Iwade; Tomoo ;   et al.
2007-03-08
Semiconductor device
App 20070018197 - Mochida; Akira ;   et al.
2007-01-25
Transfer-molded power device and method for manufacturing transfer-molded power device
Grant 7,145,254 - Hirano , et al. December 5, 2
2006-12-05
Semiconductor device
Grant 7,091,603 - Mamitsu , et al. August 15, 2
2006-08-15
Semiconductor device
App 20060096299 - Mamitsu; Kuniaki ;   et al.
2006-05-11
Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same
App 20060087043 - Hirasawa; Naoki ;   et al.
2006-04-27
Semiconductor device having radiation structure
Grant 6,992,383 - Mamitsu , et al. January 31, 2
2006-01-31
Semiconductor device having radiation structure
Grant 6,967,404 - Mamitsu , et al. November 22, 2
2005-11-22
Semiconductor device having radiation structure
Grant 6,960,825 - Mamitsu , et al. November 1, 2
2005-11-01
Semiconductor device
App 20050167802 - Hirano, Naohiko ;   et al.
2005-08-04
Semiconductor Device Having Radiation Structure
App 20050167821 - Mamitsu, Kuniaki ;   et al.
2005-08-04
Semiconductor device
App 20050145999 - Mamitsu, Kuniaki ;   et al.
2005-07-07
Semiconductor device having radiation structure
Grant 6,891,265 - Mamitsu , et al. May 10, 2
2005-05-10
Semiconductor device having heat radiation plate and bonding member
App 20050077617 - Hirano, Naohiko ;   et al.
2005-04-14
Semiconductor device having a protective film
Grant 6,803,667 - Okura , et al. October 12, 2
2004-10-12
Semiconductor device having radiation structure
Grant 6,798,062 - Mamitsu , et al. September 28, 2
2004-09-28
Semiconductor device having radiation structure
App 20040097082 - Mamitsu, Kuniaki ;   et al.
2004-05-20
Semiconductor device having radiation structure
App 20040089942 - Mamitsu, Kuniaki ;   et al.
2004-05-13
Semiconductor device having radiation structure
App 20040089940 - Mamitsu, Kuniaki ;   et al.
2004-05-13
Semiconductor device having radiation structure
App 20040089941 - Mamitsu, Kuniaki ;   et al.
2004-05-13
Semiconductor device having radiation structure
App 20040070072 - Mamitsu, Kuniaki ;   et al.
2004-04-15
Semiconductor device having radiation structure
App 20040070060 - Mamitsu, Kuniaki ;   et al.
2004-04-15
Semiconductor device having radiation structure
Grant 6,703,707 - Mamitsu , et al. March 9, 2
2004-03-09
Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
Grant 6,693,350 - Teshima , et al. February 17, 2
2004-02-17
Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
App 20030132530 - Teshima, Takanori ;   et al.
2003-07-17
Semiconductor device
App 20030052400 - Okura, Yasushi ;   et al.
2003-03-20
Transfer-molded power device and method for manufacturing transfer-molded power device
App 20030022464 - Hirano, Naohiko ;   et al.
2003-01-30

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