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Patent applications and USPTO patent grants for Maloney; John Jay.The latest application filed is for "heatplates for heatsink attachment for semiconductor chips".
Patent | Date |
---|---|
Heatplates for heatsink attachment for semiconductor chips Grant 7,834,444 - Awad , et al. November 16, 2 | 2010-11-16 |
Heatplates For Heatsink Attachment For Semiconductor Chips App 20090200660 - Awad; Elie ;   et al. | 2009-08-13 |
Heatplates for heatsink attachment for semiconductor chips Grant 7,498,673 - Awad , et al. March 3, 2 | 2009-03-03 |
Heatplates for heatsink attachment for semiconductor chips App 20080116570 - Awad; Elie ;   et al. | 2008-05-22 |
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