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Patent applications and USPTO patent grants for Maloney; Gerard S..The latest application filed is for "apparatus and method for chemical-mechanical polishing (cmp) head having direct pneumatic wafer polishing pressure".
Patent | Date |
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Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure Grant 7,311,586 - Maloney , et al. December 25, 2 | 2007-12-25 |
Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure App 20060128277 - Maloney; Gerard S. ;   et al. | 2006-06-15 |
Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring Grant 7,044,838 - Maloney , et al. May 16, 2 | 2006-05-16 |
Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure Grant 7,029,382 - Maloney , et al. April 18, 2 | 2006-04-18 |
Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure App 20020077045 - Maloney, Gerard S. ;   et al. | 2002-06-20 |
Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring Grant 6,231,428 - Maloney , et al. May 15, 2 | 2001-05-15 |
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