MALOLEPSZY; Sean Michael
Patent Applications and Registrations
Patent applications and USPTO patent grants for MALOLEPSZY; Sean Michael.The latest application filed is for "dual capillary ic wirebonding".
- MALOLEPSZY; Sean Michael - Sherman TX
| Patent | Date |
|---|---|
| Dual Capillary IC Wirebonding App 20110272449 - PIRKLE; Rex Warren ; et al. | 2011-11-10 |
| Dual capillary IC wirebonding Grant 8,008,183 - Pirkle , et al. August 30, 2 | 2011-08-30 |
| Output impedance compensation for linear voltage regulators Grant 7,675,272 - Michallick , et al. March 9, 2 | 2010-03-09 |
| Dual Capillary IC Wirebonding App 20090091006 - Pirkle; Rex Warren ; et al. | 2009-04-09 |
| Output impedance compensation for linear voltage regulators App 20090039847 - Michallick; Ronald Andrew ; et al. | 2009-02-12 |
| Bond Surface Conditioning System for Improved Bondability App 20070094867 - Malolepszy; Sean Michael ; et al. | 2007-05-03 |
| Wirebonder to bond an IC chip to a substrate Grant 7,152,308 - Malolepszy , et al. December 26, 2 | 2006-12-26 |
| Bond surface conditioning system for improved bondability App 20040093725 - Malolepszy, Sean Michael ; et al. | 2004-05-20 |
| Bond surface conditioning system for improved bondability Grant 6,602,726 - Malolepszy , et al. August 5, 2 | 2003-08-05 |
| Bond Surface Conditioning System For Improved Bondability App 20030143778 - Malolepszy, Sean Michael ; et al. | 2003-07-31 |
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