| Patent | Date |
|---|
Nested Interposer With Through-silicon Via Bridge Die
App 20220278032 - PIETAMBARAM; Srinivas V. ; et al. | 2022-09-01 |
Ultra-thin, hyper-density semiconductor packages
Grant 11,430,724 - Mallik , et al. August 30, 2 | 2022-08-30 |
Semiconductor package having passive support wafer
Grant 11,417,630 - Mallik , et al. August 16, 2 | 2022-08-16 |
Stacked Die Cavity Package
App 20220238402 - MODI; Mitul ; et al. | 2022-07-28 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20220230958 - SIR; Jiun Hann ; et al. | 2022-07-21 |
Low Cost Package Warpage Solution
App 20220230892 - KARHADE; Omkar G. ; et al. | 2022-07-21 |
Interposer package-on-package (PoP) with solder array thermal contacts
Grant 11,387,175 - Mallik , et al. July 12, 2 | 2022-07-12 |
Micro Socket Electrical Couplings For Dies
App 20220200183 - NEKKANTY; Srikant ; et al. | 2022-06-23 |
High Bandwidth Optical Interconnection Architectures
App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
Low cost package warpage solution
Grant 11,328,937 - Karhade , et al. May 10, 2 | 2022-05-10 |
Stacked die cavity package
Grant 11,328,968 - Modi , et al. May 10, 2 | 2022-05-10 |
Scalable High-performance Package Architecture Using Processor-memory-photonics Modules
App 20220115362 - MALLIK; Debendra ; et al. | 2022-04-14 |
Inorganic-based Embedded-die Layers For Modular Semiconductive Devices
App 20220028788 - PIETAMBARAM; Srinivas V. ; et al. | 2022-01-27 |
High Speed Memory System Integration
App 20210391301 - TOMISHIMA; Shigeki ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391268 - Karhade; Omkar G. ; et al. | 2021-12-16 |
Electronic Package With Stud Bump Electrical Connections
App 20210366862 - Li; Zhaozhi ; et al. | 2021-11-25 |
Inorganic-based embedded-die layers for modular semiconductive devices
Grant 11,164,818 - Pietambaram , et al. November 2, 2 | 2021-11-02 |
Ic Die With Solderable Thermal Interface Structures For Assemblies Including Solder Array Thermal Interconnects
App 20210305119 - Mallik; Debendra ; et al. | 2021-09-30 |
Ic Die And Heat Spreaders With Solderable Thermal Interface Structures For Multi-chip Assemblies Including Solder Array Thermal Interconnects
App 20210305120 - Mallik; Debendra ; et al. | 2021-09-30 |
Ic Die And Heat Spreaders With Solderable Thermal Interface Structures For Assemblies Including Solder Array Thermal Interconnects
App 20210305121 - Mallik; Debendra ; et al. | 2021-09-30 |
Electronic package with stud bump electrical connections
Grant 11,127,706 - Li , et al. September 21, 2 | 2021-09-21 |
Microelectronic Package With Substrate Cavity For Bridge-attach
App 20210272905 - Karhade; Omkar G. ; et al. | 2021-09-02 |
Ic Package Including Multi-chip Unit With Bonded Integrated Heat Spreader
App 20210242104 - Mallik; Debendra ; et al. | 2021-08-05 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20210202380 - SIR; Jiun Hann ; et al. | 2021-07-01 |
IC package including multi-chip unit with bonded integrated heat spreader
Grant 11,011,448 - Mallik , et al. May 18, 2 | 2021-05-18 |
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
Grant 10,998,262 - Sir , et al. May 4, 2 | 2021-05-04 |
Semiconductor Package Having Wafer-level Active Die And External Die Mount
App 20210082826 - MEHTA; Vipul Vijay ; et al. | 2021-03-18 |
Ultrathin Bridge And Multi-die Ultrafine Pitch Patch Architecture And Method Of Making
App 20210043570 - GANESAN; Sanka ; et al. | 2021-02-11 |
Ic Package Including Multi-chip Unit With Bonded Integrated Heat Spreader
App 20210035881 - Mallik; Debendra ; et al. | 2021-02-04 |
Multi-die Ultrafine Pitch Patch Architecture And Method Of Making
App 20210035911 - GANESAN; Sanka ; et al. | 2021-02-04 |
Semiconductor package having wafer-level active die and external die mount
Grant 10,910,317 - Mehta , et al. February 2, 2 | 2021-02-02 |
Glass Core Patch With In Situ Fabricated Fan-out Layer To Enable Die Tiling Applications
App 20210028080 - PIETAMBARAM; Srinivas ; et al. | 2021-01-28 |
Package On Active Silicon Semiconductor Packages
App 20210013188 - Gomes; Wilfred ; et al. | 2021-01-14 |
Nested Interposer Package For Ic Chips
App 20210005542 - MALLIK; Debendra ; et al. | 2021-01-07 |
Microelectronic Package With Solder Array Thermal Interface Material (sa-tim)
App 20200411464 - Mallik; Debendra ; et al. | 2020-12-31 |
Substrateless Double-sided Embedded Multi-die Interconnect Bridge
App 20200395300 - Xie; Biancun ; et al. | 2020-12-17 |
Heterogeneous Nested Interposer Package For Ic Chips
App 20200395313 - MALLIK; Debendra ; et al. | 2020-12-17 |
Localized High Density Substrate Routing
App 20200395297 - STARKSTON; Robert ; et al. | 2020-12-17 |
Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
Grant 10,847,467 - Collins , et al. November 24, 2 | 2020-11-24 |
Low Cost Package Warpage Solution
App 20200350181 - KARHADE; Omkar G. ; et al. | 2020-11-05 |
Coreless Architecture And Processing Strategy For Emib-based Substrates With High Accuracy And High Density
App 20200335443 - SUN ZHOU; Xiao Di ; et al. | 2020-10-22 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20200328151 - Sir; Jiun Hann ; et al. | 2020-10-15 |
Localized high density substrate routing
Grant 10,796,988 - Starkston , et al. October 6, 2 | 2020-10-06 |
Inorganic-based Embedded-die Layers For Modular Semiconductive Devices
App 20200312767 - Pietambaram; Srinivas V. ; et al. | 2020-10-01 |
Nested Architectures For Enhanced Heterogeneous Integration
App 20200286814 - MAHAJAN; Ravindranath ; et al. | 2020-09-10 |
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction
App 20200273768 - Karhade; Omkar ; et al. | 2020-08-27 |
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite
App 20200273811 - Mallik; Debendra ; et al. | 2020-08-27 |
Ultra-thin, Hyper-density Semiconductor Packages
App 20200273784 - MALLIK; Debendra ; et al. | 2020-08-27 |
Low cost package warpage solution
Grant 10,741,419 - Karhade , et al. A | 2020-08-11 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200227332 - Singh; Kumar Abhishek ; et al. | 2020-07-16 |
Interconnect Architecture With Silicon Interposer And Emib
App 20200211969 - HOSSAIN; MD Altaf ; et al. | 2020-07-02 |
Antenna Boards And Communication Devices
App 20200203839 - Karhade; Omkar G. ; et al. | 2020-06-25 |
Stacked Die Cavity Package
App 20200185289 - MODI; Mitul ; et al. | 2020-06-11 |
Edge-firing antenna walls built into substrate
Grant 10,658,765 - Chavali , et al. | 2020-05-19 |
Through-mold structures
Grant 10,636,716 - Oster , et al. | 2020-04-28 |
Electronic Package With Stud Bump Electrical Connections
App 20200105701 - Li; Zhaozhi ; et al. | 2020-04-02 |
Stacked Wire-bond Dice Attached By Pillars Or Bumps Above A Flip-chip Die On A Semiconductor Package Substrate
App 20200098727 - Mallik; Debendra ; et al. | 2020-03-26 |
Electronic Package Assembly With Stiffener
App 20200083180 - MALLIK; Debendra ; et al. | 2020-03-12 |
Interposer Package-on-package (pop) With Solder Array Thermal Contacts
App 20200051899 - MALLIK; Debendra ; et al. | 2020-02-13 |
Fine Pitch Z Connections For Flip Chip Memory Architectures With Interposer
App 20200051956 - KARHADE; Omkar ; et al. | 2020-02-13 |
Power-delivery Methods For Embedded Multi-die Interconnect Bridges And Methods Of Assembling Same
App 20200051916 - COLLINS; Andrew ; et al. | 2020-02-13 |
Edge-firing Antenna Walls Built Into Substrate
App 20200006866 - Chavali; Sri Chaitra Jyotsna ; et al. | 2020-01-02 |
Integrated circuit package substrate
Grant 10,522,455 - Manusharow , et al. Dec | 2019-12-31 |
Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
Grant 10,490,503 - Collins , et al. Nov | 2019-11-26 |
Low Cost Package Warpage Solution
App 20190341271 - KARHADE; Omkar G. ; et al. | 2019-11-07 |
Stacking Multiple Dies Having Dissimilar Interconnect Structure Layout And Pitch
App 20190311983 - Raorane; Digvijay A. ; et al. | 2019-10-10 |
Power-delivery Methods For Embedded Multi-die Interconnect Bridges And Methods Of Assembling Same
App 20190304911 - Collins; Andrew ; et al. | 2019-10-03 |
Semiconductor Package Having Passive Support Wafer
App 20190287942 - MALLIK; Debendra ; et al. | 2019-09-19 |
Semiconductor Package Having Wafer-level Active Die And External Die Mount
App 20190279938 - MEHTA; Vipul Vijay ; et al. | 2019-09-12 |
Low cost package warpage solution
Grant 10,403,512 - Karhade , et al. Sep | 2019-09-03 |
Localized high density substrate routing
Grant 10,366,951 - Starkston , et al. July 30, 2 | 2019-07-30 |
Integrated Circuit Package Substrate
App 20190164881 - MANUSHAROW; Mathew J. ; et al. | 2019-05-30 |
Integrated circuit package substrate
Grant 10,242,942 - Manusharow , et al. | 2019-03-26 |
Multi-surface solar cell packaging for self-powered electronic devices
Grant 10,193,493 - Heppner , et al. Ja | 2019-01-29 |
Localized High Density Substrate Routing
App 20180350737 - Starkston; Robert ; et al. | 2018-12-06 |
3D integrated circuit package with through-mold first level interconnects
Grant 10,090,277 - Mallik , et al. October 2, 2 | 2018-10-02 |
Through-mold Structures
App 20180277458 - Oster; Sasha ; et al. | 2018-09-27 |
Integrated acoustic phase array
Grant 10,074,357 - Manipatruni , et al. September 11, 2 | 2018-09-11 |
Low Cost Package Warpage Solution
App 20180190510 - Karhade; Omkar G. ; et al. | 2018-07-05 |
Multi-surface Solar Cell Packaging For Self-powered Electronic Devices
App 20180083569 - HEPPNER; Joshua ; et al. | 2018-03-22 |
Low cost package warpage solution
Grant 9,899,238 - Karhade , et al. February 20, 2 | 2018-02-20 |
Embedded memory and power management subpackage
Grant 9,871,026 - Guzek , et al. January 16, 2 | 2018-01-16 |
Localized High Density Substrate Routing
App 20170287831 - Starkston; Robert ; et al. | 2017-10-05 |
Methods to form high density through-mold interconnections
Grant 9,741,692 - Karhade , et al. August 22, 2 | 2017-08-22 |
Integrated circuit package structures
Grant 9,721,880 - Yao , et al. August 1, 2 | 2017-08-01 |
Reduced PTH pad for enabling core routing and substrate layer count reduction
Grant 9,711,441 - Mallik , et al. July 18, 2 | 2017-07-18 |
Pad-less interconnect for electrical coreless substrate
Grant 9,691,727 - Soto Gonzalez , et al. June 27, 2 | 2017-06-27 |
Through-mold Structures
App 20170178990 - Oster; Sasha ; et al. | 2017-06-22 |
Integrated Circuit Package Structures
App 20170170105 - Yao; Jimin ; et al. | 2017-06-15 |
Localized high density substrate routing
Grant 9,679,843 - Starkston , et al. June 13, 2 | 2017-06-13 |
Integrated Circuit Package Substrate
App 20170154842 - MANUSHAROW; Mathew J. ; et al. | 2017-06-01 |
Photonic Package Architecture
App 20170108655 - ZARBOCK; Edward A. ; et al. | 2017-04-20 |
3d Integrated Circuit Package With Through-mold First Level Interconnects
App 20170103970 - Mallik; Debendra ; et al. | 2017-04-13 |
Photonic package architecture
Grant 9,570,883 - Zarbock , et al. February 14, 2 | 2017-02-14 |
3D integrated circuit package with through-mold first level interconnects
Grant 9,530,758 - Mallik , et al. December 27, 2 | 2016-12-27 |
Flexible computing fabric
Grant 9,526,285 - Aleksov , et al. December 27, 2 | 2016-12-27 |
Suspended inductor microelectronic structures
Grant 9,526,175 - Manusharow , et al. December 20, 2 | 2016-12-20 |
Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package
Grant 9,478,476 - Mallik , et al. October 25, 2 | 2016-10-25 |
Methods To Form High Density Through-mold Interconnections
App 20160268231 - Karhade; Omkar G. ; et al. | 2016-09-15 |
3D integrated circuit package with window interposer
Grant 9,391,013 - Mallik , et al. July 12, 2 | 2016-07-12 |
Localized High Density Substrate Routing
App 20160197037 - Starkston; Robert ; et al. | 2016-07-07 |
Embedded Memory And Power Management Subpackage
App 20160197065 - Guzek; John S. ; et al. | 2016-07-07 |
Low Cost Package Warpage Solution
App 20160181218 - Karhade; Omkar G. ; et al. | 2016-06-23 |
Reduced Pth Pad For Enabling Core Routing And Substrate Layer Count Reduction
App 20160155694 - Mallik; Debendra ; et al. | 2016-06-02 |
Method and apparatus for managing and accessing personal data
Grant 9,355,242 - Manipatruni , et al. May 31, 2 | 2016-05-31 |
Silicon Space Transformer For Ic Packaging
App 20160133589 - Mallik; Debendra ; et al. | 2016-05-12 |
Embedded memory and power management subpackage
Grant 9,287,248 - Guzek , et al. March 15, 2 | 2016-03-15 |
Localized high density substrate routing
Grant 9,269,701 - Starkston , et al. February 23, 2 | 2016-02-23 |
Integrated Acoustic Phase Array
App 20160027429 - Manipatruni; Sasikanth ; et al. | 2016-01-28 |
Reduced PTH pad for enabling core routing and substrate layer count reduction
Grant 9,210,809 - Mallik , et al. December 8, 2 | 2015-12-08 |
Localized High Density Substrate Routing
App 20150340353 - Starkston; Robert ; et al. | 2015-11-26 |
3d Integrated Circuit Package With Window Interposer
App 20150332994 - MALLIK; Debendra ; et al. | 2015-11-19 |
Integrated accoustic phase array
Grant 9,183,829 - Manipatruni , et al. November 10, 2 | 2015-11-10 |
3d Integrated Circuit Package With Through-mold First Level Interconnects
App 20150294958 - Mallik; Debendra ; et al. | 2015-10-15 |
Localized high density substrate routing
Grant 9,136,236 - Starkston , et al. September 15, 2 | 2015-09-15 |
Die-to-die Bonding And Associated Package Configurations
App 20150255411 - Karhade; Omkar G. ; et al. | 2015-09-10 |
3D integrated circuit package with window interposer
Grant 9,129,958 - Mallik , et al. September 8, 2 | 2015-09-08 |
Processes Of Making Pad-less Interconnect For Electrical Coreless Substrate
App 20150221608 - SOTO GONZALEZ; Javier ; et al. | 2015-08-06 |
3D integrated circuit package with through-mold first level interconnects
Grant 9,099,444 - Mallik , et al. August 4, 2 | 2015-08-04 |
Embedded Memory And Power Management Subpackage
App 20150171065 - Guzek; John S. ; et al. | 2015-06-18 |
Processes of making pad-less interconnect for electrical coreless substrate
Grant 9,049,807 - Soto , et al. June 2, 2 | 2015-06-02 |
Silicon Space Transformer For Ic Packaging
App 20150001732 - Mallik; Debendra ; et al. | 2015-01-01 |
Direct external interconnect for embedded interconnect bridge package
Grant 8,901,748 - Manusharow , et al. December 2, 2 | 2014-12-02 |
Direct External Interconnect For Embedded Interconnect Bridge Package
App 20140264791 - MANUSHAROW; MATHEW J. ; et al. | 2014-09-18 |
Suspended Inductor Microelectronic Structures
App 20140251669 - Manusharow; Mathew J. ; et al. | 2014-09-11 |
3d Integrated Circuit Package With Through-mold First Level Interconnects
App 20140217585 - Mallik; Debendra ; et al. | 2014-08-07 |
Magnetic Contacts For Electronics Applications
App 20140205851 - MAHAJAN; Ravindranath V. ; et al. | 2014-07-24 |
3d Integrated Circuit Package With Window Interposer
App 20140191419 - Mallik; Debendra ; et al. | 2014-07-10 |
Integrated Accoustic Phase Array
App 20140176367 - Manipatruni; Sasikanth ; et al. | 2014-06-26 |
Method And Apparatus For Managing And Accessing Personal Data
App 20140173716 - Manipatruni; Sasikanth ; et al. | 2014-06-19 |
Flexible Computing Fabric
App 20140165269 - ALEKSOV; ALEKSANDAR ; et al. | 2014-06-19 |
Reduced Pth Pad For Enabling Core Routing And Substrate Layer Count Reduction
App 20140098506 - Mallik; Debendra ; et al. | 2014-04-10 |
Localized High Density Substrate Routing
App 20140091474 - Starkston; Robert ; et al. | 2014-04-03 |
Photonic Package Architecture
App 20140029639 - Zarbock; Edward A. ; et al. | 2014-01-30 |
Reduced PTH pad for enabling core routing and substrate layer count reduction
Grant 8,617,990 - Mallik , et al. December 31, 2 | 2013-12-31 |
Reduced PTH pad for enabling core routing and substrate layer count reduction
Grant 08617990 - | 2013-12-31 |
Package For A Microelectronic Die, Microelectronic Assembly Containing Same, Microelectronic System, And Method Of Reducing Die Stress In A Microelectronic Package
App 20130270691 - Mallik; Debendra ; et al. | 2013-10-17 |
Multiple Socket Concept
App 20130005162 - MALLIK; Debendra ; et al. | 2013-01-03 |
Reduced Pth Pad For Enabling Core Routing And Substrate Layer Count Reduction
App 20120153495 - Mallik; Debendra ; et al. | 2012-06-21 |
Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
Grant 7,932,596 - Mallik , et al. April 26, 2 | 2011-04-26 |
Methods and apparatuses for providing stacked-die devices
Grant 7,867,818 - Suh , et al. January 11, 2 | 2011-01-11 |
Land grid array (LGA) socket for various package sizes
Grant 7,794,236 - Mallik , et al. September 14, 2 | 2010-09-14 |
Land Grid Array (LGA) Socket for Various Package Sizes
App 20100151706 - Mallik; Debendra ; et al. | 2010-06-17 |
C4 joint reliability
Grant 7,656,035 - Agraharam , et al. February 2, 2 | 2010-02-02 |
Direct layer laser lamination for electrical bump substrates, and processes of making same
App 20090314519 - Soto; Javier ; et al. | 2009-12-24 |
C4 Joint Reliability
App 20090115057 - Agraharam; Sairam ; et al. | 2009-05-07 |
C4 joint reliability
Grant 7,517,787 - Agraharam , et al. April 14, 2 | 2009-04-14 |
Thermally Enhanced Electronic Flip-chip Packaging With External-connector-side Die And Method
App 20090079061 - Mallik; Debendra ; et al. | 2009-03-26 |
Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
Grant 7,456,047 - Mallik , et al. November 25, 2 | 2008-11-25 |
Stackable integrated circuit packaging
Grant 7,345,361 - Mallik , et al. March 18, 2 | 2008-03-18 |
Selective plating of package terminals
Grant 7,321,172 - Wood , et al. January 22, 2 | 2008-01-22 |
Thermally Enhanced Electronic Flip-chip Packaging With External-connector-side Die And Method
App 20070279873 - Mallik; Debendra ; et al. | 2007-12-06 |
Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
Grant 7,268,425 - Mallik , et al. September 11, 2 | 2007-09-11 |
Configurable microelectronic package using electrically conductive material
Grant 7,199,304 - Wienrich , et al. April 3, 2 | 2007-04-03 |
Selective plating of package terminals
Grant 7,186,645 - Wood , et al. March 6, 2 | 2007-03-06 |
Methods and apparatuses for providing stacked-die devices
Grant 7,187,068 - Suh , et al. March 6, 2 | 2007-03-06 |
C4 joint reliability
App 20060214292 - Agraharam; Sairam ; et al. | 2006-09-28 |
Methods and apparatuses for providing stacked-die devices
App 20060035409 - Suh; Daewoong ; et al. | 2006-02-16 |
Methods and apparatuses for providing stacked-die devices
App 20060033193 - Suh; Daewoong ; et al. | 2006-02-16 |
Metal ball attachment of heat dissipation devices
Grant 6,992,891 - Mallik , et al. January 31, 2 | 2006-01-31 |
Selective plating of package terminals
App 20060006535 - Wood; Dustin P. ; et al. | 2006-01-12 |
Semiconductor chip package and method of manufacturing same
Grant 6,975,025 - LeBonheur , et al. December 13, 2 | 2005-12-13 |
Microelectronic device signal transmission by way of a lid
App 20050127489 - Mallik, Debendra ; et al. | 2005-06-16 |
Stackable integrated circuit packaging
App 20050121764 - Mallik, Debendra ; et al. | 2005-06-09 |
Selective plating of package terminals
App 20050112880 - Wood, Dustin P. ; et al. | 2005-05-26 |
Molded substrate stiffener with embedded capacitors
Grant 6,821,823 - Xie , et al. November 23, 2 | 2004-11-23 |
Metal ball attachment of heat dissipation devices
App 20040196634 - Mallik, Debendra ; et al. | 2004-10-07 |
Thermally enhanced electronic flip-chip packaging with external-connector side die and method
App 20040173901 - Mallik, Debendra ; et al. | 2004-09-09 |
Molded substrate stiffener with embedded capacitors
App 20040135240 - Xie, Hong ; et al. | 2004-07-15 |
Molded substrate stiffener with embedded capacitors
Grant 6,710,444 - Xie , et al. March 23, 2 | 2004-03-23 |
Configurable microelectronic package using electrically conductive material
App 20040040741 - Wienrich, Jeff R. ; et al. | 2004-03-04 |
Molded substrate stiffener with embedded capacitors
App 20030178722 - Xie, Hong ; et al. | 2003-09-25 |
Semiconductor chip package and method of manufacturing same
App 20030104652 - LeBonheur, Vassoudevane ; et al. | 2003-06-05 |
Integrated circuit package with a capacitor
App 20020135053 - Figueroa, Dave G. ; et al. | 2002-09-26 |
Advance multilayer molded plastic package using mesic technology
Grant 5,556,807 - Bhattacharyya , et al. September 17, 1 | 1996-09-17 |
Structure of a thermally and electrically enhanced plastic ball grid array package
Grant 5,557,502 - Banerjee , et al. September 17, 1 | 1996-09-17 |
Method of controlling solder ball size of BGA IC components
Grant 5,519,580 - Natarajan , et al. May 21, 1 | 1996-05-21 |
Multilayer molded plastic package using mesic technology
Grant 5,488,257 - Bhattacharyya , et al. January 30, 1 | 1996-01-30 |
Integrated circuit having a two-dimensional lead grid array
Grant 5,420,461 - Mallik , et al. May 30, 1 | 1995-05-30 |
De-coupling capacitor on the top of the silicon die by eutectic flip bonding
Grant 5,369,545 - Bhattacharyya , et al. November 29, 1 | 1994-11-29 |
Lead grid array integrated circuit
Grant 5,210,939 - Mallik , et al. May 18, 1 | 1993-05-18 |
Multi-layer molded plastic IC package
Grant 4,891,687 - Mallik , et al. January 2, 1 | 1990-01-02 |
Method of making a multilayer molded plastic IC package
Grant 4,835,120 - Mallik , et al. May 30, 1 | 1989-05-30 |
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