| Patent | Date |
|---|
Semiconductor structure with thin film resistor and terminal bond pad
Grant 9,287,345 - Chen , et al. March 15, 2 | 2016-03-15 |
Self-healing crack stop structure
Grant 9,230,921 - Ayotte , et al. January 5, 2 | 2016-01-05 |
Self-healing Crack Stop Structure
App 20150097271 - Ayotte; Stephen P. ; et al. | 2015-04-09 |
Discontinuous guard ring
Grant 8,729,664 - Gambino , et al. May 20, 2 | 2014-05-20 |
Method For Forming Thin Film Resistor And Terminal Bond Pad Simultaneously
App 20140001599 - CHEN; Fen ; et al. | 2014-01-02 |
Method for forming thin film resistor and terminal bond pad simultaneously
Grant 8,563,336 - Chen , et al. October 22, 2 | 2013-10-22 |
Methods for reading a feature pattern from a packaged die
Grant 8,565,510 - Cohn , et al. October 22, 2 | 2013-10-22 |
Discontinuous Guard Ring
App 20130256826 - Gambino; Jeffrey P. ; et al. | 2013-10-03 |
Product chips and die with a feature pattern that contains information relating to the product chip
Grant 8,299,609 - Cohn , et al. October 30, 2 | 2012-10-30 |
Fabricating product chips and die with a feature pattern that contains information relating to the product chip
Grant 8,187,897 - Cohn , et al. May 29, 2 | 2012-05-29 |
Product Chips And Die With A Feature Pattern That Contains Information Relating To The Product Chip
App 20120119333 - Cohn; John M. ; et al. | 2012-05-17 |
Methods For Reading A Feature Pattern From A Packaged Die
App 20120120758 - Cohn; John M. ; et al. | 2012-05-17 |
Method for Forming Thin Film Resistor and Terminal Bond Pad Simultaneously
App 20100155893 - CHEN; Fen ; et al. | 2010-06-24 |
Product Chips and Die With a Feature Pattern That Contains Information Relating to the Product Chip, Methods for Fabricating Such Product Chips and Die, and Methods for Reading a Feature Pattern From a Packaged Die
App 20100044858 - Cohn; John M. ; et al. | 2010-02-25 |
Dual chip stack method for electro-static discharge protection of integrated circuits
Grant 7,067,914 - Malinowski , et al. June 27, 2 | 2006-06-27 |
Multi-level RF passive device
Grant 7,053,460 - Volant , et al. May 30, 2 | 2006-05-30 |
Method of polishing C4 molybdenum masks to remove molybdenum peaks
Grant 7,025,891 - Codding , et al. April 11, 2 | 2006-04-11 |
Method Of Polishing C4 Molybdenum Masks To Remove Molybdenum Peaks
App 20050045591 - Codding, Steven R. ; et al. | 2005-03-03 |
Selective nitride: oxide anisotropic etch process
Grant 6,656,375 - Armacost , et al. December 2, 2 | 2003-12-02 |
Process for implanting a deep subcollector with self-aligned photo registration marks
Grant 6,656,815 - Coolbaugh , et al. December 2, 2 | 2003-12-02 |
Multi-level RF passive device
App 20030116850 - Volant, Richard P. ; et al. | 2003-06-26 |
Dual chip stack method for electro-static discharge protection of integrated circuits
App 20030089979 - Malinowski, John C. ; et al. | 2003-05-15 |
Multiple material stacks with a stress relief layer between a metal structure and a passivation layer
App 20020163062 - Wang, Ping-Chuan ; et al. | 2002-11-07 |
Process for implanting a deep subcollector with self-aligned photo registration marks
App 20020146889 - Coolbaugh, Douglas D. ; et al. | 2002-10-10 |
Process for fabricating multiple pillars inside a dram trench for increased capacitor surface
Grant 5,204,280 - Dhong , et al. April 20, 1 | 1993-04-20 |
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