Malik; Igor J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Malik; Igor J..The latest application filed is for "method and system for fabricating strained layers for the manufacture of integrated circuits".

Company Profile

0.16.11

Malik; Igor J. - Palo Alto CA
Malik; Igor J. - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Non-contact etch annealing of strained layers Grant 8,187,377 - Malik , et al. May 29, 2	2012-05-29
Method and system for fabricating strained layers for the manufacture of integrated circuits Grant 7,595,499 - Henley , et al. September 29, 2	2009-09-29
Method and system for lattice space engineering Grant 7,390,724 - Henley , et al. June 24, 2	2008-06-24
System for forming a strained layer of semiconductor material Grant 7,391,047 - Henley , et al. June 24, 2	2008-06-24
Method and system for fabricating strained layers for the manufacture of integrated circuits App 20080141510 - Henley; Francois J. ; et al.	2008-06-19
Surface finishing of SOI substrates using an EPI process App 20070259526 - Kang; Sien G. ; et al.	2007-11-08
Surface finishing of SOI substrates using an EPI process Grant 7,253,081 - Kang , et al. August 7, 2	2007-08-07
Method and system for fabricating strained layers for the manufacture of integrated circuits Grant 7,094,666 - Henley , et al. August 22, 2	2006-08-22
Method and system for fabricating strained layers for the manufacture of integrated circuits App 20060160329 - Henley; Francois J. ; et al.	2006-07-20
Method and system for fabricating strained layers for the manufacture of integrated circuits App 20060024917 - Henley; Francois J. ; et al.	2006-02-02
Treatment method of film quality for the manufacture of substrates Grant 6,969,668 - Kang , et al. November 29, 2	2005-11-29
Method for smoothing a film of material using a ring structure App 20050247668 - Malik, Igor J. ; et al.	2005-11-10
Method and system for lattice space engineering App 20050233545 - Henley, Francois J. ; et al.	2005-10-20
Smoothing method for cleaved films made using a release layer Grant 6,881,644 - Malik , et al. April 19, 2	2005-04-19
Non-contact etch annealing of strained layers App 20040067644 - Malik, Igor J. ; et al.	2004-04-08
Smoothing method for cleaved films made using a release layer App 20030008477 - Kang, Sien G. ; et al.	2003-01-09
Computer memory product for substrate surface treatment applications App 20020173872 - Malik, Igor J.	2002-11-21
Smoothing method for cleaved films made using thermal treatment Grant 6,455,399 - Malik , et al. September 24, 2	2002-09-24
Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer Grant 6,448,152 - Henley , et al. September 10, 2	2002-09-10
Surface finishing of SOI substrates using an EPI process App 20020022344 - Kang, Sien G. ; et al.	2002-02-21
Surface finishing of SOI substrates using an EPI process Grant 6,287,941 - Kang , et al. September 11, 2	2001-09-11
Smoothing method for cleaved films made using thermal treatment App 20010016402 - Malik, Igor J. ; et al.	2001-08-23
Method to remove metals in a scrubber Grant 6,274,059 - Krusell , et al. August 14, 2	2001-08-14
Wafer edge engineering method and device Grant 6,265,328 - Henley , et al. July 24, 2	2001-07-24
Method for surface treatment of substrates Grant 6,221,774 - Malik April 24, 2	2001-04-24
Smoothing method for cleaved films made using thermal treatment Grant 6,204,151 - Malik , et al. March 20, 2	2001-03-20
Treatment method of cleaved film for the manufacture of substrates Grant 6,171,965 - Kang , et al. January 9, 2	2001-01-09

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