loadpatents
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name:-0.0038998126983643
name:-0.00037693977355957
Makino; Takuma Patent Filings

Makino; Takuma

Patent Applications and Registrations

Patent applications and USPTO patent grants for Makino; Takuma.The latest application filed is for "laminated radiation member, power semiconductor apparatus, and method for producing the same".

Company Profile
0.5.5
  • Makino; Takuma - Kasugai JP
  • Makino, Takuma - Kasugai-city JP
  • Makino; Takuma - Nagoya JP
  • Makino, Takuma - Nagoya-city JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of measuring thermal conductivity of honeycomb structure
Grant 7,682,072 - Ichikawa , et al. March 23, 2
2010-03-23
Laminated radiation member, power semiconductor apparatus, and method for producing the same
Grant 7,170,186 - Araki , et al. January 30, 2
2007-01-30
Laminated radiation member, power semiconductor apparatus, and method for producing the same
App 20050263877 - Araki, Kiyoshi ;   et al.
2005-12-01
Method of measuring thermal conductivity of honeycomb structure
App 20050105584 - Ichikawa, Shuichi ;   et al.
2005-05-19
Adhesive composition for bonding different kinds of members
Grant 6,742,700 - Makino , et al. June 1, 2
2004-06-01
Laminated radiation member, power semiconductor apparatus, and method for producing the same
App 20030030141 - Araki, Kiyoshi ;   et al.
2003-02-13
Laminated radiation member, power semiconductor apparatus, and method for producing the same
Grant 6,485,816 - Araki , et al. November 26, 2
2002-11-26
Adhesive composition for bonding different kinds of members
App 20020092896 - Makino, Takuma ;   et al.
2002-07-18
Adhesive composition for bonding different kinds of members
Grant 6,390,354 - Makino , et al. May 21, 2
2002-05-21
Laminated radiation member, power semiconductor apparatus, and method for producing the same
App 20010031345 - Araki, Kiyoshi ;   et al.
2001-10-18

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